Microchip Technology EEC1727-I/2GW-TR

Overview

EEC1727-I/2GW-TR from Microchip Technology is a 32-bit ARM® Cortex-M4F embedded controller with secure boot, hardware cryptographic accelerators (AES-256, ECDSA, SHA-2/512, RSA up to 4096-bit), 416KB SRAM (352KB code + 64KB data), and dual-voltage I/O (1.8 V / 3.3 V) for PC platform power management. It supports all ACPI S0–S5 states, includes RTC, hibernation timer, two UARTs, five SMBus/I²C controllers, eight ADC channels, and operates across –40°C to +85°C.

For engineers reviewing the EEC1727-I/2GW-TR datasheet, EEC1727-I/2GW-TR pinout, EEC1727-I/2GW-TR application, or EEC1727-I/2GW-TR equivalent, this page delivers verified technical context, validated package mapping, confirmed low-power sleep modes (Light/Heavy Sleep), real-world security use cases, and accurate alternative part comparisons - all grounded in Microchip's DS00003840A documentation.

Technical Context

The EEC1727-I/2GW-TR integrates an ARM Cortex-M4F core running at up to 96 MHz with tightly coupled SRAM (352KB ITCM + 64KB DTCM), a dedicated Boot ROM with secure bootloader, and hardware crypto engines supporting authenticated boot from external SPI Flash (e.g., SST25PF040C). Its interrupt architecture includes an EC Interrupt Aggregator and NVIC with 8 priority levels.

Power management is implemented via dual suspend supply planes (VBAT, VTR) and runtime sensing of VCC, enabling instant-on behavior and support for ACPI-compliant sleep states. Peripheral subsystems include a 16-channel DMA controller with CRC-32, six configurable I²C/SMBus ports routed through a full crossbar switch, and battery-backed peripherals (RTC, hibernation timers, 128-byte VBAT SRAM).

Key Specifications

Pinout & Package

EEC1727-I/2GW-TR uses a 68-pin Wafer-Level Fine-Pitch Ball Grid Array (WFBGA) package measuring 5.0 × 5.0 mm with 0.4 mm ball pitch. The package supports 55 GPIOs, including 8 over-voltage tolerant pins, 8 GPIO pass-through ports (GPTP), and dedicated analog inputs (ADC, comparator, VREF).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar embedded controller applications.

Compared with EEC1727-I/2GW-TR, EEC1725-I/2GW-TR offers identical packaging and power management but omits RSA/ECC and internal SPI Flash support, making it appropriate for non-security-critical designs; ASPEED AST2600A1B264 targets BMC use cases with higher compute and connectivity needs, lacking the EEC1727's hardware RoT and ultra-low-power EC sleep architecture.

Availability

EEC1727-I/2GW-TR is available at Aetrix Electronics and suitable for PC platform power management, secure storage enclosures, thermal subsystems, and industrial sensor hubs requiring stable component supply, long-term lifecycle support, and guaranteed traceable sourcing.

Supply support for EEC1727-I/2GW-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology Inc. is a leading provider of microcontrollers, analog components, and security solutions, headquartered in Chandler, Arizona, with global design and manufacturing operations.

The EEC1727 belongs to Microchip's Embedded Controller family, designed specifically for secure, low-power platform management in PC, storage, and industrial systems - emphasizing hardware-enforced trust, ACPI compliance, and mixed-signal integration.

FAQ

What is the primary function of the EEC1727-I/2GW-TR in a PC platform?

The EEC1727-I/2GW-TR serves as the embedded controller responsible for low-level platform power management, including ACPI S0–S5 state transitions, keyboard/mouse wake event handling, thermal regulation, and secure boot enforcement. Its ARM Cortex-M4F core executes firmware that coordinates with the chipset while maintaining hardware-rooted security - making the EEC1727-I/2GW-TR essential for reliable, standards-compliant PC system control.

Does the EEC1727-I/2GW-TR support secure boot from external SPI Flash?

Yes, the EEC1727-I/2GW-TR supports secure boot from external SPI Flash using its hardware cryptographic accelerators. The Boot ROM authenticates firmware images via ECDSA and SHA-512 before loading, and optionally decrypts them using AES-256. It supports dual-image fallback and is validated for use with SST25PF040C and compatible devices - a core capability of the EEC1727-I/2GW-TR.

What are the supported operating voltages and temperature range for the EEC1727-I/2GW-TR?

The EEC1727-I/2GW-TR operates with dual I/O voltage rails: 1.8 V and 3.3 V, distributed across three configurable GPIO banks (VTR1, VTR2, VTR3). Its specified industrial temperature range is –40°C to +85°C, fully qualified per Microchip DS00003840A - ensuring robust operation in PC enclosures, storage systems, and industrial environments where the EEC1727-I/2GW-TR is deployed.

How many ADC channels does the EEC1727-I/2GW-TR provide, and what resolution is supported?

The EEC1727-I/2GW-TR integrates eight ADC input channels (GPIO200–GPIO207) supporting configurable 10-bit or 12-bit conversion with 500 ns per channel. It accepts external voltage reference (VREF_ADC) and is optimized for thermistor-based temperature sensing and power rail monitoring - a key feature enabling autonomous thermal and power supervision in the EEC1727-I/2GW-TR.

What package type and pin count does the EEC1727-I/2GW-TR use?

The EEC1727-I/2GW-TR uses a 68-pin Wafer-Level Fine-Pitch Ball Grid Array (WFBGA) package measuring 5.0 mm × 5.0 mm with 0.4 mm ball pitch. This compact, surface-mount package accommodates 55 GPIOs, multiple peripheral interfaces (SPI, I²C, UART), and dedicated analog inputs - matching the mechanical and routing requirements of modern motherboard and storage enclosure designs where the EEC1727-I/2GW-TR is applied.