Diodes Incorporated DSR6V600P5-13

Overview

DSR6V600P5 from Diodes Incorporated is a 600 V, 6 A ultrafast recovery rectifier optimized for continuous conduction mode (CCM) power factor correction circuits and high-intensity discharge (HID) lighting ballasts. It features 23 ns reverse recovery time, 135 nC typical reverse recovery charge, and a maximum junction temperature of 175 °C in the POWERDI®5 package.

For engineers reviewing the DSR6V600P5 datasheet, DSR6V600P5 pinout, DSR6V600P5 application, or DSR6V600P5 equivalent, key selection criteria include soft reverse recovery behavior (S = 0.7), low EMI generation, thermal resistance of 30 °C/W on polyimide PCB, and compatibility with compact, low-profile (<1.1 mm) board layouts.

Technical Context

This diode employs an optimized epitaxial structure to achieve soft, low-overshoot reverse recovery-critical for minimizing switching losses and voltage spikes in CCM PFC boost stages. Its 0.7 softness factor and 23 ns trr at IF = 0.5 A / IR = 1 A ensure reduced di/dt-induced ringing and lower EMI compared to standard fast recovery diodes.

The POWERDI®5 package integrates a thermally enhanced cathode pad (18.8 mm × 14.4 mm) and anode pad (5.6 mm × 14.4 mm), enabling 30 °C/W RθJA on polyimide PCB-nearly 3× better than FR-4-supporting high-power density in space-constrained HID and motor control designs.

Key Specifications

Pinout & Package

The DSR6V600P5 uses the POWERDI®5 surface-mount package: 4.0 mm × 6.5 mm footprint, 1.1 mm profile, molded plastic case (UL 94V-0), matte tin-plated copper leads, and bottom-side thermal pad for PCB-level heat sinking. Pins are arranged as left (anode) and right (cathode); both must be electrically connected to respective PCB pads.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast recovery rectifier applications.

Compared with STTH6L06S and MUR660E, DSR6V600P5 delivers superior thermal performance (30 °C/W) and lowest profile (1.1 mm), making it optimal for space-constrained, high-efficiency CCM PFC and HID ballast designs where PCB-level thermal management is feasible.

Availability

DSR6V600P5 is available at Aetrix Electronics and suitable for CCM power factor correction, HID lighting ballasts, industrial motor drives, and UPS DC-link protection requiring stable component supply and long-term design-in support.

Supply support for DSR6V600P5 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-performance, energy-efficient components for power management and signal integrity.

The DIODESTAR rectifier product line targets high-frequency switching applications-including PFC, lighting, and motor control-with emphasis on soft recovery, low Qrr, and thermally optimized packaging.

FAQ

What is the maximum allowable junction temperature for DSR6V600P5?

The absolute maximum junction temperature is +175 °C, validated per JEDEC test conditions. Operation above this limit risks permanent degradation of the epitaxial junction and accelerated parameter drift. Derating curves in the datasheet define safe ambient and lead temperature limits based on PCB layout and airflow.

Is DSR6V600P5 suitable for discontinuous conduction mode (DCM) PFC?

No-it is specifically optimized for CCM operation, where low Qrr and soft recovery minimize turn-off losses. In DCM, reverse recovery effects are negligible; standard fast recovery diodes or SiC Schottky devices offer better cost/performance trade-offs for that topology.

Does the POWERDI®5 package require thermal vias under the bottom pad?

Thermal vias are not mandatory but strongly recommended: at least six 0.3 mm vias spaced evenly under the cathode pad significantly reduce RθJA on FR-4 boards. On polyimide PCBs with large copper pours, vias provide marginal improvement but enhance reliability under sustained 6 A loads.

How does the softness factor (S = 0.7) impact EMI in PFC designs?

A softness factor of 0.7 indicates controlled, non-abrupt current decay during reverse recovery-reducing high-frequency spectral content in switching node waveforms. This lowers common-mode noise and simplifies EMI filter design, especially critical in Class B conducted emissions compliance for lighting and industrial equipment.