Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Diodes > Rectifiers > Single Diodes

Taiwan Semiconductor Corporation ES2D

Name: ES2D
Brand: Taiwan Semiconductor Corporation
SKU: ES2D
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: ES2D

Manufacturer:: Taiwan Semiconductor Corporation

Category:: Single Diodes

Package:: DO-214AA, SMB

Datasheet:: ES2D.pdf

Description:: DIODE GEN PURP 200V 2A DO214AA

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:4,740

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

ES2D from Taiwan Semiconductor is a 2 A, 200 V super fast recovery surface-mount rectifier in DO-214AA (SMB) package, featuring 35 ns reverse recovery time, 0.95 V forward voltage at 2 A, and 10 µA reverse leakage at 25°C, used in DC-DC converters and snubber circuits.

For engineers reviewing the ES2D datasheet, ES2D pinout, ES2D application, or ES2D equivalent, key selection criteria include repetitive peak reverse voltage (200 V), thermal resistance (R_θJL = 20 °C/W), junction temperature range (–55 to +150 °C), and RoHS/halogen-free compliance for industrial power conversion designs.

Technical Context

The ES2D operates as a single-die, unidirectional silicon rectifier with glass-passivated junction for enhanced reliability and moisture resistance (J-STD-020 Level 1). Its super fast recovery enables high-frequency switching in SMPS topologies without excessive switching loss.

Designed for automated SMT assembly, the DO-214AA (SMB) package supports reflow soldering per J-STD-002, with matte tin-plated leads and UL 94V-0 molding compound. Polarity is marked by cathode band; weight is 0.090 g.

Key Specifications

Parameter	Value and Actual Design Meaning
V_RRM	200 V - Maximum repetitive reverse blocking voltage; defines safe operating limit in flyback or boost converter output stages
I_F	2 A - Continuous average forward current; determines thermal sizing of PCB copper and heatsinking in 100 kHz+ DC-DC designs
t_rr	35 ns - Reverse recovery time; enables efficient operation up to ~500 kHz with minimal switching loss and EMI generation
V_F	0.95 V @ 2 A, 25°C - Forward voltage drop; directly impacts conduction loss and thermal rise in high-duty-cycle freewheeling paths
R_θJL	20 °C/W - Junction-to-lead thermal resistance; enables direct thermal coupling to copper pour or metal-core PCB for passive cooling
I_FSM	50 A @ 8.3 ms - Non-repetitive surge rating; withstands inrush and transient overloads in lighting ballasts and motor drives
C_J	25 pF @ 1 MHz, 4 V - Junction capacitance; influences high-frequency noise coupling and snubber design in resonant converters

Pinout & Package

DO-214AA (SMB) surface-mount package: cathode-indicated band on body; anode and cathode terminals only; no internal connections beyond diode junction.

Pin/Terminal	Circuit Role	Design Meaning
Anode	Forward current entry	Connected to lower-potential node (e.g., switch node in buck converter); requires adequate trace width for 2 A continuous
Cathode	Forward current exit / reverse blocking terminal	Connected to output rail or snubber network; polarity marking critical for correct orientation during automated placement

Key Features

Feature	Design Value
Glass passivated junction	Enables stable long-term performance under humid conditions and prevents junction corrosion in industrial environments
Super fast recovery (35 ns)	Reduces reverse recovery charge (Q_rr) and associated switching losses in high-frequency SMPS above 200 kHz
Moisture sensitivity level 1	Eliminates bake requirement before reflow; compatible with standard SMT lines without dry-pack handling
Halogen-free (IEC 61249-2-21)	Meets environmental compliance for automotive and EU industrial equipment without compromising flame retardancy (UL 94V-0)
Low profile SMB package	Height ≤ 2.6 mm enables compact layout in space-constrained LED drivers and AC-DC adapters

Applications

DC-DC Converter	Snubber Circuit
Use Scenario: Secondary-side rectification in isolated 12 V/2 A flyback converter powering industrial I/O modules. IC Role / Device Role / Timing Role: Unidirectional power conversion element conducting during transformer reset phase; replaces slower 1N5822 to reduce switching loss. Use Value: 35 ns t_rr cuts reverse recovery loss by >40% vs. standard fast rectifiers, improving efficiency from 82% to 85.3% at full load.	Use Scenario: RCD clamp across MOSFET drain-source in 65 kHz PFC boost stage. IC Role / Device Role / Timing Role: Fast recovery diode capturing energy from leakage inductance; must turn off rapidly before next switching cycle. Use Value: 25 pF C_J and 35 ns t_rr minimize voltage overshoot and ringing, reducing stress on 600 V MOSFET.
Lighting Application	Freewheeling Application
Use Scenario: Output rectifier in constant-current LED driver for streetlight luminaires (input 90–305 VAC). IC Role / Device Role / Timing Role: High-reliability rectifier handling 2 A continuous output with thermal cycling from ambient –40°C to +85°C. Use Value: 150°C T_JMAX and J-STD-020 Level 1 allow uninterrupted operation in sealed outdoor enclosures without derating.	Use Scenario: Freewheeling path across solenoid coil in programmable logic controller (PLC) output module. IC Role / Device Role / Timing Role: Provides low-loss current recirculation path when 24 V DC coil is de-energized; suppresses inductive kick. Use Value: 0.95 V V_F limits power dissipation to <1.9 W during 2 A freewheeling, avoiding thermal shutdown in dense PCB layouts.

DC-DC Converter

Snubber Circuit

Use Scenario: Secondary-side rectification in isolated 12 V/2 A flyback converter powering industrial I/O modules.

IC Role / Device Role / Timing Role: Unidirectional power conversion element conducting during transformer reset phase; replaces slower 1N5822 to reduce switching loss.

Use Value: 35 ns t_rr cuts reverse recovery loss by >40% vs. standard fast rectifiers, improving efficiency from 82% to 85.3% at full load.

Use Scenario: RCD clamp across MOSFET drain-source in 65 kHz PFC boost stage.

IC Role / Device Role / Timing Role: Fast recovery diode capturing energy from leakage inductance; must turn off rapidly before next switching cycle.

Use Value: 25 pF C_J and 35 ns t_rr minimize voltage overshoot and ringing, reducing stress on 600 V MOSFET.

Lighting Application

Freewheeling Application

Use Scenario: Output rectifier in constant-current LED driver for streetlight luminaires (input 90–305 VAC).

IC Role / Device Role / Timing Role: High-reliability rectifier handling 2 A continuous output with thermal cycling from ambient –40°C to +85°C.

Use Value: 150°C T_JMAX and J-STD-020 Level 1 allow uninterrupted operation in sealed outdoor enclosures without derating.

Use Scenario: Freewheeling path across solenoid coil in programmable logic controller (PLC) output module.

IC Role / Device Role / Timing Role: Provides low-loss current recirculation path when 24 V DC coil is de-energized; suppresses inductive kick.

Use Value: 0.95 V V_F limits power dissipation to <1.9 W during 2 A freewheeling, avoiding thermal shutdown in dense PCB layouts.

Equivalent & Alternatives

The following parts are listed as comparable options for similar super fast rectifier applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
Vishay VS-ES2D02-M3/5BT	Same V_RRM (200 V), identical DO-214AA package, but t_rr = 30 ns (5 ns faster); V_F = 0.92 V @ 2 A	Slightly lower conduction and switching loss; suitable where <5 ns t_rr reduction justifies cost premium	Preferred for high-efficiency 500 kHz+ resonant LLC designs requiring minimal Q_rr
ON Semiconductor MUR220RLG	V_RRM = 200 V, same I_F, but DO-41 through-hole package; t_rr = 35 ns, V_F = 0.97 V	Requires manual or wave-solder assembly; unsuitable for fully automated SMT production	Select only for legacy through-hole designs or prototyping where rework flexibility outweighs SMT efficiency

Compared with VS-ES2D02-M3/5BT and MUR220RLG, the ES2D delivers optimal balance of SMT compatibility, thermal performance (R_θJL = 20 °C/W), and cost for volume-manufactured industrial DC-DC and lighting systems.

Availability

ES2D is available at Aetrix Electronics and suitable for DC-DC converters, snubber circuits, and lighting applications requiring stable component supply, consistent parametric performance, and full RoHS/halogen-free compliance.

Supply support for ES2D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.

The ES2D belongs to TSC's ES2x super fast rectifier family, engineered specifically for high-frequency, high-reliability power conversion in space- and thermally-constrained SMT applications.

FAQ

What is the maximum junction temperature rating for the ES2D?

The ES2D has a maximum junction temperature (T_JMAX) of +150°C, verified per absolute maximum ratings table in TSC's L2102 datasheet. This allows reliable operation in enclosed industrial environments where ambient temperatures reach +85°C and power dissipation generates additional thermal rise. The ES2D must be mounted on sufficient copper area to maintain T_J ≤ 150°C under worst-case I_F = 2 A conditions.

Does the ES2D meet RoHS and halogen-free requirements?

Yes, the ES2D is RoHS compliant and halogen-free per IEC 61249-2-21, as confirmed in the "Features" section of TSC's official ES2A–ES2J datasheet (Version L2102). The molding compound is UL 94V-0 rated, and terminals are matte tin plated-fully compatible with lead-free reflow processes and environmentally regulated end equipment.

What is the reverse recovery time (t_rr) of the ES2D and how is it measured?

The ES2D has a reverse recovery time (t_rr) of 35 ns, measured under conditions of I_F = 0.5 A, I_R = 1.0 A, and I_rr = 0.25 A, as specified in TSC's electrical characteristics table. This value is typical and guaranteed maximum; it reflects the diode's ability to transition from conduction to blocking state, directly impacting switching loss in high-frequency converters using the ES2D.

Can the ES2D replace the ES2C in an existing design?

Yes, the ES2D can replace the ES2C in most cases because both share identical package (DO-214AA), forward current (2 A), thermal specs, and pinout-but the ES2D has higher V_RRM (200 V vs. 150 V) and slightly lower V_F (0.95 V vs. 0.96 V). Review system-level reverse voltage stress to confirm 200 V margin is appropriate; no PCB or layout changes are needed for the ES2D substitution.

What is the junction-to-lead thermal resistance (R_θJL) of the ES2D and why does it matter?

The ES2D has a junction-to-lead thermal resistance (R_θJL) of 20 °C/W, enabling efficient heat transfer from die to PCB copper via the cathode/anode leads. This parameter matters because it directly determines achievable power dissipation without exceeding T_JMAX; for example, at 2 A and 0.95 V V_F, the ES2D dissipates ~1.9 W, requiring ≤38°C temperature rise from lead to junction-achievable with ≥1 cm² of 2-oz copper connected to both terminals.

ES2D Specifications

Product attributes: Attribute value

Manufacturer:: Taiwan Semiconductor Corporation

Series:: -

Package/Case:: DO-214AA, SMB

Packaging:: Tape & Reel (TR)

Product Status:: Active

Technology:: Standard

Voltage - DC Reverse (Vr) (Max):: 200 V

Current - Average Rectified (Io):: 2A

Voltage - Forward (Vf) (Max) @ If:: 950 mV @ 2 A

Speed:: Fast Recovery =< 500ns, > 200mA (Io)

Reverse Recovery Time (trr):: 35 ns

Current - Reverse Leakage @ Vr:: 10 µA @ 200 V

Capacitance @ Vr, F:: 25pF @ 4V, 1MHz

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: DO-214AA (SMB)

Operating Temperature - Junction:: -55°C ~ 150°C

ES2D FAQ

1.How can I place an order for ES2D through Aetrix?

Please submit a Request for Quotation (RFQ) for ES2D on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ES2D reliable?

The price and inventory of ES2D are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ES2D is usually 5 days.

3.What payment methods are accepted for ES2D?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ES2D transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ES2D?

ES2D orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ES2D order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ES2D?

For technical support, including ES2D datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ES2D requirements.

6.How does Aetrix verify that ES2D is sourced from the original manufacturer or authorized distributors?

All ES2D products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ES2D meets industry standards.

7.What is the process for return or replacement of ES2D?

All ES2D units undergo pre-shipment inspection (PSI). If there is an issue with ES2D, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ES2D part is unused and in its original packaging.

Return procedure for ES2D:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-09 Counterfeit Electronic Components: How to Detect, Authenticate, and Test Suspect Parts

Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…