onsemi EGP30A

Overview

EGP30A from onsemi is a glass-passivated axial-lead superfast rectifier diode rated for 3.0 A average forward current, 50 V peak repetitive reverse voltage, and 50 ns maximum reverse recovery time; it delivers low forward voltage (0.95 V at 3.0 A) and low leakage (5.0 µA at 25°C), suited for high-efficiency AC/DC input stages in compact power supplies.

For engineers reviewing the EGP30A datasheet, pinout, applications, or equivalent options, this part serves as a high-surge-capable (125 A), thermally robust (R_JL = 8.5 °C/W) discrete rectifier requiring attention to lead-length thermal derating, junction temperature limits (−65 °C to 150 °C), and DO-201AD package mounting constraints.

Technical Context

The EGP30A employs a glass-passivated cavity-free PN junction enabling stable operation under repeated surge stress and minimizing surface leakage paths. Its superfast recovery (50 ns) and low forward voltage are optimized for switching-mode power supply (SMPS) input rectification where efficiency and EMI control are critical.

Thermal design relies on its low junction-to-lead resistance (8.5 °C/W) and requires minimum 0.375" lead length for full 3.0 A rating; ambient derating begins above 25°C with R_JA = 20 °C/W. The device operates across −65 °C to 150 °C junction temperature range and is Pb-free, halide-free, and RoHS compliant.

Key Specifications

Pinout & Package

EGP30A uses the DO-201AD (Case 017AF) axial-lead glass package with cathode indicated by a color band. Leads are non-inductive, intended for through-hole mounting with minimum 0.375" lead length for rated current.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar superfast rectifier applications.

Compared with STTH3L06S and MBR360, the EGP30A provides optimal balance of 50 V blocking, 50 ns speed, and DO-201AD form factor for cost-sensitive, space-constrained 50 V-class AC/DC inputs-without Schottky leakage trade-offs or TO-220 thermal overhead.

Availability

EGP30A is available at Aetrix Electronics and suitable for AC/DC wall adapters, industrial power supplies, LED driver power stages, and UPS input rectification requiring stable component supply and long-lifecycle support.

Supply support for EGP30A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (formerly ON Semiconductor) is a global semiconductor supplier delivering energy-efficient, high-performance silicon solutions for automotive, industrial, cloud, and IoT applications.

The EGP30A belongs to onsemi's high-efficiency rectifier product line, engineered specifically for high-frequency, high-reliability AC/DC front-end rectification in compact, thermally constrained power converters.

FAQ

What is the maximum allowable junction temperature for EGP30A?

The EGP30A has a specified junction temperature range of −65 °C to +150 °C. Operation beyond 150 °C risks permanent parametric shift or catastrophic failure. Derating curves in the official onsemi datasheet (EGP30K/D, Rev. 2, June 2024) define safe current limits versus T_J; sustained operation above 135 °C requires careful thermal design verification. The EGP30A must be mounted with ≥0.375" lead length to achieve its rated 3.0 A at T_L = 55°C.

Is EGP30A pin-compatible with other EGP30x variants like EGP30D or EGP30K?

Yes - all EGP30x devices share identical DO-201AD (Case 017AF) axial-lead packaging, anode/cathode terminal configuration, and mechanical dimensions. However, electrical ratings differ significantly: EGP30A is rated for 50 V V_RRM, while EGP30D is 200 V and EGP30K is 800 V. Substituting EGP30A for higher-voltage variants risks immediate breakdown under normal operating voltage; always verify reverse voltage requirements before interchange.

Does EGP30A require a heatsink in typical 3.0 A applications?

No - the EGP30A is designed for lead-mounted thermal conduction without a heatsink when leads are ≥0.375" long and ambient temperature remains ≤55°C. Its R_JL = 8.5 °C/W enables effective heat transfer directly through leads to PCB copper. For continuous 3.0 A operation at higher ambient temperatures or in enclosed spaces, additional copper pour or forced airflow is recommended. The EGP30A datasheet provides forward current derating curves confirming thermal behavior under real-world conditions.

What does the "A" suffix in EGP30A indicate?

Per onsemi's ordering documentation, the "A" in EGP30A designates the specific voltage grade within the EGP30 family: 50 V peak repetitive reverse voltage (V_RRM). Other suffixes denote different V_RRM ratings - e.g., "D" = 200 V, "K" = 800 V. All EGP30x variants share identical package (DO-201AD), current rating (3.0 A), recovery time spec (50–75 ns depending on variant), and construction (glass-passivated superfast rectifier). The EGP30A is not discontinued, unlike some other variants noted in the datasheet.

How does EGP30A compare to standard FR30x rectifiers in terms of recovery performance?

The EGP30A offers significantly faster recovery (50 ns) than standard FR30x fast rectifiers (typically 250–500 ns), reducing reverse recovery charge (Q_rr) and associated switching losses. This enables higher-frequency operation, lower EMI, and improved efficiency in modern switch-mode power supplies. Unlike FR30x, the EGP30A uses glass passivation instead of plastic encapsulation, enhancing moisture resistance and long-term parameter stability - a key distinction confirmed in the onsemi EGP30K/D datasheet.