Taiwan Semiconductor Corporation ES3F M6G
- Part No.:
- ES3F M6G
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- DO-214AB, SMC
- Datasheet:
-
ES3F M6G.pdf
- Description:
- DIODE GEN PURP 300V 3A DO214AB
- Quantity:
- Payment:

- Shipping:

Inventory:6,097
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ES3F M6G from Taiwan Semiconductor is a 3A, 300V super fast recovery surface-mount rectifier in DO-214AB (SMC) package, featuring 35ns reverse recovery time, 1.30V max forward voltage at 3A/25°C, and 100A peak surge current - used in high-frequency switching mode power supplies for telecom and computing.
For engineers reviewing the ES3F M6G datasheet, ES3F M6G pinout, ES3F M6G application, or ES3F M6G equivalent, key selection criteria include VRRM = 300V, IF = 3A, trr = 35ns, RθJA = 47°C/W, and DO-214AB mechanical compatibility with automated SMT assembly.
Technical Context
This single-die, glass-passivated super fast rectifier operates with junction temperatures from –55°C to +150°C and supports high-efficiency DC/DC conversion where low forward voltage drop and rapid reverse recovery minimize switching losses. Its 30pF junction capacitance at 1MHz/4V enables stable performance in MHz-range SMPS topologies.
The device meets J-STD-020 moisture sensitivity level 1 and JESD201 Class 2 whisker resistance, with matte tin-plated leads solderable per J-STD-002 - confirming suitability for lead-free reflow and high-reliability industrial production environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 300 V - maximum repetitive reverse blocking voltage; defines safe operating limit in flyback/freewheeling paths |
| IF | 3 A continuous - rated average forward current at TL = 75°C; determines thermal derating in compact layouts |
| trr | 35 ns - measured at IF = 0.5A, IR = 1.0A, Irr = 0.25A; enables >500 kHz switching without excessive diode recovery loss |
| VF (max) | 1.30 V at IF = 3A, TJ = 25°C - directly impacts conduction loss and thermal rise in high-current output rails |
| CJ | 30 pF at 1 MHz, VR = 4.0 V - limits capacitive coupling noise and EMI in high-dv/dt node placements |
| RθJA | 47 °C/W - junction-to-ambient thermal resistance; informs heatsink/no-heatsink layout decisions on FR-4 PCBs |
Pinout & Package
DO-214AB (SMC) surface-mount package with cathode-indicating band; 2-terminal unidirectional configuration; body dimensions 7.11 × 6.22 × 2.39 mm (L × W × H); matte tin-plated leads compliant with J-STD-002 solderability.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry point | Connected to lower-potential side of switching node (e.g., MOSFET source or transformer secondary center-tap) |
| Cathode | Forward current exit / reverse blocking terminal | Connected to output rail or filter capacitor; polarity marked by molded band - critical for correct orientation in automated placement |
Key Features
| Feature | Design Value |
|---|---|
| Super fast recovery (trr ≤ 35 ns) | Reduces reverse recovery charge (Qrr) and associated switching losses in hard-switched converters |
| Glass passivated junction | Ensures long-term reliability under humidity and thermal cycling; eliminates need for conformal coating in non-hermetic enclosures |
| Moisture sensitivity level 1 | Allows unlimited floor life before reflow; eliminates baking requirement and simplifies SMT line logistics |
| RoHS & halogen-free compliance | Meets IEC 61249-2-21 and EU RoHS Directive 2011/65/EU - required for CE-marked telecom and industrial end equipment |
Applications
| Telecom AC-DC Adapters | Server VRM Output Rectification |
|---|---|
Use Scenario: Secondary-side rectification in 65–300W offline adapters powering VoIP phones and base station control modules. IC Role / Device Role / Timing Role: Super fast freewheeling diode in synchronous or quasi-resonant flyback topology. Use Value: 35ns trr minimizes cross-conduction loss during MOSFET turn-on, improving efficiency by ≥0.8% at full load vs. standard fast rectifiers. | Use Scenario: Output rectification in multiphase buck-derived VRMs supplying CPU/GPU core voltage (1.0–1.8V @ 100+ A). IC Role / Device Role / Timing Role: High-current, low-VF freewheeling path in discrete phase-leg designs. Use Value: 1.30V VF at 3A reduces conduction loss by ~120mW per phase versus 1.5V alternatives, lowering thermal density in dense VRM layouts. |
| Industrial PLC Power Supplies | LED Driver Secondary Rectification |
Use Scenario: Input rectification stage in 24V/48V isolated DC-DC modules powering programmable logic controllers. IC Role / Device Role / Timing Role: Primary-side bridge rectifier replacement in compact, fanless 15–50W isolated supplies. Use Value: DO-214AB footprint allows direct integration into space-constrained PCBs while maintaining 150°C TJMAX for extended service life in sealed enclosures. | Use Scenario: Secondary-side rectification in constant-current LED drivers for street lighting and commercial signage. IC Role / Device Role / Timing Role: High-reliability output diode in flyback-based constant-current sources driving 30–100W LED strings. Use Value: Glass passivation and JESD201 Class 2 whisker resistance ensure stable operation over 50,000-hour lifetime under thermal cycling and vibration stress. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar super fast rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay VS-ES3FHM3 | VRRM = 300V, trr = 35ns, VF = 1.30V, same DO-214AB package but with green molding compound | Identical electrical specs; differs only in material composition (halogen-free status not explicitly stated in public datasheet) | Select when requiring Vishay's qualification documentation or specific supply chain diversification |
| ON Semiconductor MUR330 | VRRM = 300V, trr = 35ns, but VF = 1.35V (max), RθJA = 50°C/W, same DO-214AB footprint | Slightly higher conduction loss and thermal resistance; validated for automotive-grade temperature cycling | Prefer when AEC-Q101 qualification is mandatory, despite marginal efficiency trade-off |
Compared with VS-ES3FHM3 and MUR330, ES3F M6G delivers identical trr and VF performance in a halogen-free, J-STD-020 Level-1 compliant package - making it optimal for cost-sensitive, high-volume telecom and industrial power supplies where moisture handling and environmental compliance are prioritized.
Availability
ES3F M6G is available at Aetrix Electronics and suitable for telecom AC-DC adapters, server VRM output stages, and industrial PLC power supplies requiring stable component supply, consistent parametric performance, and full traceability across production lots.
Supply support for ES3F M6G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in rectifiers, TVS diodes, MOSFETs, and bipolar transistors since 1979.
The ES3x series was developed specifically for high-frequency switching power conversion in cost-sensitive, high-volume applications - balancing ultra-fast recovery, low forward voltage, and robust packaging for automated SMT manufacturing.
FAQ
What is the maximum junction temperature rating for ES3F M6G?
The ES3F M6G has a maximum junction temperature (TJMAX) of +150°C, with operational range from –55°C to +150°C. This rating allows reliable use in enclosed, fanless power supplies where ambient temperatures may reach 70–85°C, provided thermal design maintains junction temperature below 150°C under worst-case load and airflow conditions. The ES3F M6G's RθJA = 47°C/W must be applied with appropriate copper area and airflow assumptions.
Does ES3F M6G meet RoHS and halogen-free requirements?
Yes, ES3F M6G is RoHS compliant and halogen-free per IEC 61249-2-21. The device uses molding compound and plating materials that contain no brominated flame retardants, chlorine, or fluorine above threshold limits. This compliance is verified in Taiwan Semiconductor's official product declaration and applies to all units shipped under ordering code ES3F M6G - critical for CE marking and export to EU, Japan, and South Korea markets.
What is the reverse recovery time (trr) test condition for ES3F M6G?
The reverse recovery time of 35 ns for ES3F M6G is measured under standardized conditions: IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A, with specified di/dt and voltage ramp rates per JEDEC standards. This value is guaranteed maximum - typical performance is tighter. The ES3F M6G's trr remains stable across its full operating temperature range, supporting consistent efficiency in variable-temperature environments.
Is ES3F M6G suitable for lead-free reflow soldering?
Yes, ES3F M6G features matte tin-plated leads qualified per J-STD-002 for solderability and is rated for lead-free reflow profiles up to 260°C peak temperature. Its moisture sensitivity level is J-STD-020 Level 1, meaning it can be stored indefinitely at ≤30°C/60% RH without baking prior to assembly - eliminating process steps and reducing risk of popcorning during reflow. This makes ES3F M6G fully compatible with modern high-speed SMT lines.
How does the forward voltage of ES3F M6G compare to ES3A–ES3D variants?
ES3F M6G has a maximum forward voltage of 1.30 V at IF = 3 A and TJ = 25°C, whereas ES3A–ES3D variants specify 0.95 V max under identical conditions. This difference reflects the higher VRRM (300 V vs. 50–200 V) and optimized doping profile for higher-voltage blocking - resulting in slightly higher conduction loss but enabling safe operation in 300 V-rated circuits where ES3A–ES3D would fail catastrophically. The ES3F M6G remains optimal for 300 V applications.
ES3F M6G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- DO-214AB, SMC
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 300 V
- Current - Average Rectified (Io):
- 3A
- Voltage - Forward (Vf) (Max) @ If:
- 1.3 V @ 3 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 35 ns
- Current - Reverse Leakage @ Vr:
- 10 µA @ 300 V
- Capacitance @ Vr, F:
- 30pF @ 4V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AB (SMC)
- Operating Temperature - Junction:
- -55°C ~ 150°C
ES3F M6G FAQ
1.How can I place an order for ES3F M6G through Aetrix?
Please submit a Request for Quotation (RFQ) for ES3F M6G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ES3F M6G reliable?
The price and inventory of ES3F M6G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ES3F M6G is usually 5 days.
3.What payment methods are accepted for ES3F M6G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ES3F M6G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ES3F M6G?
ES3F M6G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ES3F M6G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ES3F M6G?
For technical support, including ES3F M6G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ES3F M6G requirements.
6.How does Aetrix verify that ES3F M6G is sourced from the original manufacturer or authorized distributors?
All ES3F M6G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ES3F M6G meets industry standards.
7.What is the process for return or replacement of ES3F M6G?
All ES3F M6G units undergo pre-shipment inspection (PSI). If there is an issue with ES3F M6G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ES3F M6G part is unused and in its original packaging.
Return procedure for ES3F M6G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ES3F M6G Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

