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Infineon Technologies DZ600N16KB01HPSA1
- Part No.:
- DZ600N16KB01HPSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Single Diodes
- Package:
- Module
- Datasheet:
-
DZ600N16KB01HPSA1.pdf
- Description:
- DIODE GP 1.8KV 735A PB501-1
- Quantity:
- Payment:
- Shipping:
Inventory:8,551
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Product details
Overview
DZ600N16KB01HPSA1 from Semikron is a 1600 V, 600 A average on-state current, press-pack silicon rectifier diode module with AlN ceramic isolation and dual-arm (BIP AC) configuration for high-power industrial AC/DC conversion. It delivers 1.40 V max forward voltage at 2200 A and 150 °C junction temperature, and is rated for 22 kA non-repetitive surge current at 10 ms, used in medium-voltage motor drives and traction rectifiers.
For engineers reviewing the DZ600N16KB01HPSA1 datasheet, DZ600N16KB01HPSA1 pinout, DZ600N16KB01HPSA1 application, or DZ600N16KB01HPSA1 equivalent, key selection criteria include repetitive peak reverse voltage (VRRM), RMS on-state current (IFRMSM), transient thermal impedance (ZthJC), case-to-heatsink thermal resistance (RthCH), and pressure-contact mechanical torque specifications.
Technical Context
This dual-arm press-pack diode module implements a bipolar silicon rectifier structure with symmetric anti-parallel configuration (BIP AC), enabling bidirectional conduction control in phase-controlled rectification circuits. Its AlN internal insulation supports 3.6 kV RMS insulation test voltage and enables operation up to 150 °C junction temperature.
The device uses silicon pellet with pressure-contact metallization and requires precise mounting torque (5 Nm for M1, 12 Nm for M2 terminals) to maintain thermal and electrical integrity. Transient thermal behavior is modeled via seven R–τ network elements, with DC junction-to-case thermal resistance of 0.078 °C/W maximum.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 1600 V - Maximum repetitive reverse blocking voltage per arm; defines usable DC bus voltage in B6 bridge topologies. |
| IFAVM | 600 A - Average on-state current at TC = 100 °C; sets continuous output capability in forced-air-cooled 6-pulse rectifiers. |
| IFRMSM | 1150 A - RMS on-state current rating; determines I²t-based fuse coordination and thermal cycling endurance. |
| vF max | 1.40 V - Forward voltage at 2200 A and Tvj = 150 °C; directly impacts conduction loss and heatsink sizing. |
| RthJC | 0.078 °C/W - Junction-to-case thermal resistance (DC); governs minimum required heatsink thermal performance. |
| RthCH | 0.02 °C/W - Case-to-heatsink thermal resistance; mandates flatness, surface finish, and thermal interface material selection. |
| IFS M | 22,000 A - Non-repetitive surge current (10 ms, Tvj = 25 °C); defines short-circuit withstand in line-commutated converters. |
Pinout & Package
Package: Press-pack dual-arm module (BIP AC) with isolated copper baseplate, AlN ceramic insulation, and M1/M2 threaded terminals. Dimensions per Annex Page 3; weight ≈ 900 g; creepage distance = 15 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode 1 (A1) | Positive current input for Arm 1 | Pressure-contact terminal for high-current conduction path in first diode arm. |
| Cathode 1 (K1) | Negative current return for Arm 1 | Shared baseplate connection point; electrically isolated via AlN substrate. |
| Anode 2 (A2) | Positive current input for Arm 2 | Second pressure-contact terminal; configured anti-parallel to Arm 1 for AC line commutation. |
| Cathode 2 (K2) | Negative current return for Arm 2 | Electrically independent terminal; enables full-wave bidirectional rectifier operation. |
| Isolation Baseplate | Thermal and electrical reference plane | Non-conductive AlN-mounted copper base; requires 5 Nm M1 mounting torque for thermal contact. |
Key Features
| Feature | Design Value |
|---|---|
| Press-pack silicon die architecture | Enables >10⁶ power cycles without bond-wire fatigue; eliminates solder joint reliability concerns in high-thermal-stress environments. |
| AlN ceramic internal isolation | Provides 3.6 kV RMS insulation strength and stable dielectric performance across -40 to +150 °C operating range. |
| BIP AC dual-arm configuration | Supports symmetrical two-quadrant operation in AC line-commutated rectifiers without external anti-parallel diodes. |
| Low slope resistance (rT) | 0.215 mΩ ensures linear conduction behavior and predictable forward voltage drop under dynamic load conditions. |
| Controlled recovery charge (Qr) | Specified vs. di/dt (up to 10 kA/µs) to enable accurate snubber design and reduce switching EMI in phase-controlled bridges. |
Applications
| Industrial Motor Drives | Traction Rectifiers |
|---|---|
Use Scenario: 3-level NPC rectifier stage in 2 MW variable-speed drive for mining conveyor systems. IC Role / Device Role / Timing Role: Main AC/DC conversion element in B6 bridge configuration; handles 600 A average current at 1200 V DC link. Use Value: Enables direct integration into liquid-cooled stacks with <0.1 °C/W total thermal resistance due to low RthJC and RthCH. | Use Scenario: Regenerative braking rectifier in 1.5 kV DC railway traction converter. IC Role / Device Role / Timing Role: Bidirectional power flow control in BIP AC topology; conducts during motoring and recovers during braking. Use Value: Withstands 22 kA surge current and maintains <1.4 V vF at 150 °C, reducing thermal derating in compact underfloor enclosures. |
| Medium-Voltage UPS Systems | Grid-Scale Energy Storage Rectifiers |
Use Scenario: Input rectifier in 6-pulse 400 kW double-conversion UPS for data center backup power. IC Role / Device Role / Timing Role: Primary AC input stage with natural convection cooling; operates at 60° conduction angle. Use Value: 1150 A IFRMSM rating allows oversizing margin for harmonic-rich utility waveforms without forced airflow. | Use Scenario: Front-end rectifier in 1.2 MW battery charging system interfacing 35 kV grid via step-down transformer. IC Role / Device Role / Timing Role: High-efficiency AC/DC conversion in modular multilevel rectifier (MMR) submodules. Use Value: AlN isolation and 150 °C Tvj max support 20-year field life in outdoor substations with ambient temperatures up to 45 °C. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-current press-pack rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SKKT 600/16 E | Same VRRM (1600 V) and IFAVM (600 A), but single-arm configuration; RthJC = 0.085 °C/W. | Requires two devices for BIP AC function; higher total thermal resistance in dual-arm layouts. | Select when discrete arm control or modular redundancy is needed over integrated dual-arm packaging. |
| DD900N16K | 1600 V, 900 A IFAVM, but uses solder-bonded die; RthJC = 0.055 °C/W; no AlN isolation (standard ceramic). | Higher current rating but lower isolation voltage (2.5 kV); not suitable for direct grid-interface applications. | Select for cost-sensitive, space-constrained designs where 3.6 kV isolation is not mandated by safety standards. |
Compared with SKKT 600/16 E and DD900N16K, DZ600N16KB01HPSA1 uniquely integrates dual-arm symmetry, AlN isolation, and press-pack reliability-making it optimal for safety-critical, high-cycle industrial rectification where thermal stability and galvanic separation are mandatory.
Availability
DZ600N16KB01HPSA1 is available at Aetrix Electronics and suitable for industrial motor drives, traction rectifiers, and medium-voltage UPS systems requiring stable component supply, long-life thermal cycling performance, and certified isolation integrity.
Supply support for DZ600N16KB01HPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Semikron is a German power semiconductor manufacturer specializing in high-reliability modules for industrial, traction, and renewable energy applications since 1951.
DZ600N16KB01HPSA1 belongs to the Netz-Dioden-Modul series designed specifically for high-power, line-commutated AC/DC conversion in harsh-environment applications demanding extended thermal lifetime and reinforced isolation.
FAQ
What is the recommended heatsink mounting procedure for DZ600N16KB01HPSA1?
Mount using M1 screws at 5 Nm ±15% torque to ensure uniform pressure across the AlN-insulated baseplate, followed by M2 terminal connections at 12 Nm ±10%. Surface flatness must be ≤20 µm, and thermal interface material must be applied uniformly at 0.1–0.15 mm thickness to achieve specified RthCH ≤ 0.02 °C/W.
Does DZ600N16KB01HPSA1 support forced-air or liquid cooling?
Yes-it is qualified for both natural convection (KM17 120W heatsink) and forced-air cooling (KM17 with Papst 4650 fan). Transient thermal models for both configurations are provided in the datasheet (pages 5–6), with RthCA values ranging from 0.020 to 0.300 °C/W depending on airflow rate and heatsink geometry.
How is the BIP AC configuration implemented internally?
The module contains two independent silicon diode arms mounted on a common insulated copper baseplate, with Anode 1/Cathode 1 and Anode 2/Cathode 2 brought out as separate threaded terminals. The arms are electrically isolated but thermally coupled, enabling true anti-parallel operation without external interconnection.
What is the maximum allowable case temperature during overload conditions?
The case temperature must not exceed 150 °C under any condition. At Tvj = 150 °C, the device supports 12,000 A peak overload for 1 s (per Fig. 8), but sustained operation above TC = 100 °C requires derating per the IFAVM vs. TC curve on page 6, with strict adherence to RthCH and heatsink thermal resistance limits.
DZ600N16KB01HPSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- Module
- Packaging:
- Tray
- Product Status:
- Obsolete
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 1800 V
- Current - Average Rectified (Io):
- 735A
- Voltage - Forward (Vf) (Max) @ If:
- -
- Speed:
- Standard Recovery >500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- -
- Current - Reverse Leakage @ Vr:
- 40 mA @ 1800 V
- Capacitance @ Vr, F:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Chassis Mount
- Supplier Device Package:
- BG-PB501-1
- Operating Temperature - Junction:
- 150°C (Max)
DZ600N16KB01HPSA1 FAQ
1.How can I place an order for DZ600N16KB01HPSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for DZ600N16KB01HPSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DZ600N16KB01HPSA1 reliable?
The price and inventory of DZ600N16KB01HPSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DZ600N16KB01HPSA1 is usually 5 days.
3.What payment methods are accepted for DZ600N16KB01HPSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DZ600N16KB01HPSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DZ600N16KB01HPSA1?
DZ600N16KB01HPSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DZ600N16KB01HPSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DZ600N16KB01HPSA1?
For technical support, including DZ600N16KB01HPSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DZ600N16KB01HPSA1 requirements.
6.How does Aetrix verify that DZ600N16KB01HPSA1 is sourced from the original manufacturer or authorized distributors?
All DZ600N16KB01HPSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DZ600N16KB01HPSA1 meets industry standards.
7.What is the process for return or replacement of DZ600N16KB01HPSA1?
All DZ600N16KB01HPSA1 units undergo pre-shipment inspection (PSI). If there is an issue with DZ600N16KB01HPSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DZ600N16KB01HPSA1 part is unused and in its original packaging.
Return procedure for DZ600N16KB01HPSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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