Diodes Incorporated DL4004-13-F

Overview

DL4004-13-F from Diodes Incorporated is a glass passivated surface-mount MELF rectifier diode rated for 400 V peak repetitive reverse voltage (VRRM), 1.0 A average forward rectified current (IO) at 75°C terminal temperature, and 1.1 V maximum forward voltage (VF) at 1.0 A. It delivers high reliability with low leakage (5.0 µA at 25°C) and low thermal resistance (50 K/W junction-to-ambient), suited for AC/DC input stage rectification in compact power supplies.

For engineers reviewing the DL4004-13-F datasheet, DL4004-13-F pinout, DL4004-13-F application, or DL4004-13-F equivalent, key selection factors include its 400 V blocking rating, MELF package thermal performance, 30 A non-repetitive surge capability, and compatibility with automated SMT assembly under UL 94V-0 flammability compliance.

Technical Context

This device operates as a single-phase, half-wave silicon rectifier optimized for surface-mount use in offline power conversion. Its glass passivation ensures stable junction characteristics across -55°C to +150°C operating range, while the MELF (Metal Electrode Leadless Face) cylindrical package enables uniform heat dissipation and high-power density mounting.

Electrical behavior follows standard PN junction rectifier characteristics: forward conduction begins near 0.8 V, with VF rising to 1.1 V at rated 1.0 A DC; reverse leakage remains ≤5 µA up to 100°C, and junction capacitance measures 15 pF at 4 V reverse bias-critical for EMI filtering and snubber design in flyback and buck-derived topologies.

Key Specifications

Pinout & Package

DL4004-13-F uses a two-terminal MELF (DO-213AB) glass-passivated cylindrical package with cathode band marking. No discrete pins-terminals are axial solder pads on opposite ends of the cylinder.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage rectifier applications.

Compared with 1N4004G and ES1D, DL4004-13-F offers optimal balance of SMT compatibility, thermal performance, and low forward loss for 50/60 Hz and low-kHz rectification-making it preferred for space-constrained, thermally managed AC/DC front-ends where fast recovery is unnecessary.

Availability

DL4004-13-F is available at Aetrix Electronics and suitable for AC-DC adapters, industrial switch-mode power supplies, and LED driver input stages requiring stable component supply, consistent MELF packaging, and UL 94V-0 compliance.

Supply support for DL4004-13-F includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management and signal integrity solutions for consumer, industrial, and automotive markets.

DL4004-13-F belongs to the DL400x family of glass-passivated MELF rectifiers designed specifically for reliable, high-density surface-mount rectification in cost-sensitive yet thermally demanding power conversion applications.

FAQ

What is the maximum allowable junction temperature for DL4004-13-F?

The absolute maximum junction temperature is +150°C, with continuous operation supported from -55°C to +150°C. Derating begins above 75°C terminal temperature-full 1.0 A current rating applies only when the solder joint (TT) is maintained at or below 75°C via adequate PCB copper area.

Can DL4004-13-F be used in full-wave bridge configurations?

Yes-DL4004-13-F is a single diode and may be used in discrete full-wave bridge assemblies. Four units can form a compact SMT bridge, though dedicated bridge packages (e.g., GBPC series) offer lower profile and better thermal coupling for higher current designs.

Is DL4004-13-F RoHS compliant and lead-free?

Yes-DL4004-13-F is RoHS compliant and features lead-free terminations compatible with standard SnAgCu reflow profiles. The "-13-F" suffix explicitly denotes lead-free, halogen-free, and RoHS-compliant construction per Diodes Incorporated's product coding standard.

How does the MELF package affect PCB layout and thermal design?

The MELF package requires axial pad placement with ≥2.6 mm center-to-center spacing. For full 1.0 A rating, each terminal pad must connect to ≥25 mm² of 1 oz copper; thermal vias under pads significantly improve heat transfer to inner layers or ground planes.