My Inquiry
My Account
Texas Instruments DRV8300DRGER
- Part No.:
- DRV8300DRGER
- Manufacturer:
- Texas Instruments
- Category:
- Gate Drivers
- Package:
- 24-VFQFN Exposed Pad
- Datasheet:
-
DRV8300DRGER.pdf
- Description:
- IC GATE DRVR HI/LOW SIDE 24VFQFN
- Quantity:
- Payment:
- Shipping:
Inventory:15,671
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DRV8300DRGER from Texas Instruments is a 100-V three-phase half-bridge gate driver IC for N-channel MOSFETs, featuring 750-mA source / 1.5-A sink peak gate drive current, adjustable deadtime via DT pin, and integrated cross-conduction prevention. It supports up to 15S battery systems and drives BLDC/PMSM motors in e-mobility and power tools.
For engineers reviewing the DRV8300DRGER datasheet, DRV8300DRGER pinout, DRV8300DRGER application, or DRV8300DRGER equivalent, this page delivers verified package mapping (24-pin VQFN, 4.0 × 4.0 mm), confirmed bootstrap architecture with external diode requirement, real propagation delay matching (±4 ns), absolute maximum SHx rating (–22 V transient), and validated alternative options for motor control system design.
Technical Context
The DRV8300DRGER implements a bootstrap-based high-side gate drive architecture requiring external bootstrap diodes and capacitors-distinct from the integrated-diode DRV8300D variants. Its DT pin enables linear deadtime adjustment (200–2000 ns) via resistor-to-GND, while MODE pin selects INLx inversion polarity for flexible MCU interface alignment.
Each of its three independent half-bridges tolerates –22-V negative transients on SHx pins and supports 125-V absolute max BSTx voltage, enabling robust operation in high-dV/dt motor phases. Propagation delay matching (±4 ns per phase) minimizes required deadtime, directly improving inverter efficiency in 200-kHz PWM applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Max PVDD / SHx voltage | 100 V continuous, –22 V transient - enables direct use with 15S Li-ion battery stacks (57.6 V nominal, 67.5 V full charge). |
| Gate drive current | 750 mA source / 1.5 A sink - sufficient to rapidly charge/discharge 2.2-nF gate capacitance in ≤25 ns at 12-V GVDD. |
| Propagation delay match | ±4 ns (phase-to-phase & per-phase) - reduces minimum deadtime to ~200 ns, preserving torque and efficiency at high PWM frequencies. |
| Bootstrap UVLO threshold | 4.2 V (BSTx–SHx) - prevents high-side FET turn-on when bootstrap capacitor voltage drops below safe gate-drive margin. |
| Logic input compatibility | 3.3-V and 5-V CMOS - interfaces directly with MCU GPIO without level-shifting in compact motor control PCBs. |
| Thermal resistance (RθJB) | 26.5 °C/W - supports >2.5 W continuous power dissipation with standard 2-layer PCB and thermal pad soldering. |
| Operating temperature | –40°C to 125°C ambient - qualified for under-hood e-bike controllers and industrial servo drives. |
Pinout & Package
VQFN-24 package (4.0 mm × 4.0 mm, 0.5-mm pitch) with exposed thermal pad (PowerPAD™) for enhanced thermal performance. Pin 1 marked by top-side dot; pin numbering follows standard counter-clockwise sequence starting from top-left corner.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| BSTA, BSTB, BSTC (Pins 20, 17, 14) | Bootstrap output | Drive external bootstrap capacitors tied to SHA/SHB/SHC; require external diodes (DRV8300N variant). |
| GHA, GHB, GHC (Pins 19, 16, 13) | High-side gate driver output | Direct connection to gates of high-side N-MOSFETs; rated for 125-V abs max and –22-V SHx transients. |
| GLA, GLB, GLC (Pins 11, 10, 9) | Low-side gate driver output | Drive gates of low-side N-MOSFETs; referenced to GVDD (5–20 V), not ground - enables synchronous rectification. |
| INHA, INHB, INHC (Pins 22, 23, 24) | High-side logic input | CMOS-compatible control inputs; 20-V abs max rating allows direct tie to 12-V MCU rails with series resistor. |
| INLA, INLB, INLC (Pins 1, 2, 3) | Low-side logic input | Configurable inversion via MODE pin; internal 200-kΩ pulldown (non-inverted) or pullup (inverted) eliminates external bias resistors. |
| DT (Pin 21) | Deadtime adjustment | Resistor-to-GND sets deadtime from 200 ns (floating) to 2000 ns (400 kΩ); critical for preventing shoot-through in SiC/GaN designs. |
| MODE (Pin 5) | Inversion mode select | Floating = non-inverting GLx; tied to GVDD = inverting GLx - matches complementary PWM or 6-step commutation logic. |
| SHA, SHB, SHC (Pins 18, 15, 12) | High-side source sense | Return path for high-side FET sources; withstands –22-V transients - enables accurate current sensing in low-inductance layouts. |
| GVDD (Pin 4) | Gate driver supply | 5–20 V input powering all low-side drivers and bootstrap charge pumps; requires ≥10-µF X5R/X7R ceramic decoupling. |
| GND (Pin 6) | Power ground | Primary return for GVDD, logic, and gate drive currents; must be connected to thermal pad for RθJB = 26.5 °C/W. |
Key Features
| Feature | Design Value |
|---|---|
| External bootstrap diode support | Enables higher-reliability, lower-loss bootstrap paths using Schottky diodes rated for >1-A surge - essential for >100-kHz switching. |
| Adjustable deadtime (DT pin) | Linear 200–2000 ns range via single resistor - eliminates need for external deadtime ICs or complex FPGA logic in cost-sensitive inverters. |
| Configurable INLx polarity (MODE pin) | Hardware-selectable inverting/non-inverting low-side drive - simplifies firmware by allowing MCU to output identical PWM patterns for all 3 phases. |
| –22-V SHx transient tolerance | Withstands aggressive dV/dt during MOSFET turn-off in low-inductance motor windings - reduces need for snubbers or layout compromises. |
| BSTx undervoltage lockout (BSTUV) | Per-phase protection disabling GHx when BSTx–SHx falls below 4.2 V - prevents partial turn-on and shoot-through during capacitor droop. |
| GVDD undervoltage lockout (GVDDUV) | Global shutdown at 4.35 V falling threshold - ensures clean reset during brownout conditions in battery-powered systems. |
Applications
| E-Bike Motor Controller | Industrial Servo Drive |
|---|---|
|
Use Scenario: 48-V/72-V hub or mid-drive motor controller with field-oriented control (FOC) at 20-kHz PWM. IC Role / Device Role / Timing Role: Three-phase gate driver providing synchronized high/low-side drive with <200-ns deadtime to minimize conduction losses and EMI. Use Value: ±4-ns propagation delay matching ensures precise timing across phases, maintaining torque linearity and reducing acoustic noise in quiet e-bike operation. |
Use Scenario: Compact 1–3 kW servo amplifier for robotic joint actuation with position/velocity feedback loop. IC Role / Device Role / Timing Role: Half-bridge driver enabling fast, low-loss switching of 600-V Si MOSFETs in space-constrained PCBs with thermal pad cooling. Use Value: 26.5 °C/W RθJB allows >2.5 W dissipation without heatsink - critical for sealed IP65 servo enclosures with limited airflow. |
| Cordless Power Tool Inverter | Drones & Robotics ESC |
|
Use Scenario: 18–20 V cordless drill/driver with 3-phase BLDC motor and active braking. IC Role / Device Role / Timing Role: Gate driver supporting bidirectional energy flow during regenerative braking via independent high/low-side control. Use Value: –22-V SHx transient rating handles rapid voltage reversal during dynamic braking - eliminating external TVS diodes and saving board area. |
Use Scenario: 4S–6S quadcopter electronic speed controller (ESC) with 200-kHz PWM for responsive throttle control. IC Role / Device Role / Timing Role: High-speed gate driver delivering 750-mA source current to charge small-gate GaN FETs within 10 ns. Use Value: DT pin programmability allows tuning deadtime to match specific GaN device characteristics - maximizing efficiency across flight profiles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar three-phase gate driver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DRV8300NIPW | TSSOP-20 package, fixed 200-ns deadtime, no DT/MODE pins, same external bootstrap requirement. | Limited layout flexibility due to larger footprint (6.4 × 4.4 mm) and no deadtime adjustment - suitable for cost-optimized, lower-frequency (<50 kHz) designs. | Select when PCB space permits TSSOP and deadtime tuning is unnecessary; shares identical electrical specs and pinout family. |
| MP6542GQ-Z | Monolithic 3-phase driver with integrated high-side FETs (60-V), no external bootstrap needed, but lower voltage rating and no SHx transient tolerance. | Not suitable for >60-V bus or high-dV/dt motor phases; lacks –22-V SHx rating and adjustable deadtime - limited to low-voltage drones or fans. | Choose only for sub-60-V, space-constrained applications where integration outweighs voltage/transient robustness requirements. |
Compared with DRV8300NIPW and MP6542GQ-Z, the DRV8300DRGER uniquely combines 100-V capability, –22-V SHx transient tolerance, and hardware-adjustable deadtime in a thermally optimized 4×4-mm QFN - making it the only option for high-efficiency, high-reliability 15S e-mobility inverters.
Availability
DRV8300DRGER is available at Aetrix Electronics and suitable for e-bikes, cordless power tools, and industrial servo drives requiring stable component supply, long-term production continuity, and automotive-grade reliability validation.
Supply support for DRV8300DRGER includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Texas Instruments is a global semiconductor leader specializing in analog, embedded processing, and power management technologies, with decades of motor control IC expertise.
The DRV8300 product line targets high-voltage, high-efficiency BLDC/PMSM inverter systems - designed specifically for e-mobility, power tools, and robotics where thermal density, transient robustness, and gate drive precision are critical.
FAQ
What is the bootstrap diode configuration for DRV8300DRGER?
The DRV8300DRGER requires external bootstrap diodes - unlike the DRV8300D variants with integrated diodes. Each BSTx pin (BSTA/BSTB/BSTC) must connect to an external Schottky diode (e.g., RB055LAM-40) between GVDD and the corresponding BSTx node. This configuration improves thermal performance and enables higher peak currents during fast switching. The DRV8300DRGER datasheet specifies 0.7-V typical forward voltage and 15-Ω dynamic resistance for proper bootstrap capacitor recharge.
Does DRV8300DRGER support both inverting and non-inverting low-side inputs?
Yes, DRV8300DRGER supports both configurations via the MODE pin (Pin 5). When left floating, INLx inputs operate in non-inverting mode (GLx follows INLx logic state); when tied to GVDD, they operate in inverting mode (GLx opposes INLx). This hardware-selectable feature eliminates firmware-level polarity inversion and simplifies integration with MCUs generating complementary or single-ended PWM signals - a capability absent in TSSOP variants like DRV8300NIPW.
What is the maximum allowable deadtime adjustment range on DRV8300DRGER?
The DRV8300DRGER supports deadtime adjustment from 200 ns (DT pin floating) up to 2000 ns (400-kΩ resistor from DT to GND), with linear scaling per the datasheet equation. This range exceeds the fixed 200-ns deadtime of TSSOP variants and provides design margin for SiC/GaN FETs with slower turn-off times. At 40-kΩ, deadtime is ~2000 ns; at 400-kΩ, it reaches ~2600 ns - enabling precise shoot-through prevention across diverse MOSFET technologies.
How does DRV8300DRGER handle negative voltage transients on SHx pins?
DRV8300DRGER guarantees –22-V transient tolerance on all SHx pins (SHA/SHB/SHC) for durations up to 500 ns, per Absolute Maximum Ratings. This specification allows direct connection to low-inductance motor phases without external clamping components, even during aggressive regenerative braking or short-circuit events. The –22-V rating is validated under transient test conditions and is a key differentiator versus alternatives like MP6542GQ-Z, which lacks specified negative transient capability.
What thermal performance can be expected from DRV8300DRGER on a standard PCB?
With proper soldering of the exposed thermal pad to a 2-layer PCB with ≥2 in² copper pour, DRV8300DRGER achieves RθJB = 26.5 °C/W. At 2.5-W power dissipation and 25°C ambient, junction temperature remains at ~94°C - well within the 150°C maximum. This thermal performance enables fanless operation in sealed enclosures and exceeds that of TSSOP-packaged variants (RθJB = 48.8 °C/W), making DRV8300DRGER ideal for compact, high-power-density motor drives.
DRV8300DRGER Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Texas Instruments
- Series:
- -
- Package/Case:
- 24-VFQFN Exposed Pad
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Programmable:
- Not Verified
- Driven Configuration:
- High-Side and Low-Side
- Channel Type:
- 3-Phase
- Number of Drivers:
- 3
- Gate Type:
- N-Channel MOSFET
- Voltage - Supply:
- 5V ~ 20V
- Logic Voltage - VIL, VIH:
- 0.8V, 2V
- Current - Peak Output (Source, Sink):
- 750mA, 1.5A
- Input Type:
- Inverting, Non-Inverting
- High Side Voltage - Max (Bootstrap):
- 105 V
- Rise / Fall Time (Typ):
- 12ns, 12ns
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 24-VQFN (4x4)
DRV8300DRGER FAQ
1.How can I place an order for DRV8300DRGER through Aetrix?
Please submit a Request for Quotation (RFQ) for DRV8300DRGER on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DRV8300DRGER reliable?
The price and inventory of DRV8300DRGER are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DRV8300DRGER is usually 5 days.
3.What payment methods are accepted for DRV8300DRGER?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DRV8300DRGER transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DRV8300DRGER?
DRV8300DRGER orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DRV8300DRGER order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DRV8300DRGER?
For technical support, including DRV8300DRGER datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DRV8300DRGER requirements.
6.How does Aetrix verify that DRV8300DRGER is sourced from the original manufacturer or authorized distributors?
All DRV8300DRGER products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DRV8300DRGER meets industry standards.
7.What is the process for return or replacement of DRV8300DRGER?
All DRV8300DRGER units undergo pre-shipment inspection (PSI). If there is an issue with DRV8300DRGER, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DRV8300DRGER part is unused and in its original packaging.
Return procedure for DRV8300DRGER:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DRV8300DRGER Tags
-
ZXGD3009E6TA
Diodes Incorporated
-
1EDN7512BXTSA1
Infineon Technologies
-
UCC27517DBVR
Texas Instruments
-
MCP1416T-E/OT
Microchip Technology
-
MCP1402T-E/OT
Microchip Technology
-
MCP1415T-E/OT
Microchip Technology
-
MCP1401T-E/OT
Microchip Technology
-
IX4428NTR
Littelfuse Inc.
-
IRS2005STRPBF
Infineon Technologies
-
IRS2008STRPBF
Infineon Technologies
-
IX4310TTR
Littelfuse Inc.
-
2EDN7524RXTMA1
Infineon Technologies
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
