My Inquiry
My Account
Taiwan Semiconductor Corporation ES2DA R3G
- Part No.:
- ES2DA R3G
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- DO-214AC, SMA
- Datasheet:
-
ES2DA R3G.pdf
- Description:
- DIODE GEN PURP 200V 2A DO214AC
- Quantity:
- Payment:
- Shipping:
Inventory:1,089
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ES2DA R3G from Taiwan Semiconductor is a 2A, 200V super fast recovery surface-mount rectifier in DO-214AC (SMA) package, featuring 35ns reverse recovery time, 0.95V forward voltage at 2A/25°C, and 50A peak surge current - deployed in DC-DC converters and snubber circuits.
For engineers reviewing the ES2DA R3G datasheet, ES2DA R3G pinout, ES2DA R3G application, or ES2DA R3G equivalent, key selection criteria include VRRM = 200V, IF = 2A, trr = 35ns, thermal resistance RθJA = 75°C/W, and DO-214AC mechanical compatibility with automated SMT assembly.
Technical Context
This single-die, unidirectional silicon rectifier uses glass-passivated junction technology to achieve stable reverse leakage (<10µA @ 25°C, <350µA @ 125°C) and low forward conduction loss. Its super-fast recovery enables high-frequency switching operation up to several hundred kHz.
The device operates across -55°C to +150°C junction temperature range, with junction-to-lead thermal resistance of 20°C/W and moisture sensitivity level 1 per J-STD-020 - supporting reflow-compatible manufacturing without baking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 200 V - maximum repetitive reverse voltage before breakdown; defines safe operating limit in flyback or clamp circuits |
| IF | 2 A - continuous average forward current; determines heatsink requirements in 100% duty-cycle applications |
| trr | 35 ns - reverse recovery time at IF=0.5A, IR=1.0A, Irr=0.25A; enables high-efficiency operation in >100kHz SMPS |
| VF | 0.95 V @ 2A, 25°C - forward voltage drop; directly impacts conduction loss and thermal rise in power stage |
| IFSM | 50 A - non-repetitive peak surge current (8.3ms half-sine); supports inrush and fault-current handling |
| RθJA | 75 °C/W - junction-to-ambient thermal resistance; used to calculate temperature rise on standard FR-4 PCB with minimal copper |
Pinout & Package
Package: DO-214AC (SMA), molded epoxy case meeting UL 94V-0, matte tin-plated leads, cathode indicated by band.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry point | Connected to lower-potential node (e.g., switch node in buck converter or transformer secondary) |
| Cathode | Forward current exit / reverse blocking terminal | Connected to output rail or clamp node; polarity marked by visible band on package body |
Key Features
| Feature | Design Value |
|---|---|
| Glass-passivated junction | Enhances long-term reliability under humidity and thermal cycling; eliminates need for conformal coating in industrial environments |
| Super-fast 35ns recovery | Reduces switching losses and EMI generation in high-frequency DC-DC topologies such as active clamp forward or LLC resonant converters |
| DO-214AC (SMA) package | Enables automated pick-and-place placement and reflow soldering; compatible with IPC-7351B footprint standards |
| Moisture sensitivity level 1 | Allows unlimited floor life before reflow; eliminates pre-bake requirement and reduces production overhead |
Applications
| DC-DC Converter | Snubber Circuit |
|---|---|
Use Scenario: Secondary-side rectification in isolated 48V-to-12V synchronous or diode-based buck-derived converters. IC Role / Device Role / Timing Role: Unidirectional power conversion element conducting during positive half-cycle; blocks reverse voltage during off-time. Use Value: 0.95V VF minimizes conduction loss; 35ns trr suppresses voltage overshoot and ringing during turn-off. | Use Scenario: Voltage clamping across MOSFET drain-source in flyback or forward converters. IC Role / Device Role / Timing Role: Fast-turn-on freewheeling path that absorbs inductive energy during switch turn-off. Use Value: Low VF and rapid recovery reduce clamping loss and improve system efficiency over slower rectifiers. |
| Lighting Application | Freewheeling Diode |
Use Scenario: Output rectification in LED driver ICs with integrated high-side switch (e.g., constant-current buck drivers). IC Role / Device Role / Timing Role: Provides continuous current path for LED string during switch off-phase. Use Value: 2A rating supports common mid-power LED loads; DO-214AC footprint fits compact driver PCB layouts. | Use Scenario: Inductive load protection in relay drivers, solenoid controls, and motor gate-drive circuits. IC Role / Device Role / Timing Role: Provides low-impedance return path for stored magnetic energy when drive signal is removed. Use Value: 50A IFSM withstands repeated inductive kick events; 200V VRRM covers typical 24–48V industrial bus transients. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar super-fast rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor MUR220G | VRRM = 200V, trr = 35ns, VF = 0.93V @ 2A - nearly identical electrical specs; DO-214AC package | No functional deviation; validated in same lighting and DC-DC reference designs | Select when dual-sourcing or qualifying alternate supply chain with identical thermal and layout behavior |
| Vishay VS-2EY20-M3/54 | VRRM = 200V, trr = 35ns, VF = 0.97V @ 2A; slightly higher RθJA (80°C/W vs. 75°C/W) | Same circuit role but requires marginally larger thermal pad area for equivalent temperature rise | Prefer where Vishay qualification is mandated; verify thermal performance under worst-case ambient conditions |
Compared with MUR220G and VS-2EY20-M3/54, ES2DA R3G offers identical VRRM, trr, and IF ratings, with marginally better thermal resistance (75°C/W), enabling tighter thermal design margins in space-constrained industrial power modules.
Availability
ES2DA R3G is available at Aetrix Electronics and suitable for DC-DC converters, snubber circuits, and LED lighting applications requiring stable component supply, consistent parametric performance, and full traceability across production lots.
Supply support for ES2DA R3G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.
The ES2xx series was designed specifically for high-efficiency, high-frequency AC/DC and DC/DC power conversion - emphasizing fast recovery, low VF, and robust thermal performance in compact surface-mount packages.
FAQ
What is the maximum junction temperature rating for ES2DA R3G?
The ES2DA R3G has a maximum junction temperature (TJ) of +150°C and a minimum storage temperature of -55°C. This rating allows reliable operation in industrial environments with elevated ambient temperatures, provided thermal design respects the RθJA = 75°C/W specification and maintains adequate PCB copper area for heat dissipation. The ES2DA R3G must not exceed this limit during steady-state or transient conditions.
Is ES2DA R3G RoHS and halogen-free compliant?
Yes, ES2DA R3G is RoHS compliant and halogen-free per IEC 61249-2-21. The molding compound meets UL 94V-0 flammability rating, and the matte tin-plated leads are solderable per J-STD-002. These compliance attributes are verified per Taiwan Semiconductor's M2102 specification release and apply to all production lots of ES2DA R3G.
What does the 'R3G' suffix indicate in ES2DA R3G?
The 'R3G' suffix in ES2DA R3G denotes tape-and-reel packaging: R3 = 7,500 units per reel, G = green compound (halogen-free). This marking aligns with Taiwan Semiconductor's ordering code convention for the ES2xx family. The ES2DA R3G is not a different electrical variant - its parameters match those of ES2DA in the datasheet, including VRRM = 200V and trr = 35ns.
Can ES2DA R3G replace ES2DHE3/54 in existing designs?
ES2DA R3G is not a direct replacement for Vishay's ES2DHE3/54 due to differences in thermal resistance (ES2DA R3G: RθJA = 75°C/W; ES2DHE3/54: RθJA = 80°C/W) and minor VF variation (0.95V vs. 0.97V). While both are DO-214AC 200V/2A super-fast rectifiers, thermal validation is required before substitution. The ES2DA R3G may offer slight thermal advantage but requires verification of marking, date code, and lot traceability alignment.
What is the reverse leakage current of ES2DA R3G at elevated temperature?
At TJ = 125°C and rated reverse voltage (200V), the ES2DA R3G exhibits a maximum reverse leakage current (IR) of 350 µA, per the datasheet's electrical specifications table. At 25°C, IR is ≤10 µA. This temperature-dependent leakage is critical for low-power standby circuits and must be accounted for in total system quiescent current budgets. The ES2DA R3G maintains this spec across all qualified production lots.
ES2DA R3G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- DO-214AC, SMA
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 200 V
- Current - Average Rectified (Io):
- 2A
- Voltage - Forward (Vf) (Max) @ If:
- 950 mV @ 2 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 35 ns
- Current - Reverse Leakage @ Vr:
- 10 µA @ 200 V
- Capacitance @ Vr, F:
- 25pF @ 4V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AC (SMA)
- Operating Temperature - Junction:
- -55°C ~ 150°C
ES2DA R3G FAQ
1.How can I place an order for ES2DA R3G through Aetrix?
Please submit a Request for Quotation (RFQ) for ES2DA R3G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ES2DA R3G reliable?
The price and inventory of ES2DA R3G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ES2DA R3G is usually 5 days.
3.What payment methods are accepted for ES2DA R3G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ES2DA R3G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ES2DA R3G?
ES2DA R3G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ES2DA R3G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ES2DA R3G?
For technical support, including ES2DA R3G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ES2DA R3G requirements.
6.How does Aetrix verify that ES2DA R3G is sourced from the original manufacturer or authorized distributors?
All ES2DA R3G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ES2DA R3G meets industry standards.
7.What is the process for return or replacement of ES2DA R3G?
All ES2DA R3G units undergo pre-shipment inspection (PSI). If there is an issue with ES2DA R3G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ES2DA R3G part is unused and in its original packaging.
Return procedure for ES2DA R3G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ES2DA R3G Tags
-
1N4448X-TP
Micro Commercial Co
-
1N4148WX-TP
Micro Commercial Co
-
1N4148TR
onsemi
-
MMSD4148T1G
onsemi
-
MMBD914LT3G
onsemi
-
BAS16HT1G
onsemi
-
1N914BWT
onsemi
-
BAS21LT1G
onsemi
-
LL4148
onsemi
-
BAS16LT1G
onsemi
-
MMSD914T1G
onsemi
-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
