Taiwan Semiconductor Corporation ES1D R3G
- Part No.:
- ES1D R3G
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- DO-214AC, SMA
- Datasheet:
-
ES1D R3G.pdf
- Description:
- DIODE GEN PURP 200V 1A DO214AC
- Quantity:
- Payment:

- Shipping:

Inventory:2
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ES1D R3G from Taiwan Semiconductor is a 1 A, 200 V super fast recovery surface-mount rectifier diode in DO-214AC (SMA) package, featuring 35 ns reverse recovery time, 0.95 V forward voltage at 1 A, and 30 A peak surge current - used for freewheeling and snubber circuits in DC-DC converters.
For engineers reviewing the ES1D R3G datasheet, ES1D R3G pinout, ES1D R3G application, or ES1D R3G equivalent, key selection criteria include VRRM = 200 V, IF = 1 A, trr = 35 ns, thermal resistance RθJA = 85 °C/W, and DO-214AC mechanical compatibility with automated SMT placement.
Technical Context
This single-die, unidirectional silicon rectifier uses glass-passivated junction technology to achieve stable high-speed switching performance across -55°C to +150°C operating range. Its low Qrr and fast trr minimize switching losses in high-frequency power conversion topologies.
The device operates with cathode-band polarity indication, matte tin-plated leads compliant with J-STD-002 solderability, and meets JESD201 Class 2 whisker resistance and UL 94V-0 flammability standards for reliability in industrial-grade PCB assemblies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 200 V - maximum repetitive reverse voltage before breakdown; sets safe operating limit in 200 V-rated DC-DC output stages |
| IF | 1 A continuous - average forward current rating defining steady-state conduction capability in freewheeling paths |
| trr | 35 ns - reverse recovery time measured at IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A; enables >1 MHz switching in SMPS |
| VF | 0.95 V @ 1 A, 25°C - forward voltage drop directly impacts conduction loss and thermal rise in compact layouts |
| RθJA | 85 °C/W - junction-to-ambient thermal resistance under standard JEDEC test board conditions; guides heatsinking requirements |
| IFSM | 30 A @ 8.3 ms - non-repetitive surge rating supporting transient overload tolerance during startup or fault events |
| CJ | 16 pF @ 1 MHz, 4 V - junction capacitance affecting high-frequency noise coupling and EMI filter design |
Pinout & Package
Package: DO-214AC (SMA), surface-mount, single-anode/single-cathode configuration with cathode band marking. Weight: 0.060 g.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry point | Connected to lower-potential node (e.g., switch node in buck converter); must handle full IF and IFSM |
| Cathode | Forward current exit point | Marked by band; connects to higher-potential rail (e.g., output capacitor positive); defines polarity-sensitive placement |
Key Features
| Feature | Design Value |
|---|---|
| Glass-passivated junction | Enables stable leakage current (<5 µA @ 25°C) and long-term reliability under humidity and thermal cycling |
| Super fast recovery (35 ns) | Reduces switching loss and EMI generation compared to standard rectifiers in 300–1000 kHz converters |
| Moisture sensitivity level 1 | Eliminates bake requirement prior to reflow; supports direct use in J-STD-020-compliant SMT lines |
| Halogen-free & RoHS compliant | Meets IEC 61249-2-21 and EU RoHS directives for environmentally regulated industrial and consumer end equipment |
| DO-214AC (SMA) package | Standardized footprint compatible with automated pick-and-place and reflow profiles; supports high-density board layouts |
Applications
| DC-DC Converter Output Rectification | Snubber Network Clamping |
|---|---|
Use Scenario: Used as secondary-side rectifier in isolated flyback or forward converters delivering 5–24 V at up to 1 A. IC Role / Device Role / Timing Role: Unidirectional current valve converting transformer AC output to regulated DC; timing role defined by trr-driven switching node ringing suppression. Use Value: 0.95 V VF minimizes conduction loss; 35 ns trr reduces voltage overshoot and improves efficiency above 300 kHz. | Use Scenario: Placed across MOSFET drain-source or transformer primary to absorb inductive energy spikes. IC Role / Device Role / Timing Role: Clamp diode conducting only during voltage transients; fast trr ensures rapid turn-off after spike decay. Use Value: Low CJ (16 pF) avoids slowing snubber RC time constant; 30 A IFSM withstands repeated surge events. |
| Freewheeling Path in Buck Regulators | Lighting Driver Flyback Secondary |
Use Scenario: Completes current path when high-side switch turns off in step-down regulators powering microcontrollers or sensors. IC Role / Device Role / Timing Role: Freewheeling diode maintaining continuous inductor current; trr directly affects minimum on-time and light-load stability. Use Value: 35 ns trr prevents reverse recovery current from interfering with next switching cycle, enabling stable operation down to 5% duty cycle. | Use Scenario: Rectifies high-voltage, low-current output in LED driver flyback transformers (e.g., 200 V, 150 mA). IC Role / Device Role / Timing Role: High-VRRM rectifier handling repetitive 200 V reverse bias while conducting pulsed forward current. Use Value: 200 V VRRM provides 2× safety margin over typical 100 V reflected output; glass passivation ensures long life under thermal stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar super fast rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STTH1R02U (STMicroelectronics) | VRRM = 200 V, trr = 30 ns, VF = 0.92 V @ 1 A - slightly faster and lower VF, but DO-214AA (SMB) package | Same VRRM/IF class; requires PCB pad revision due to larger SMB footprint and different thermal profile | Select if tighter trr and lower VF justify layout change and qualification effort |
| SB120 (ON Semiconductor) | VRRM = 200 V, trr = 50 ns, VF = 0.97 V @ 1 A - slower recovery, same DO-214AC package | Compatible footprint and assembly process; acceptable where <50 ns trr suffices and cost is prioritized | Choose for drop-in replacement where 35 ns is not critical and supply chain diversification is needed |
Compared with STTH1R02U and SB120, ES1D R3G offers balanced performance: faster than SB120 (35 vs. 50 ns) with identical DO-214AC fit, yet more cost-effective than STTH1R02U despite slightly higher VF and trr.
Availability
ES1D R3G is available at Aetrix Electronics and suitable for DC-DC converters, snubber networks, freewheeling paths, and lighting drivers requiring stable component supply with full traceability and volume scalability.
Supply support for ES1D R3G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.
The ES1x series was designed specifically for high-efficiency, high-frequency power conversion systems where fast recovery, low forward drop, and robust thermal performance are essential - targeting cost-sensitive yet reliability-driven applications.
FAQ
What is the maximum junction temperature rating for ES1D R3G?
The ES1D R3G has a maximum junction temperature (TJ) of +150°C, with an operational range from -55°C to +150°C. This rating allows reliable use in enclosed industrial power supplies and automotive under-hood auxiliary converters where ambient temperatures exceed 85°C. The device's RθJA of 85 °C/W must be considered alongside PCB copper area and airflow to ensure TJ remains within limit under full IF load.
Does ES1D R3G support lead-free reflow soldering?
Yes, ES1D R3G supports lead-free reflow soldering per J-STD-002. Its matte tin-plated leads are fully compatible with standard Pb-free reflow profiles (peak 260°C), and its moisture sensitivity level is rated at Level 1 per J-STD-020 - meaning no pre-bake is required before assembly. The DO-214AC package body meets UL 94V-0 flammability requirements, ensuring process robustness.
What is the reverse leakage current specification for ES1D R3G at elevated temperature?
At TJ = 125°C and rated VR, ES1D R3G exhibits a maximum reverse leakage current (IR) of 100 µA. At 25°C, it is limited to 5 µA. This low leakage supports stable operation in high-impedance snubber or hold-up circuits where minimal standby power loss is critical, especially in energy-efficient lighting and IoT power modules.
Is ES1D R3G pin-compatible with other devices in the ES1x family?
Yes, all ES1x devices including ES1D R3G share identical DO-214AC (SMA) package dimensions, pinout, and polarity marking (cathode band). They differ only in VRRM (50–600 V) and related parameters like VF and CJ. This allows direct substitution within the same voltage class without PCB changes - for example, ES1D R3G can replace ES1C or ES1F only if system-level VRRM and trr requirements align.
How does the 35 ns reverse recovery time of ES1D R3G impact EMI in switching power supplies?
The 35 ns trr of ES1D R3G reduces high-frequency ringing amplitude at the switch node by minimizing reverse recovery charge (Qrr). In buck or flyback converters operating above 300 kHz, this directly lowers broadband EMI emissions - particularly in the 30–100 MHz range - easing compliance with CISPR-22/32 Class B limits. Faster recovery also decreases associated gate-drive losses in synchronous rectifier control schemes.
ES1D R3G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- DO-214AC, SMA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 200 V
- Current - Average Rectified (Io):
- 1A
- Voltage - Forward (Vf) (Max) @ If:
- 950 mV @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 35 ns
- Current - Reverse Leakage @ Vr:
- 5 µA @ 200 V
- Capacitance @ Vr, F:
- 16pF @ 4V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AC (SMA)
- Operating Temperature - Junction:
- -55°C ~ 150°C
ES1D R3G FAQ
1.How can I place an order for ES1D R3G through Aetrix?
Please submit a Request for Quotation (RFQ) for ES1D R3G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ES1D R3G reliable?
The price and inventory of ES1D R3G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ES1D R3G is usually 5 days.
3.What payment methods are accepted for ES1D R3G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ES1D R3G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ES1D R3G?
ES1D R3G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ES1D R3G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ES1D R3G?
For technical support, including ES1D R3G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ES1D R3G requirements.
6.How does Aetrix verify that ES1D R3G is sourced from the original manufacturer or authorized distributors?
All ES1D R3G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ES1D R3G meets industry standards.
7.What is the process for return or replacement of ES1D R3G?
All ES1D R3G units undergo pre-shipment inspection (PSI). If there is an issue with ES1D R3G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ES1D R3G part is unused and in its original packaging.
Return procedure for ES1D R3G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ES1D R3G Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
