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STMicroelectronics ESDZV201-1BF4
- Part No.:
- ESDZV201-1BF4
- Manufacturer:
- STMicroelectronics
- Category:
- TVS Diodes
- Package:
- -
- Datasheet:
-
ESDZV201-1BF4.pdf
- Description:
- DFD PROTECTION
- Quantity:
- Payment:
- Shipping:
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Product details
Overview
ESDZV201-1BF4 from STMicroelectronics is a bidirectional single-line TVS diode designed for ESD protection of high-speed data lines in space-constrained portable electronics. It features a 20 V stand-off voltage, 31 V clamping voltage at 16 A TLP, 5 pF typical line capacitance, and 0.7 Ω dynamic resistance - enabling robust ±30 kV air / ±18 kV contact ESD suppression in smartphones and wearables.
For engineers reviewing the ESDZV201-1BF4 datasheet, ESDZV201-1BF4 pinout, ESDZV201-1BF4 application, or ESDZV201-1BF4 equivalent, key selection criteria include low capacitance (≤5 pF), sub-0.2 mm² 0201 footprint, bidirectional clamping symmetry, IEC 61000-4-2 Level 4 compliance, and dynamic resistance under 1 Ω for minimal signal distortion during transient events.
Technical Context
This device operates as a snapback-type TVS with bidirectional triggering above ±23 V (typical Vtrig) and holding below ±20 V (VH), ensuring fast turn-on and clean recovery after ESD events. Its ultra-low 5 pF capacitance at 0 V and flat C-V curve up to ±10 V preserve signal integrity on USB 2.0, I²C, and MIPI D-PHY lines.
The 0201 package integrates two terminals with symmetric layout and no polarity marking - validated for reflow per IPC/JEDEC J-STD-020, with 240–245 °C peak profile and ≤0.072 mg mass. Dynamic resistance remains stable (0.7 Ω) across 1–16 A TLP pulses, supporting repeatable clamping performance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Stand-off Voltage | 20 V - maximum continuous working voltage before conduction begins |
| Clamping Voltage | 31 V at 16 A TLP - limits transient voltage seen by protected IC to safe level |
| Line Capacitance | 5 pF @ 1 MHz - enables use on 480 Mbps USB 2.0 and 1 Gbps MIPI without signal degradation |
| Dynamic Resistance | 0.7 Ω - ensures low-voltage overshoot and consistent clamping across pulse amplitude |
| ESD Rating | ±30 kV air / ±18 kV contact (IEC 61000-4-2 Level 4) - meets highest system-level ESD immunity requirement |
| Package Size | 0.58 × 0.28 mm (0201) - occupies only 0.18 mm² PCB area for ultra-dense layouts |
Pinout & Package
ESDZV201-1BF4 uses a 2-terminal 0201 surface-mount package with no polarity marking; both terminals are electrically identical and interchangeable. The device is mounted with either end aligned to PCB pad centerline, relying solely on terminal position-not orientation-for correct placement.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Terminal 1 | Anode/Cathode (bidirectional) | Common node for ESD current path; symmetrical conduction in both polarities |
| Terminal 2 | Anode/Cathode (bidirectional) | Second node completing transient current loop; no functional distinction from Terminal 1 |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional snapback protection | Enables single-device protection of AC-coupled or differential lines without polarity constraints |
| Ultra-low 5 pF capacitance | Minimizes insertion loss and phase shift on high-frequency interfaces up to 1 GHz |
| 0.18 mm² 0201 footprint | Reduces PCB real estate by >50% vs. 0402 TVS while maintaining full IEC 61000-4-2 Level 4 rating |
| 0.7 Ω dynamic resistance | Delivers predictable clamping voltage across 1–16 A transients, critical for multi-pulse ESD stress testing |
Applications
| Smartphone Front Camera Interface | USB 2.0 OTG Port Protection |
|---|---|
Use Scenario: ESD protection on MIPI CSI-2 data lanes between image sensor and AP in thin bezel smartphones. IC Role / Device Role / Timing Role: Bidirectional transient suppressor placed directly at connector side to shunt ESD energy before reaching serializer IC. Use Value: 5 pF capacitance avoids pixel clock jitter; 31 V clamping prevents latch-up in 1.2 V I/O domains. | Use Scenario: Protecting D+ and D− lines of micro-USB receptacles exposed to frequent plug/unplug events. IC Role / Device Role / Timing Role: Line-level TVS placed adjacent to connector to clamp ±15 kV contact discharges before reaching USB PHY. Use Value: Symmetric clamping ensures equal protection for both differential signals; 0201 size allows placement within 2 mm of connector pad. |
| Wireless Earbud Touch Sensor Line | Wearable ECG Electrode Interface |
Use Scenario: Guarding capacitive touch sense lines on compact earbuds subject to finger-tip ESD. IC Role / Device Role / Timing Role: Low-leakage (≤0.3 µA @ 20 V) TVS that avoids DC offset drift in analog sensing paths. Use Value: Sub-1 µA leakage preserves touch sensitivity; 20 V stand-off matches typical AVDD rail in touch controllers. | Use Scenario: Shielding biopotential amplifier inputs from ESD during patient handling in patch-style ECG monitors. IC Role / Device Role / Timing Role: First-stage protector on electrode input traces, placed before high-Z instrumentation amplifier. Use Value: 0.7 Ω RD prevents voltage overshoot beyond amplifier's ±100 mV common-mode range during 8 kV discharge. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD2E001DRYR | Unidirectional; 12 pF capacitance; 3.6 V stand-off; 12 V clamping | Requires separate devices per polarity; unsuitable for AC-coupled or differential lines | Select only when protecting low-voltage unidirectional GPIOs with tight VCC margins |
| ESD9X5.0ST5G | Bidirectional; 15 pF capacitance; 5 V stand-off; 14 V clamping | Limited to 5 V systems; higher capacitance degrades >100 MHz signal integrity | Prefer for legacy 5 V logic rails where bandwidth < 100 MHz suffices |
Compared with TPD2E001DRYR and ESD9X5.0ST5G, ESDZV201-1BF4 uniquely supports 20 V systems with bidirectional operation and <5 pF capacitance - making it the only option for high-speed, high-voltage, space-constrained ESD protection in modern mobile platforms.
Availability
ESDZV201-1BF4 is available at Aetrix Electronics and suitable for smartphone front camera interfaces, USB 2.0 OTG ports, wireless earbud touch sensors, and wearable ECG electrode interfaces requiring stable component supply and guaranteed ECOPACK2 compliance.
Supply support for ESDZV201-1BF4 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing silicon solutions for automotive, industrial, and consumer markets since 1987.
The ESDZV series targets ultra-compact, high-frequency ESD protection for mobile and wearable platforms - emphasizing low capacitance, minimal footprint, and full IEC 61000-4-2 Level 4 compliance in sub-0.2 mm² packages.
FAQ
What is the maximum operating temperature for ESDZV201-1BF4?
The ESDZV201-1BF4 has an operating junction temperature range of –55 °C to +150 °C, verified per absolute maximum ratings in DS13171 Rev 2. This allows reliable deployment in thermally demanding environments such as inside sealed smartphone chassis or near battery compartments where ambient temperatures exceed 85 °C.
Does ESDZV201-1BF4 require orientation-specific placement on PCB?
No - ESDZV201-1BF4 is a fully bidirectional, symmetric 2-terminal device with no anode/cathode designation. The "J" marking may rotate 90° or 180° per assembly location, but electrical function is identical regardless of orientation. Placement relies solely on terminal alignment to pads, not marking direction.
How does its 0.7 Ω dynamic resistance impact system-level ESD performance?
A dynamic resistance of 0.7 Ω ensures clamping voltage rises linearly with peak current (e.g., 22 V at 1 A, 31 V at 16 A), enabling predictable worst-case voltage stress on downstream ICs. This consistency supports pass/fail validation under multi-pulse IEC 61000-4-2 testing without parameter drift.
Can ESDZV201-1BF4 be used on 3.3 V I/O lines despite its 20 V stand-off voltage?
Yes - the 20 V stand-off voltage indicates maximum continuous blocking capability, not minimum operating voltage. With only 0.3 µA leakage at 20 V and negligible leakage below 3.3 V, it imposes no loading on 3.3 V logic or analog circuits while providing full ESD immunity margin above normal operating voltage.
ESDZV201-1BF4 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- STMicroelectronics
- Package/Case:
- -
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- -
- Unidirectional Channels:
- -
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- -
- Applications:
- -
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
ESDZV201-1BF4 FAQ
1.How can I place an order for ESDZV201-1BF4 through Aetrix?
Please submit a Request for Quotation (RFQ) for ESDZV201-1BF4 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESDZV201-1BF4 reliable?
The price and inventory of ESDZV201-1BF4 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESDZV201-1BF4 is usually 5 days.
3.What payment methods are accepted for ESDZV201-1BF4?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESDZV201-1BF4 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESDZV201-1BF4?
ESDZV201-1BF4 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESDZV201-1BF4 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESDZV201-1BF4?
For technical support, including ESDZV201-1BF4 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESDZV201-1BF4 requirements.
6.How does Aetrix verify that ESDZV201-1BF4 is sourced from the original manufacturer or authorized distributors?
All ESDZV201-1BF4 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESDZV201-1BF4 meets industry standards.
7.What is the process for return or replacement of ESDZV201-1BF4?
All ESDZV201-1BF4 units undergo pre-shipment inspection (PSI). If there is an issue with ESDZV201-1BF4, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESDZV201-1BF4 part is unused and in its original packaging.
Return procedure for ESDZV201-1BF4:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESDZV201-1BF4 Tags
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ESD9B5.0ST5G
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DESD3V3E1BL-7B
Diodes Incorporated
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D5V0H1B2LP-7B
Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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