My Inquiry
My Account
Taiwan Semiconductor Corporation ES1GHR3G
- Part No.:
- ES1GHR3G
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- DO-214AC, SMA
- Datasheet:
-
ES1GHR3G.pdf
- Description:
- DIODE GEN PURP 400V 1A DO214AC
- Quantity:
- Payment:
- Shipping:
Inventory:2,035
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ES1GHR3G from Taiwan Semiconductor is a 1 A, 400 V super fast recovery surface-mount rectifier diode in DO-214AC (SMA) package, featuring 35 ns reverse recovery time, 1.30 V max forward voltage at 1 A and 25°C, and 5 µA max reverse leakage at rated VR and 25°C, used in DC-DC converters and snubber circuits.
For engineers reviewing the ES1GHR3G datasheet, ES1GHR3G pinout, ES1GHR3G application, or ES1GHR3G equivalent, key selection criteria include peak repetitive reverse voltage (400 V), forward surge current capability (30 A), junction-to-lead thermal resistance (35 °C/W), moisture sensitivity level (J-STD-020 Level 1), and RoHS/halogen-free compliance.
Technical Context
This single-die, unidirectional silicon rectifier uses glass passivated junction technology to achieve stable performance under high-frequency switching conditions. Its super fast recovery (trr ≤ 35 ns) minimizes switching losses in high-efficiency power topologies.
The device operates across -55°C to +150°C junction temperature range with 85 °C/W junction-to-ambient thermal resistance. Cathode polarity is marked by a visible band on the DO-214AC molded case, and terminals are matte tin-plated for reliable solderability per J-STD-002.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 400 V - Maximum repetitive reverse voltage the diode blocks without breakdown; defines usable input voltage headroom in flyback or buck-derived topologies. |
| IF | 1 A - Continuous average forward current rating; determines steady-state conduction capability in low-power SMPS outputs. |
| trr | 35 ns - Measured at IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A; enables operation up to ~3–5 MHz switching frequencies with minimal recovery loss. |
| VF (max) | 1.30 V @ 1 A, 25°C - Forward voltage drop directly impacts conduction loss and thermal rise in compact layouts. |
| RθJL | 35 °C/W - Junction-to-lead thermal resistance; supports direct PCB copper pad heat sinking for improved power handling without heatsinks. |
| IR (max) | 5 µA @ VR = 400 V, 25°C - Low leakage ensures minimal standby power loss in energy-sensitive applications like IoT power supplies. |
Pinout & Package
Package: DO-214AC (SMA), surface-mount, single-anode/single-cathode configuration. Cathode indicated by molded band. Matte tin-plated leads, UL 94V-0 molding compound, 0.060 g typical weight.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode (unmarked end) | Forward current entry point | Connected to lower-potential node (e.g., switch node in boost, ground return in freewheeling path). |
| Cathode (banded end) | Forward current exit / reverse blocking terminal | Connected to higher-potential output rail; polarity marking prevents reverse installation in automated assembly. |
Key Features
| Feature | Design Value |
|---|---|
| Glass passivated junction | Ensures long-term reliability and stable electrical parameters under humidity and thermal cycling stress. |
| Super fast recovery (≤35 ns) | Reduces switching loss and EMI generation in high-frequency DC-DC converters operating above 100 kHz. |
| J-STD-020 Level 1 moisture sensitivity | Enables standard SMT reflow without dry-pack or baking requirements, lowering manufacturing cost and complexity. |
| RoHS and halogen-free compliance | Fulfills IEC 61249-2-21 and environmental regulations for consumer, industrial, and automotive-grade end equipment. |
Applications
| DC-DC Converter | Snubber Circuit |
|---|---|
Use Scenario: Secondary-side rectification in isolated 5–24 V output flyback or forward converters delivering up to 12 W. IC Role / Device Role / Timing Role: Unidirectional current steering and AC-to-DC conversion at switching node; replaces slower general-purpose rectifiers to reduce loss. Use Value: 35 ns trr and 1.30 V VF minimize conduction and recovery losses, improving efficiency by 1.2–1.8% over standard FR107 equivalents. | Use Scenario: Voltage spike suppression across MOSFET drains in PWM motor drivers or SMPS primary switches. IC Role / Device Role / Timing Role: Fast clamping diode that conducts transient energy into RC network before voltage exceeds safe threshold. Use Value: Sub-40 ns recovery ensures rapid turn-on during nanosecond-scale transients, preventing MOSFET avalanche failure. |
| Lighting Application | Freewheeling Diode |
Use Scenario: Output rectification in LED driver IC-based constant-current supplies for commercial downlights and street lighting. IC Role / Device Role / Timing Role: High-reliability output rectifier sustaining continuous 1 A load with minimal thermal derating at 85°C ambient. Use Value: 150°C TJ max and 35 °C/W RθJL allow full 1 A rating at 75°C board temperature without forced air. | Use Scenario: Inductive kickback path in solenoid, relay, or stepper motor coil drivers. IC Role / Device Role / Timing Role: Provides low-impedance recirculation path for stored magnetic energy when drive signal turns off. Use Value: 30 A IFSM withstands repeated 10–20 ms surges common in 24 V industrial actuators without degradation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar super fast rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor MUR140 | Same 400 V VRRM, but 50 ns trr and 1.3 V VF; DO-41 through-hole package. | Requires PCB through-hole layout; unsuitable for fully SMT designs. | Select when legacy through-hole assembly is mandated and 15 ns slower recovery is acceptable. |
| Vishay VS-ES1GHE3/5BT | Identical DO-214AC package, 400 V, 35 ns trr, but 1.25 V VF (typ) and 10 µA IR (25°C); halogen-free, RoHS compliant. | Same footprint and function; minor VF/IR trade-off favors lower conduction loss at cost of slightly higher leakage. | Prefer for new designs where <1.25 V VF improves light-load efficiency in battery-powered systems. |
Compared with MUR140 and VS-ES1GHE3/5BT, ES1GHR3G offers optimal balance of ultra-fast recovery, SMT compatibility, and industry-standard thermal performance-making it ideal for space-constrained, high-frequency power supply designs requiring J-STD-020 Level 1 handling.
Availability
ES1GHR3G is available at Aetrix Electronics and suitable for DC-DC converters, snubber networks, LED lighting drivers, and freewheeling paths requiring stable component supply, consistent parametric performance, and full RoHS/halogen-free compliance.
Supply support for ES1GHR3G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.
The ES1x series was designed specifically for high-efficiency, high-frequency switching power supplies requiring robust super fast rectification in compact SMT packages-emphasizing reliability, thermal performance, and automated assembly readiness.
FAQ
What is the maximum junction temperature rating for ES1GHR3G?
The ES1GHR3G has a maximum junction temperature (TJ max) of +150°C, enabling reliable operation in thermally demanding environments such as enclosed LED drivers or industrial power modules. This rating is maintained across its full operating current range and supports derating curves defined in the official TSC datasheet. Thermal design should reference the 35 °C/W junction-to-lead resistance to estimate temperature rise under actual PCB copper area conditions. The ES1GHR3G must not exceed this limit during continuous or pulsed operation.
Does ES1GHR3G meet J-STD-020 moisture sensitivity requirements?
Yes, ES1GHR3G is rated at Moisture Sensitivity Level 1 per J-STD-020, meaning it can be exposed indefinitely to floor life conditions (≤30°C/85% RH) without baking prior to reflow. This eliminates dry-pack requirements and simplifies SMT line integration. The qualification is verified per TSC's internal reliability testing and documented in the ES1A–ES1J datasheet revision O2112. No special handling or storage controls are needed for ES1GHR3G beyond standard ESD-safe practices.
What is the reverse recovery time (trr) specification for ES1GHR3G?
The ES1GHR3G has a maximum reverse recovery time (trr) of 35 ns, measured under standardized conditions: IF = 0.5 A, IR = 1.0 A, and Irr = 0.25 A. This value is confirmed in the Electrical Specifications table of the TSC ES1A–ES1J datasheet. The 35 ns trr enables efficient operation in switching power supplies operating up to 500 kHz, reducing switching losses and associated EMI compared to standard fast recovery diodes. The ES1GHR3G maintains this performance across its rated temperature range.
Is ES1GHR3G RoHS and halogen-free compliant?
Yes, ES1GHR3G is fully RoHS compliant and halogen-free per IEC 61249-2-21. This compliance is explicitly stated in the Features section of the official TSC ES1A–ES1J datasheet (O2112). The molding compound, lead finish, and internal construction contain no restricted substances above threshold limits, making ES1GHR3G suitable for export to EU, China, Korea, and other regulated markets. Compliance documentation is available upon request from Aetrix Electronics for full BOM traceability.
What package type does ES1GHR3G use, and what are its mechanical identifiers?
ES1GHR3G uses the DO-214AC (SMA) surface-mount package, with cathode polarity indicated by a visible molded band on the body. Dimensions conform to JEDEC outline MO-136AA. The device weighs approximately 0.060 g, features UL 94V-0 flammability-rated epoxy, and uses matte tin-plated leads qualified per J-STD-002 for solderability. The marking "ES1G" appears on the banded side, confirming the 400 V variant within the ES1x family. No alternate packages exist for ES1GHR3G.
ES1GHR3G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- DO-214AC, SMA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 400 V
- Current - Average Rectified (Io):
- 1A
- Voltage - Forward (Vf) (Max) @ If:
- 1.3 V @ 1 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 35 ns
- Current - Reverse Leakage @ Vr:
- 5 µA @ 400 V
- Capacitance @ Vr, F:
- 16pF @ 4V, 1MHz
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AC (SMA)
- Operating Temperature - Junction:
- -55°C ~ 150°C
ES1GHR3G FAQ
1.How can I place an order for ES1GHR3G through Aetrix?
Please submit a Request for Quotation (RFQ) for ES1GHR3G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ES1GHR3G reliable?
The price and inventory of ES1GHR3G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ES1GHR3G is usually 5 days.
3.What payment methods are accepted for ES1GHR3G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ES1GHR3G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ES1GHR3G?
ES1GHR3G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ES1GHR3G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ES1GHR3G?
For technical support, including ES1GHR3G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ES1GHR3G requirements.
6.How does Aetrix verify that ES1GHR3G is sourced from the original manufacturer or authorized distributors?
All ES1GHR3G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ES1GHR3G meets industry standards.
7.What is the process for return or replacement of ES1GHR3G?
All ES1GHR3G units undergo pre-shipment inspection (PSI). If there is an issue with ES1GHR3G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ES1GHR3G part is unused and in its original packaging.
Return procedure for ES1GHR3G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ES1GHR3G Tags
-
1N4448X-TP
Micro Commercial Co
-
1N4148WX-TP
Micro Commercial Co
-
1N4148TR
onsemi
-
MMSD4148T1G
onsemi
-
MMBD914LT3G
onsemi
-
BAS16HT1G
onsemi
-
1N914BWT
onsemi
-
BAS21LT1G
onsemi
-
LL4148
onsemi
-
BAS16LT1G
onsemi
-
MMSD914T1G
onsemi
-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
