Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Diodes > Rectifiers > Single Diodes

Taiwan Semiconductor Corporation ESH2DA

Name: ESH2DA
Brand: Taiwan Semiconductor Corporation
SKU: ESH2DA
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: ESH2DA

Manufacturer:: Taiwan Semiconductor Corporation

Category:: Single Diodes

Package:: DO-214AC, SMA

Datasheet:: ESH2DA.pdf

Description:: DIODE GEN PURP 200V 1A DO214AC

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:14,930

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

ESH2DA from Taiwan Semiconductor is a 1 A, 200 V ultra-fast surface-mount rectifier diode in DO-214AC (SMA) package, featuring 25 ns reverse recovery time, 0.9 V max forward voltage at 1 A, and 50 A peak surge current capability. It serves as a freewheeling or snubber diode in high-frequency DC-DC converters and switching inverters.

For engineers reviewing the ESH2DA datasheet, ESH2DA pinout, ESH2DA application, or ESH2DA equivalent, key selection criteria include its 200 V repetitive peak reverse voltage, ultra-fast 25 ns trr, 175 °C maximum junction temperature, DO-214AC mechanical compatibility, and RoHS/halogen-free compliance for industrial power conversion designs.

Technical Context

The ESH2DA is a single-die, planar epitaxial ultra-fast recovery rectifier optimized for high-efficiency switching applications. Its 25 ns reverse recovery time and low 0.9 V forward voltage drop minimize conduction and switching losses in 50–500 kHz power stages.

Thermally, it delivers R_θJL = 20 °C/W and R_θJA = 75 °C/W in standard PCB mounting, enabling reliable operation up to 175 °C junction temperature. The device exhibits <1 µA reverse leakage at 25 °C and <50 µA at 125 °C under rated VR.

Key Specifications

Parameter	Value and Actual Design Meaning
V_RRM	200 V - Maximum repetitive reverse blocking voltage; defines usable input voltage headroom in 170 V_AC rectification or 150 V_DC bus clamp circuits
I_F	1 A continuous - Rated average forward current at T_L = 75 °C; supports compact heatsinking in space-constrained SMPS designs
t_rr	25 ns - Ultra-fast reverse recovery; reduces switching loss and EMI in hard-switched topologies above 100 kHz
V_F (max)	0.9 V @ 1 A, 25 °C - Low conduction loss improves efficiency in low-voltage output stages (e.g., 3.3 V/5 V DC-DC)
I_FSM	50 A @ 8.3 ms - High surge tolerance enables robustness against line transients and inrush in offline converters
T_J(max)	175 °C - Extended thermal rating allows operation in sealed enclosures or high-ambient industrial environments
C_J	25 pF @ 1 MHz, 4 V - Low junction capacitance minimizes capacitive coupling noise in high-dv/dt snubber networks

Pinout & Package

Package: DO-214AC (SMA), surface-mount, single-anode/single-cathode configuration. Cathode indicated by molded band. Matte tin-plated leads, J-STD-002 solderable, moisture sensitivity level 1.

Pin/Terminal	Circuit Role	Design Meaning
Anode (A)	Forward current entry point	Connected to lower-potential node (e.g., switch node in buck freewheel path or transformer secondary center-tap)
Cathode (K)	Forward current exit / reverse blocking terminal	Connected to higher-potential rail (e.g., output capacitor positive or DC bus); polarity band must align with PCB silkscreen

Key Features

Feature	Design Value
Ultra-fast recovery (t_rr ≤ 25 ns)	Enables high-frequency operation (>200 kHz) with minimal switching loss and reduced EMI generation
Low V_F (≤ 0.9 V @ 1 A)	Reduces conduction loss by ~15% vs. standard fast rectifiers, improving full-load efficiency in 12 V–48 V output converters
High I_FSM (50 A)	Withstands repeated line surges and inductive kickback without degradation, extending reliability in unregulated AC-DC front-ends
DO-214AC (SMA) package	Standardized footprint compatible with automated pick-and-place; supports >1.5 W power dissipation with minimal PCB area
RoHS + halogen-free	Meets IEC 61249-2-21 and EU RoHS Directive, enabling use in environmentally regulated industrial and lighting products

Applications

DC-DC Converter Freewheeling	Snubber Network Diode
Use Scenario: Used in synchronous or non-synchronous buck converters to provide low-loss current path during high-side switch off-time. IC Role / Device Role / Timing Role: Freewheeling diode conducting during dead-time; reverse recovery timing directly impacts switching loss and ringing. Use Value: 25 ns t_rr and 0.9 V V_F reduce both conduction and turn-off losses, improving converter efficiency by up to 1.2% at 200 kHz.	Use Scenario: Placed across MOSFETs or IGBTs in RCD snubber networks to clamp voltage spikes during turn-off. IC Role / Device Role / Timing Role: Fast-recovery clamping diode; must recover before next switching cycle to avoid shoot-through or excessive dissipation. Use Value: 200 V V_RRM and 25 ns t_rr ensure reliable clamping in 100–150 V bus systems with sub-100 ns switching edges.
Lighting Ballast Rectification	Switching Inverter Output Stage
Use Scenario: Rectifies high-frequency AC from electronic ballasts driving fluorescent or HID lamps. IC Role / Device Role / Timing Role: High-frequency output rectifier; operates at 20–100 kHz with repetitive reverse stress. Use Value: 175 °C T_J(max) and <50 µA IR at 125 °C ensure stable performance under sealed lamp housing thermal conditions.	Use Scenario: Output rectification in solar microinverters or UPS inverters converting DC to 50/60 Hz AC via H-bridge. IC Role / Device Role / Timing Role: Output bridge leg diode handling bidirectional current; requires low V_F and high I_FSM for surge immunity. Use Value: 50 A I_FSM withstands grid fault currents; 0.9 V V_F lowers heat generation in thermally constrained module packaging.

DC-DC Converter Freewheeling

Snubber Network Diode

Use Scenario: Used in synchronous or non-synchronous buck converters to provide low-loss current path during high-side switch off-time.

IC Role / Device Role / Timing Role: Freewheeling diode conducting during dead-time; reverse recovery timing directly impacts switching loss and ringing.

Use Value: 25 ns t_rr and 0.9 V V_F reduce both conduction and turn-off losses, improving converter efficiency by up to 1.2% at 200 kHz.

Use Scenario: Placed across MOSFETs or IGBTs in RCD snubber networks to clamp voltage spikes during turn-off.

IC Role / Device Role / Timing Role: Fast-recovery clamping diode; must recover before next switching cycle to avoid shoot-through or excessive dissipation.

Use Value: 200 V V_RRM and 25 ns t_rr ensure reliable clamping in 100–150 V bus systems with sub-100 ns switching edges.

Lighting Ballast Rectification

Switching Inverter Output Stage

Use Scenario: Rectifies high-frequency AC from electronic ballasts driving fluorescent or HID lamps.

IC Role / Device Role / Timing Role: High-frequency output rectifier; operates at 20–100 kHz with repetitive reverse stress.

Use Value: 175 °C T_J(max) and <50 µA IR at 125 °C ensure stable performance under sealed lamp housing thermal conditions.

Use Scenario: Output rectification in solar microinverters or UPS inverters converting DC to 50/60 Hz AC via H-bridge.

IC Role / Device Role / Timing Role: Output bridge leg diode handling bidirectional current; requires low V_F and high I_FSM for surge immunity.

Use Value: 50 A I_FSM withstands grid fault currents; 0.9 V V_F lowers heat generation in thermally constrained module packaging.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultra-fast rectifier applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STTH1R02	Same 1 A / 200 V rating; 30 ns t_rr, 0.95 V V_F; TO-220AC package (through-hole)	Requires PCB through-hole mounting and larger heatsink area; not suitable for high-density SMT layouts	Select when legacy through-hole assembly or higher thermal mass is preferred over SMT miniaturization
ES1D	1 A / 200 V; 35 ns t_rr, 0.93 V V_F; DO-214AC package; lower I_FSM (30 A)	Lower surge rating limits use in high-transient environments; otherwise pin-compatible in SMA footprint	Acceptable where surge margin is relaxed and cost is prioritized over robustness

Compared with STTH1R02 and ES1D, the ESH2DA offers the fastest recovery (25 ns), lowest V_F among SMA-packaged alternatives, and highest I_FSM-making it optimal for high-density, high-efficiency, and high-reliability SMT power conversion where thermal and switching performance are critical.

Availability

ESH2DA is available at Aetrix Electronics and suitable for DC-DC converters, lighting ballasts, and switching inverters requiring stable component supply, consistent parametric performance, and long-term manufacturing continuity.

Supply support for ESH2DA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS devices, and MOSFETs for industrial and consumer markets.

The ESH2DA belongs to TSC's ESH2x ultra-fast rectifier family, engineered specifically for high-frequency switching power supplies where low recovery time, tight V_F distribution, and robust surge handling are essential design requirements.

FAQ

What is the maximum junction temperature rating for the ESH2DA?

The ESH2DA has a maximum junction temperature (T_J(max)) of +175 °C, verified per absolute maximum ratings table in the official Taiwan Semiconductor datasheet F2102. This rating enables reliable operation in high-ambient environments such as enclosed LED drivers or industrial motor control modules. Derating curves confirm sustained 1 A forward current capability at lead temperatures up to 75 °C without exceeding T_J(max).

Is the ESH2DA RoHS and halogen-free compliant?

Yes, the ESH2DA is RoHS compliant and halogen-free per IEC 61249-2-21, as explicitly stated in the "FEATURES" section of the Taiwan Semiconductor datasheet F2102. The molding compound meets UL 94V-0 flammability rating, and terminals are matte tin plated per J-STD-002. These certifications apply directly to the ESH2DA variant, not just the family.

What is the reverse recovery time (t_rr) specification for the ESH2DA?

The ESH2DA has a maximum reverse recovery time (t_rr) of 25 ns, measured under IF = 0.5 A, IR = 1.0 A, and Irr = 0.25 A per the Electrical Specifications table in datasheet F2102. This value is confirmed for the ESH2DA variant and is lower than ESH2BA (20 ns not claimed) and ESH2CA (22 ns typical), making ESH2DA the fastest in the series.

Does the ESH2DA have a specified junction-to-lead thermal resistance?

Yes, the ESH2DA has a typical junction-to-lead thermal resistance (R_θJL) of 20 °C/W, published in the Thermal Performance section of the F2102 datasheet. This parameter is measured on standard FR-4 PCB with 1-inch² copper pad and is valid for the DO-214AC package used by ESH2DA.

What marking code appears on the ESH2DA device body?

The ESH2DA is marked with "ESH2DA" on its body, as confirmed in the Absolute Maximum Ratings table of datasheet F2102, which lists "Marking code on the device" as ESH2DA for this specific variant. This distinguishes it from ESH2BA (marked ESH2BA) and ESH2CA (marked ESH2CA).

ESH2DA Specifications

Product attributes: Attribute value

Manufacturer:: Taiwan Semiconductor Corporation

Series:: -

Package/Case:: DO-214AC, SMA

Packaging:: Tape & Reel (TR)

Product Status:: Active

Technology:: Standard

Voltage - DC Reverse (Vr) (Max):: 200 V

Current - Average Rectified (Io):: 1A

Voltage - Forward (Vf) (Max) @ If:: 900 mV @ 1 A

Speed:: Fast Recovery =< 500ns, > 200mA (Io)

Reverse Recovery Time (trr):: 25 ns

Current - Reverse Leakage @ Vr:: 1 µA @ 200 V

Capacitance @ Vr, F:: 25pF @ 4V, 1MHz

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: DO-214AC (SMA)

Operating Temperature - Junction:: -55°C ~ 175°C

ESH2DA FAQ

1.How can I place an order for ESH2DA through Aetrix?

Please submit a Request for Quotation (RFQ) for ESH2DA on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for ESH2DA reliable?

The price and inventory of ESH2DA are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESH2DA is usually 5 days.

3.What payment methods are accepted for ESH2DA?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESH2DA transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for ESH2DA?

ESH2DA orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your ESH2DA order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for ESH2DA?

For technical support, including ESH2DA datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESH2DA requirements.

6.How does Aetrix verify that ESH2DA is sourced from the original manufacturer or authorized distributors?

All ESH2DA products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESH2DA meets industry standards.

7.What is the process for return or replacement of ESH2DA?

All ESH2DA units undergo pre-shipment inspection (PSI). If there is an issue with ESH2DA, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The ESH2DA part is unused and in its original packaging.

Return procedure for ESH2DA:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-09 Counterfeit Electronic Components: How to Detect, Authenticate, and Test Suspect Parts

Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…