My Inquiry
My Account
Diodes Incorporated DLLFSD01LP3-7
- Part No.:
- DLLFSD01LP3-7
- Manufacturer:
- Diodes Incorporated
- Category:
- Single Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
DLLFSD01LP3-7.pdf
- Description:
- DIODE GP 80V 100MA X3-DFN0603-2
- Quantity:
- Payment:
- Shipping:
Inventory:24,170
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DLLFSD01LP3-7 from Diodes Incorporated is an ultra-low leakage, fast-switching surface-mount Schottky diode in a 0.6 × 0.3 mm DFN package, rated for 80 V peak reverse voltage, 300 mA forward current, and exhibiting only 5 nA reverse leakage at 5 V. It delivers 4.0 ns reverse recovery time and <1 pF junction capacitance, enabling use in high-frequency signal clamping and low-power sensor interface circuits.
For engineers reviewing the DLLFSD01LP3-7 datasheet, DLLFSD01LP3-7 pinout, DLLFSD01LP3-7 application, or DLLFSD01LP3-7 equivalent, key selection criteria include ultra-low IR (5 nA @ VR = 5 V), sub-1 pF CT at 0 V, 0.62–0.94 V VF across 1–100 mA, thermal resistance of 500 °C/W, and compatibility with space-constrained 0.6 × 0.3 mm PCB footprints.
Technical Context
This diode employs a planar Schottky barrier structure optimized for minimal charge storage and rapid carrier extraction, enabling its 4.0 ns trr under IF = 10 mA / VR = 6 V conditions. Its ultra-low leakage stems from tight process control of the metal-semiconductor interface and low-defect epitaxial layer.
The X3-DFN0603-2 package uses a copper leadframe with matte tin plating and green molding compound (UL 94V-0), supporting reflow soldering per MIL-STD-202 and achieving moisture sensitivity level 1. Thermal performance is defined on FR-4 with manufacturer-recommended pad layout.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRM / VRRM | 85 V / 80 V - supports transient suppression up to 85 V non-repetitive, safe DC blocking to 80 V |
| IFM | 300 mA - enables continuous operation in low-current power routing or bias networks |
| IR @ VR = 5 V | 5 nA - ensures negligible standby current draw in battery-powered sensor nodes |
| CT @ VR = 0 V | 0.5–2.5 pF - maintains signal integrity in RF detector and high-speed logic clamp applications |
| trr | 4.0 ns - allows reliable operation in >100 MHz switching waveforms without tail current |
| RθJA | 500 °C/W - requires careful thermal pad design on FR-4 for sustained >100 mW dissipation |
Pinout & Package
Package: X3-DFN0603-2 - ultra-compact 0.6 mm × 0.3 mm × 0.3 mm leadless DFN with exposed cathode-side marking bar and matte tin-plated copper terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry point | Connected to lower-potential node in rectification or clamping path |
| Cathode (bar-marked side) | Forward current exit / reverse blocking terminal | Marked side must align with PCB cathode trace; serves as primary heat-sinking surface |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low leakage | 5 nA @ VR = 5 V - extends battery life in always-on IoT sensors by minimizing quiescent drain |
| Sub-1 pF capacitance | 0.5–2.5 pF @ 0 V - preserves edge fidelity in 100+ MHz clock/data line clamping |
| 4.0 ns reverse recovery | Measured at IF = 10 mA, VR = 6 V - eliminates switching-induced glitches in high-speed comparators |
| 0.62–0.94 V forward drop | Across 1–100 mA - reduces conduction loss in low-voltage (<3.3 V) power rail OR-ing |
Applications
| Wireless Sensor Node Power Management | High-Frequency Signal Clamping |
|---|---|
Use Scenario: Battery-powered environmental sensor with wake-on-event circuitry requiring microamp-level standby current. IC Role / Device Role / Timing Role: Reverse polarity protection and leakage-sensitive voltage rail isolation diode. Use Value: 5 nA IR at 5 V prevents >1 µA parasitic discharge, extending 10-year battery life target by >18 months. | Use Scenario: 2.4 GHz ISM-band RF receiver front-end protecting LNA input from ESD transients. IC Role / Device Role / Timing Role: Fast clamping diode shunting ESD pulses before they reach sensitive gate oxide. Use Value: 4.0 ns trr and <1 pF CT ensure clamping action completes within first 10% of 1 ns ESD rise time, preserving signal integrity. |
| Low-Voltage Logic Level Translation | Portable Medical Diagnostic Interface |
Use Scenario: Bidirectional I²C level shifter between 1.8 V MCU and 3.3 V peripheral, where forward drop impacts high-level margin. IC Role / Device Role / Timing Role: Passive bidirectional clamping diode in standard level-shifting topology. Use Value: 0.62 V VF at 1 mA maintains >1.1 V logic-high margin at 1.8 V domain, avoiding false low detection. | Use Scenario: ECG electrode bias network requiring ultra-low leakage to prevent DC offset drift during multi-hour acquisition. IC Role / Device Role / Timing Role: Leakage-critical blocking diode in high-impedance analog front-end bias path. Use Value: 5 nA IR contributes <1 µV offset error across 200 kΩ bias resistor, meeting clinical-grade baseline stability specs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low leakage fast-switching diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| BAT54C-7-F | Higher IR (100 nA @ 5 V), larger SOT-23 package (3.0 × 1.4 mm), VF = 0.33 V @ 10 mA | Less suitable for nanoamp standby circuits; better for higher-current clamping | Select when lower VF outweighs leakage and size constraints |
| NSR0230HT1G | Lower VR (30 V), smaller 0.6 × 0.3 mm footprint, IR = 100 nA @ 5 V, VF = 0.32 V @ 10 mA | Not viable for 80 V blocking; preferred where ultra-small size dominates over leakage | Choose only if system VR < 30 V and leakage >10 nA is acceptable |
Compared with BAT54C-7-F and NSR0230HT1G, DLLFSD01LP3-7 uniquely balances 80 V blocking, 5 nA leakage, and 0.6 × 0.3 mm size-making it irreplaceable in space- and leakage-constrained 5–12 V portable medical or industrial sensor designs.
Availability
DLLFSD01LP3-7 is available at Aetrix Electronics and suitable for wireless sensor node power management, high-frequency signal clamping, low-voltage logic level translation, and portable medical diagnostic interface applications requiring stable component supply and long-term lifecycle assurance.
Supply support for DLLFSD01LP3-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-efficiency power management, signal integrity, and protection solutions for consumer, industrial, and automotive markets.
The DLLFSD01LP3-7 belongs to Diodes' ultra-low-leakage fast-switching diode product line, engineered specifically for miniaturized, battery-sensitive applications demanding nanoscale leakage and sub-nanosecond switching in sub-millimeter packages.
FAQ
What is the maximum operating temperature for DLLFSD01LP3-7?
The DLLFSD01LP3-7 has an operating junction temperature range of –65 °C to +150 °C. Its thermal resistance (RθJA = 500 °C/W) means that at 100 mW power dissipation on FR-4 with recommended pads, junction temperature rises ~50 °C above ambient-keeping it well within limits at ≤100 °C ambient.
Is DLLFSD01LP3-7 suitable for automotive applications?
DLLFSD01LP3-7 is not AEC-Q200 qualified and lacks automotive-specific reliability testing or extended temperature screening. While its –65 °C to +150 °C rating covers most under-hood environments, Diodes Incorporated does not endorse it for safety-critical or mission-critical automotive systems without additional qualification by the end customer.
How is cathode identification implemented on the X3-DFN0603-2 package?
The cathode is identified by a laser-marked bar on the top surface of the X3-DFN0603-2 package, aligned with one short edge. The bottom-side copper paddle is electrically connected to the cathode, and the PCB footprint must assign the marked-side pad to the cathode net per Diodes' AP02001 recommended layout.
Does DLLFSD01LP3-7 support lead-free reflow soldering?
Yes-DLLFSD01LP3-7 uses matte tin plating over copper leadframe and is fully RoHS-compliant. It meets MIL-STD-202 Method 208 for solderability and is rated for standard Pb-free reflow profiles (peak 260 °C, 10 sec max), with moisture sensitivity level 1 per J-STD-020.
DLLFSD01LP3-7 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Diodes Incorporated
- Series:
- -
- Package/Case:
- 0201 (0603 Metric)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 80 V
- Current - Average Rectified (Io):
- 100mA
- Voltage - Forward (Vf) (Max) @ If:
- 1.2 V @ 100 mA
- Speed:
- Small Signal =< 200mA (Io), Any Speed
- Reverse Recovery Time (trr):
- 4 ns
- Current - Reverse Leakage @ Vr:
- 200 nA @ 80 V
- Capacitance @ Vr, F:
- 2.5pF @ 0V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- X3-DFN0603-2
- Operating Temperature - Junction:
- -65°C ~ 150°C
DLLFSD01LP3-7 FAQ
1.How can I place an order for DLLFSD01LP3-7 through Aetrix?
Please submit a Request for Quotation (RFQ) for DLLFSD01LP3-7 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DLLFSD01LP3-7 reliable?
The price and inventory of DLLFSD01LP3-7 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DLLFSD01LP3-7 is usually 5 days.
3.What payment methods are accepted for DLLFSD01LP3-7?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DLLFSD01LP3-7 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DLLFSD01LP3-7?
DLLFSD01LP3-7 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DLLFSD01LP3-7 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DLLFSD01LP3-7?
For technical support, including DLLFSD01LP3-7 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DLLFSD01LP3-7 requirements.
6.How does Aetrix verify that DLLFSD01LP3-7 is sourced from the original manufacturer or authorized distributors?
All DLLFSD01LP3-7 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DLLFSD01LP3-7 meets industry standards.
7.What is the process for return or replacement of DLLFSD01LP3-7?
All DLLFSD01LP3-7 units undergo pre-shipment inspection (PSI). If there is an issue with DLLFSD01LP3-7, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DLLFSD01LP3-7 part is unused and in its original packaging.
Return procedure for DLLFSD01LP3-7:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DLLFSD01LP3-7 Tags
-
1N4448X-TP
Micro Commercial Co
-
1N4148WX-TP
Micro Commercial Co
-
1N4148TR
onsemi
-
MMSD4148T1G
onsemi
-
MMBD914LT3G
onsemi
-
BAS16HT1G
onsemi
-
1N914BWT
onsemi
-
BAS21LT1G
onsemi
-
LL4148
onsemi
-
BAS16LT1G
onsemi
-
MMSD914T1G
onsemi
-
BAV21W-7-F
Diodes Incorporated
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
