Diodes Incorporated DXTP3C100PD-13

Overview

DXTP3C100PD-13 from Diodes Incorporated is a dual PNP low-saturation bipolar junction transistor in PowerDI5060-8/SWP package, rated for -100V V_CEO, -3A continuous collector current, and 110mΩ typical R_CE(sat) at -2A/-200mA drive-designed for high-temperature power switching in automotive load management and industrial DC-DC converters.

For engineers reviewing the DXTP3C100PD-13 datasheet, DXTP3C100PD-13 pinout, DXTP3C100PD-13 application, or DXTP3C100PD-13 equivalent, key selection criteria include verified -100V breakdown rating, dual-die thermal coupling behavior, R_CE(sat) stability up to +175°C, and complementary pairing with DXTN3C100PD for H-bridge implementations.

Technical Context

This dual PNP transistor integrates two identical high-voltage, high-current gain transistors in a single thermally optimized PowerDI5060-8/SWP leadframe package with shared thermal path to the collector leads. Each die supports -100V V_CEO, -3A I_C, and delivers h_FE = 45–305 across -0.5A to -3A loads at V_CE = -10V.

It operates across -55°C to +175°C junction temperature range with R_θJL = 5.7°C/W (junction-to-lead), enabling direct PCB copper pad conduction cooling. ESD ratings meet 4kV HBM (JEDEC Class 3A) and 400V MM, supporting robust handling in automated assembly lines.

Key Specifications

Pinout & Package

Package: PowerDI5060-8/SWP (Type UXD), surface-mount, thermally enhanced leadframe with exposed collector pads on both sides; UL 94V-0 molded green compound; moisture sensitivity level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual high-voltage PNP switching applications.

Compared with ZXTDA100DTC and DMT3005LPSQ-13, DXTP3C100PD-13 uniquely combines -100V rating, dual PNP topology, and +175°C operation-making it the only viable option for high-reliability, high-temperature, high-voltage discrete switching where bipolar drive simplicity and thermal headroom are mandatory.

Availability

DXTP3C100PD-13 is available at Aetrix Electronics and suitable for automotive body control modules, industrial DC-DC converters, and telecom power shelf protection requiring stable component supply, long-term lifecycle support, and AEC-Q101-aligned manufacturing traceability.

Supply support for DXTP3C100PD-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability power management, signal integrity, and protection solutions for automotive, industrial, and computing markets.

DXTP3C100PD-13 belongs to Diodes' Power Transistor product line, engineered specifically for high-temperature, high-voltage discrete switching in safety-critical and thermally demanding applications-emphasizing ruggedness, parametric consistency, and automotive-grade process control.

FAQ

What is the thermal resistance from junction to ambient (R_θJA) for DXTP3C100PD-13 under standard PCB conditions?

R_θJA is 85°C/W when mounted on a 25mm × 25mm 1oz copper area on a single-sided 1.6mm FR4 board under still air. This value applies to steady-state operation with one active die; dual-die simultaneous operation increases effective thermal resistance due to mutual heating, requiring layout derating per Diodes' AN-2001 guidelines.

Can DXTP3C100PD-13 be used as a direct replacement for a single PNP transistor in existing designs?

No-it contains two independent PNP transistors in one package with shared thermal mass and non-isolated collectors. Using only one section requires accounting for thermal crosstalk and verifying that unused base/emitter terminals are properly terminated (typically grounded) to prevent latch-up or leakage-induced instability.

Does DXTP3C100PD-13 meet AEC-Q101 qualification requirements?

While not explicitly AEC-Q101 certified per its datasheet, DXTP3C100PD-13 is manufactured in IATF 16949-certified facilities and supports PPAP documentation. Diodes states that automotive-grade change control and qualification are available upon request-confirm with Diodes' automotive team before deployment in safety-critical vehicle systems.

What is the recommended minimum solder paste stencil aperture for the PowerDI5060-8/SWP package?

Per Diodes' packaging guide, use a 0.125mm thick stencil with 100% opening ratio for all pads, including the dual exposed collector pads. Recommended land pattern matches IPC-7351B SOIC-8 density, with 0.61mm pad width and 1.72mm length for side terminals and 4.42mm × 3.81mm for each collector pad to ensure void-free solder joints and optimal thermal transfer.