Taiwan Semiconductor Corporation ES3B M6G

Overview

ES3B M6G from Taiwan Semiconductor is a 3A, 100V super fast recovery surface-mount rectifier in DO-214AB (SMC) package, featuring 35ns reverse recovery time, 0.95V forward voltage at 3A/25°C, and 100A peak surge current capability. It serves as a primary output rectifier in high-frequency switching power supplies for telecom and computing applications.

For engineers reviewing the ES3B M6G datasheet, ES3B M6G pinout, ES3B M6G application, or ES3B M6G equivalent, key selection criteria include V_RRM = 100 V, I_F = 3 A, t_rr = 35 ns, V_F = 0.95 V, and thermal resistance R_θJL = 12 °C/W - all critical for efficiency and thermal management in compact SMPS designs.

Technical Context

The ES3B M6G implements a single-die, glass-passivated PN junction optimized for high-frequency rectification. Its super-fast recovery (t_rr ≤ 35 ns) minimizes switching losses in 100–500 kHz converters, while the DO-214AB package enables automated placement and supports 3 A continuous forward current with 150 °C max junction temperature.

It operates with low leakage (I_R ≤ 10 µA @ 25 °C, ≤ 500 µA @ 100 °C), stable junction capacitance (45 pF @ 1 MHz, 4 V), and meets J-STD-020 moisture sensitivity level 1 - enabling reliable reflow assembly without baking.

Key Specifications

Pinout & Package

Package: DO-214AB (SMC), surface-mount, cathode-indicated by band, matte tin-plated leads, UL 94V-0 molding compound, 0.210 g typical weight.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar super fast rectifier applications.

Compared with VS-3EYH01-M3/54, ES3B M6G offers lower V_F for better light-load efficiency; versus MUR3100CT, it delivers superior t_rr, smaller footprint, and lower thermal resistance - making ES3B M6G optimal for space-constrained, high-frequency SMPS.

Availability

ES3B M6G is available at Aetrix Electronics and suitable for telecom power modules, server PSUs, and industrial motor drives requiring stable component supply, J-STD-020 Level 1 assembly compatibility, and RoHS/halogen-free compliance.

Supply support for ES3B M6G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS diodes, and MOSFETs since 1979.

The ES3x series was developed specifically for high-frequency, high-reliability AC-DC and DC-DC conversion in computing and communications infrastructure, emphasizing fast recovery, robust thermal performance, and automated assembly readiness.

FAQ

What is the maximum junction temperature rating for ES3B M6G?

The ES3B M6G has a maximum junction temperature (T_J) of +150 °C, as specified in its Absolute Maximum Ratings table. This rating allows operation in high-ambient environments such as enclosed server chassis or industrial enclosures. Derating curves confirm usable current down to 75 °C ambient at full 3 A, provided PCB copper area meets thermal design guidelines. The ES3B M6G must not exceed this limit to maintain reliability and parametric stability.

Is ES3B M6G compatible with lead-free reflow soldering processes?

Yes, ES3B M6G is fully compatible with standard lead-free reflow profiles (e.g., JEDEC J-STD-020). Its matte tin-plated leads meet J-STD-002 solderability requirements, and its moisture sensitivity level is rated Class 1 - meaning no baking is required prior to reflow. The DO-214AB package withstands peak temperatures up to 260 °C for 10 seconds, ensuring robust intermetallic formation without delamination or voiding in the ES3B M6G assembly process.

What does the 'M6G' suffix indicate in ES3B M6G?

The 'M6G' suffix in ES3B M6G denotes Taiwan Semiconductor's internal packaging and environmental code: 'M' indicates tape-and-reel packaging (3,000 pcs per reel), '6' specifies green molding compound (halogen-free per IEC 61249-2-21), and 'G' confirms RoHS-compliant finish. This coding is consistent across the ES3x family and appears on the device marking alongside 'ES3B'. The ES3B M6G marking ensures traceability to compliant materials and automated handling specifications.

How does ES3B M6G compare to ES3A and ES3C in terms of voltage rating and application scope?

ES3B M6G is rated for 100 V V_RRM, positioned between ES3A (50 V) and ES3C (150 V). It targets mid-range applications like 48 V telecom outputs or 24 V industrial rails where 50 V is insufficient and 150 V adds unnecessary cost and capacitance. All three share identical I_F, t_rr, and package; only V_RRM and V_F differ slightly. Therefore, ES3B M6G is not interchangeable with ES3A or ES3C without verifying system blocking margin - ES3B M6G is selected specifically for 100 V-class designs.

Can ES3B M6G be used in place of a Schottky diode in a 12 V output circuit?

ES3B M6G can replace Schottky diodes in 12 V output circuits where reverse voltage exceeds 50 V and thermal design accommodates its higher V_F (~0.95 V vs. ~0.4–0.6 V for Schottky). Its advantage lies in higher T_J rating (150 °C vs. typically 125 °C) and absence of reverse leakage rise with temperature. However, due to higher forward loss, ES3B M6G is best applied where cost, reliability, or high-temperature operation outweighs marginal efficiency gain - e.g., in fanless telecom modules. System validation of ripple and thermal rise is required before substituting ES3B M6G for Schottky.