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Microchip Technology EMC1704-2-AP-TR

Part No.:
EMC1704-2-AP-TR
Manufacturer:
Microchip Technology
Category:
Power Management - Specialized
Package:
16-VQFN Exposed Pad
Datasheet:
AetrixEMC1704-2-AP-TR.pdf
Description:
IC TEMP MONITOR I2C/SMBUS 16QFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,770

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Product details

Overview

EMC1704-2-AP-TR from Microchip Technology is a high-side current-sense IC with integrated 1°C-accurate temperature monitoring for up to three external diodes and an internal sensor. It delivers bi-directional current measurement (±1% accuracy), real-time power calculation via source voltage sensing (3V–24V bus range), and hardware-based instantaneous current peak detection. It serves in notebook/desktop power management systems where precise thermal and load monitoring is required for CPU/GPU rail supervision.

For engineers reviewing the EMC1704-2-AP-TR datasheet, EMC1704-2-AP-TR pinout, EMC1704-2-AP-TR application, or EMC1704-2-AP-TR equivalent, this page provides verified specifications, QFN-16 package details, SMBus 2.0 interface behavior, peak detection configuration, and validated alternative parts for thermal-current co-monitoring designs.

Technical Context

The EMC1704-2-AP-TR implements dual-path analog front-end architecture: one 11-bit ADC for current sense voltage (SENSE+/-) with programmable integration time (82ms–2.6s), and separate 13–15-bit ADCs for temperature channels. Its hardware peak detector (exclusive to EMC1704-2 variants) uses DUR_SEL/TH_SEL resistor inputs to set duration (1–128ms) and threshold (±12.5mV to ±200mV) without firmware intervention.

Temperature measurement employs Resistance Error Correction (REC), Beta Compensation for 45nm/65nm CPU diodes, and automatic diode-type detection-including anti-parallel diode support. SMBus 2.0 communication includes block read/write, pin-selectable address, and ALERT/THERM dual-fault outputs with maskable and non-maskable thresholds.

Key Specifications

Parameter Value and Actual Design Meaning
Current Accuracy ±1% over full scale - enables reliable overcurrent protection and power budgeting in DC-DC output rails.
Bus Voltage Range 3V to 24V - supports wide-input industrial and computing power supplies without external level-shifting.
Temp Accuracy (External) ±1°C (20°C–110°C) - meets CPU/GPU diode junction monitoring requirements per JEDEC JESD51-1.
Peak Detection Hardware-based, programmable via resistors - eliminates MCU polling overhead for transient current spike flagging.
SMBus Interface SMBus 2.0 compliant with block read/write - ensures interoperability with standard system management controllers.
Operating Temp −40°C to +85°C - qualified for industrial and commercial embedded environments without derating.
Package 16-pin QFN, 4mm × 4mm, 0.5mm pitch - enables compact layout in space-constrained laptop motherboard VRM zones.

Pinout & Package

EMC1704-2-AP-TR is housed in a RoHS-compliant 16-pin QFN package (4mm × 4mm, 0.5mm pitch) with exposed thermal pad. Pin functions are validated per DS20005239A Figure 1.2 and Table 1.1.

Pin/Terminal Circuit Role Design Meaning
SENSE+ High-side current sense input Connects to high-side of external shunt resistor; differential input referenced to SENSE−.
SENSE− High-side current sense return Completes current sense path; used with SENSE+ for bidirectional measurement.
DP1/DN1 Diode channel 1 terminals Supports standard or anti-parallel diode connection for remote temperature sensing.
DP2/DN2 Diode channel 2 terminals Independent dual-diode interface for multi-zone thermal monitoring (e.g., CPU + GPU).
DP3/DN3 Diode channel 3 terminals Third remote sensing channel; enables tri-point thermal profiling in server DIMMs or VRMs.
ALERT Maskable fault indicator Asserts open-drain low on configurable overtemp, overvoltage, or overcurrent events.
THERM Non-maskable critical alert Hardwired shutdown signal for thermal runaway or catastrophic current faults.
SMCLK/SMDATA SMBus clock/data lines Standard two-wire interface compatible with host PMBus/SMBus controllers.
ADDR_SEL SMBus address selection Resistor-programmable to set one of four device addresses (0x4C–0x4F) on shared bus.
DUR_SEL / TH_SEL Peak detection timing/threshold config Resistor inputs that configure hardware peak detector duration (1–128ms) and threshold (±12.5–200mV).
GPIO General-purpose I/O Configurable as input or open-drain output; usable for board-level status signaling or reset coordination.
VDD / GND Power supply pins Accepts 3.0V–3.6V supply; supports bus-powered operation down to 3V for low-voltage systems.
EPAD Exposed thermal pad Must be soldered to PCB ground plane for thermal dissipation and EMI reduction.

Key Features

Feature Design Value
Hardware peak detector Offloads transient current detection from host MCU-enables deterministic response <100μs without firmware latency.
Beta Compensation Corrects for BJT-model diode nonlinearity in 45nm/65nm CPUs-ensures accurate junction temperature at process corners.
Resistance Error Correction (REC) Compensates for series resistance in diode traces-improves remote temp accuracy by up to 2.5°C in long-pcb layouts.
Anti-parallel diode support Enables use of cost-effective dual-diode packages-reduces BOM count and PCB footprint vs. discrete diodes.
Programmable averaging Configurable 11–15-bit conversion resolution per channel-balances noise rejection vs. update rate for thermal stability.

Applications

Laptop CPU Voltage Regulator Monitoring Industrial Motor Drive Thermal Protection

Use Scenario: Real-time monitoring of CPU core rail current and die temperature during turbo boost cycles.

IC Role / Device Role / Timing Role: High-side current sensor + triple-diode thermal monitor with hardware peak flagging for instantaneous load surges.

Use Value: Enables dynamic power capping before thermal throttling occurs; ±1°C diode accuracy prevents false throttling.

Use Scenario: Detecting winding overtemperature and phase current imbalance in 3-phase BLDC motor drives.

IC Role / Device Role / Timing Role: Simultaneous current sensing across DC bus and remote temperature sampling from motor windings and heatsink.

Use Value: Hardware peak detection triggers immediate shutdown on short-circuit events; REC compensates for PCB trace resistance in harsh environments.

Server Memory Module Power Management Embedded Edge AI Accelerator Board

Use Scenario: Per-DIMM current and temperature tracking in DDR4/DDR5 memory subsystems under variable workloads.

IC Role / Device Role / Timing Role: Measures VDDQ rail current while monitoring DRAM package diode and module PCB hotspot via three external channels.

Use Value: SMBus block reads deliver synchronized current/temp data every 100ms-supports predictive failure analytics without host CPU overhead.

Use Scenario: Thermal and load monitoring of FPGA I/O bank supplies and AI accelerator core voltage rails.

IC Role / Device Role / Timing Role: Dual-role device: current sensor for 12V/5V/3.3V rails and temperature monitor for FPGA junction, heatsink, and ambient.

Use Value: THERM output directly gates power delivery on critical overtemp; ADDR_SEL allows stacking multiple units on single SMBus segment.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-side current and multi-channel temperature monitoring applications.

Alternative Part Technical Difference Application Difference Selection Advice
INA233AIRGTT Single-channel current sensor only; no integrated temperature monitoring or diode interfaces. Requires external temperature IC (e.g., TMP117) for thermal co-monitoring-increases BOM count and calibration complexity. Select when only precision current sensing is needed and thermal monitoring is handled separately.
MAX31785AETL+ Fan controller with integrated current sensing and 2-temp-channel monitoring; lacks hardware peak detection and REC/Beta compensation. Optimized for fan speed control loops-not suitable for CPU/GPU junction temp accuracy or transient current flagging. Select for thermal management systems prioritizing fan PWM control over diode-model fidelity or peak event capture.

Compared with INA233AIRGTT and MAX31785AETL+, the EMC1704-2-AP-TR uniquely integrates hardware-based peak detection, REC, and Beta Compensation-making it the only option capable of autonomous, high-fidelity thermal-current co-monitoring for advanced computing platforms without external support circuitry.

Availability

EMC1704-2-AP-TR is available at Aetrix Electronics and suitable for notebook computers, industrial motor drives, and embedded edge AI accelerators requiring stable component supply and long-term production continuity.

Supply support for EMC1704-2-AP-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Microchip Technology is a global semiconductor company specializing in microcontrollers, analog devices, and interface ICs, with ISO/TS 16949-certified manufacturing and design facilities.

The EMC1704 product line was designed specifically for high-accuracy, co-located current and temperature monitoring in computing and industrial power systems-emphasizing hardware autonomy, diode-model fidelity, and SMBus interoperability.

FAQ

What distinguishes EMC1704-2-AP-TR from the EMC1704-1 variant?

The EMC1704-2-AP-TR features a 16-pin QFN package and includes hardware-based peak detection controlled by DUR_SEL and TH_SEL resistor inputs-functionality absent in the 14-pin SOIC EMC1704-1. It also supports all EMC1704-2-specific registers (e.g., Product Features Register) and offers identical current accuracy (±1%), temperature performance (±1°C), and SMBus 2.0 compliance. The EMC1704-2-AP-TR is the only variant with true autonomous peak flagging independent of host firmware.

Does EMC1704-2-AP-TR support anti-parallel diode configurations?

Yes, EMC1704-2-AP-TR explicitly supports anti-parallel diode connections across all three external diode channels (DP1/DN1, DP2/DN2, DP3/DN3), as documented in Section 4.7.1 of DS20005239A. This allows use of low-cost dual-diode packages and improves layout flexibility in tight spaces-particularly valuable in laptop motherboard designs where trace routing is constrained.

How does Resistance Error Correction (REC) improve temperature accuracy in EMC1704-2-AP-TR?

Resistance Error Correction (REC) in EMC1704-2-AP-TR measures and subtracts the voltage drop across PCB trace resistance between the IC and remote diode, preventing systematic temperature offset. As specified in Section 4.6.1, REC improves effective accuracy by up to 2.5°C in layouts with >50mΩ trace resistance-critical for maintaining ±1°C diode measurement integrity in high-density computing boards.

Can EMC1704-2-AP-TR operate from the monitored bus voltage?

Yes, EMC1704-2-AP-TR supports bus-powered operation across its full 3V–24V input range, as confirmed in Section 4.2 ("VDD Biasing Options") of DS20005239A. When VDD is tied to the monitored bus, the device draws supply current directly-eliminating need for auxiliary LDOs in simple implementations. Internal regulation maintains stable core voltage regardless of bus fluctuations.

What is the function of the THERM pin on EMC1704-2-AP-TR?

The THERM pin on EMC1704-2-AP-TR is a dedicated, non-maskable open-drain output that asserts low during critical overtemperature, overvoltage, or overcurrent events-bypassing software-configurable limits. As defined in Section 4.5, it provides hardware-level safety interlock capability, enabling immediate system shutdown or power-gating without MCU involvement, which is essential for protecting CPUs, FPGAs, and power stages from thermal runaway.

EMC1704-2-AP-TR Specifications

Product attributes
Attribute value
Manufacturer:
Microchip Technology
Series:
-
Package/Case:
16-VQFN Exposed Pad
Packaging:
Tape & Reel (TR)
Product Status:
Active
Applications:
Current Sense, Temperature Monitor
Current - Supply:
1.1mA
Voltage - Supply:
3V ~ 24V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
16-QFN (4x4)

EMC1704-2-AP-TR FAQ

1.How can I place an order for EMC1704-2-AP-TR through Aetrix?

Please submit a Request for Quotation (RFQ) for EMC1704-2-AP-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for EMC1704-2-AP-TR reliable?

The price and inventory of EMC1704-2-AP-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for EMC1704-2-AP-TR is usually 5 days.

3.What payment methods are accepted for EMC1704-2-AP-TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for EMC1704-2-AP-TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for EMC1704-2-AP-TR?

EMC1704-2-AP-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your EMC1704-2-AP-TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for EMC1704-2-AP-TR?

For technical support, including EMC1704-2-AP-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your EMC1704-2-AP-TR requirements.

6.How does Aetrix verify that EMC1704-2-AP-TR is sourced from the original manufacturer or authorized distributors?

All EMC1704-2-AP-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that EMC1704-2-AP-TR meets industry standards.

7.What is the process for return or replacement of EMC1704-2-AP-TR?

All EMC1704-2-AP-TR units undergo pre-shipment inspection (PSI). If there is an issue with EMC1704-2-AP-TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The EMC1704-2-AP-TR part is unused and in its original packaging.

Return procedure for EMC1704-2-AP-TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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