Taiwan Semiconductor Corporation ESH3C
- Part No.:
- ESH3C
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Single Diodes
- Package:
- DO-214AB, SMC
- Datasheet:
-
ESH3C.pdf
- Description:
- DIODE GEN PURP 150V 3A DO214AB
- Quantity:
- Payment:

- Shipping:

Inventory:2,976
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
ESH3C from Taiwan Semiconductor is a 3A, 150V ultra-fast surface-mount rectifier diode in DO-214AB (SMC) package, featuring 20 ns reverse recovery time, 0.9 V forward voltage at 3 A, and 125 A peak surge current - deployed in high-frequency switching mode power supplies for telecom and computing equipment.
For engineers reviewing the ESH3C datasheet, ESH3C pinout, ESH3C application, or ESH3C equivalent, key selection criteria include repetitive peak reverse voltage (150 V), thermal resistance (12 °C/W junction-to-lead), moisture sensitivity level (J-STD-020 Level 1), RoHS/halogen-free compliance, and SMC package compatibility with automated placement.
Technical Context
The ESH3C is a single-die, glass-passivated ultra-fast recovery rectifier optimized for high-efficiency DC/DC conversion where low forward voltage and fast switching minimize conduction and switching losses. Its 20 ns trr enables operation up to several hundred kHz in SMPS topologies.
Designed for junction temperatures up to 175 °C and rated for 125 A non-repetitive surge, the ESH3C supports robust freewheeling and output rectification in compact, thermally constrained layouts - leveraging its 12 °C/W RθJL for direct lead heat sinking.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 150 V - maximum repetitive reverse blocking voltage; defines safe operating limit in flyback/freewheeling paths |
| IF | 3 A continuous - average forward current rating at TL = 75 °C; determines heatsink or PCB copper requirement |
| trr | 20 ns - ultra-fast recovery time; reduces switching loss and EMI in high-frequency converters (>100 kHz) |
| VF | 0.9 V @ 3 A, 25 °C - low forward drop improves efficiency and reduces thermal load on PCB traces |
| RθJL | 12 °C/W - low junction-to-lead thermal resistance enables direct thermal coupling to copper pour or heatsink tab |
| IFSM | 125 A @ 8.3 ms - handles inrush and transient overloads without failure in SMPS startup or fault conditions |
| CJ | 45 pF @ 4 V - low junction capacitance minimizes capacitive coupling and ringing in high-dv/dt environments |
Pinout & Package
Package: DO-214AB (SMC) - molded plastic case with matte tin-plated leads, J-STD-002 solderable, UL 94V-0 rated, polarity indicated by cathode band.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Anode | Forward current entry point | Connected to lower-potential node (e.g., switch node in buck converter); requires adequate copper area for thermal dissipation |
| Cathode | Forward current exit / reverse blocking terminal | Connected to output rail or ground return; cathode band marks this terminal for correct PCB orientation and assembly verification |
Key Features
| Feature | Design Value |
|---|---|
| Glass passivated junction | Enhances long-term reliability under humidity and thermal cycling; eliminates need for conformal coating in industrial-grade designs |
| Ultra-fast 20 ns recovery | Enables >300 kHz operation in LLC and phase-shifted full-bridge topologies without excessive switching loss or snubber complexity |
| DO-214AB (SMC) package | Supports automated pick-and-place (IPC-7351B compliant), offers 0.200 g weight and low profile for space-constrained board stacking |
| J-STD-020 Level 1 moisture sensitivity | Eliminates bake requirements before reflow; compatible with standard SMT lines without dry pack handling or floor life tracking |
| RoHS & halogen-free | Meets IEC 61249-2-21 and EU RoHS Directive 2011/65/EU; suitable for export to regulated markets including EU, Japan, and South Korea |
Applications
| Telecom AC-DC Adapters | Server VRM Output Rectification |
|---|---|
Use Scenario: Secondary-side rectification in 48 V input telecom AC-DC adapters delivering 12 V/20 A outputs. IC Role / Device Role / Timing Role: Ultra-fast output rectifier replacing Schottky diodes where higher VRRM margin is required against line transients. Use Value: 150 V VRRM provides 25% headroom above 48 V × √2 + margin, while 20 ns trr maintains efficiency at 250 kHz switching frequency. | Use Scenario: Synchronous rectifier backup or freewheeling path in multiphase server VRMs with 3.3 V/60 A output. IC Role / Device Role / Timing Role: Freewheeling diode across high-side MOSFET in buck converter phase legs during dead-time conduction. Use Value: Low 0.9 V VF limits conduction loss during brief freewheeling intervals, and 125 A IFSM withstands phase-current overshoot during load-step events. |
| Industrial PLC Power Supplies | 5G Remote Radio Unit (RRU) DC-DC |
Use Scenario: Input rectification stage in wide-input (90–305 VAC) DIN-rail power supplies for programmable logic controllers. IC Role / Device Role / Timing Role: Bridge rectifier leg component in full-wave configuration, operating continuously at 60 °C ambient. Use Value: 175 °C TJMAX and 12 °C/W RθJL allow reliable operation without forced air, even with 10 K/W system thermal resistance. | Use Scenario: Isolated DC-DC converter in outdoor 5G RRU units requiring -40 °C to +85 °C operation with high MTBF. IC Role / Device Role / Timing Role: Secondary-side rectifier in 48 V to 5 V isolated flyback supplying FPGA and RF front-end bias rails. Use Value: Glass passivation and JESD201 Class 2 whisker resistance ensure reliability over 10-year field life in temperature-cycled outdoor enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-fast rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STTH3L06S (STMicroelectronics) | Same 3 A / 600 V rating but slower trr (35 ns), higher VF (1.15 V), TO-277 package | Higher voltage margin but reduced efficiency at >200 kHz; larger footprint than SMC | Prefer ESH3C where layout space and switching frequency are critical |
| MBR3150 (ON Semiconductor) | Schottky diode: 3 A / 150 V, VF = 0.82 V, but limited to 125 °C TJMAX, no glass passivation | Better efficiency at low voltage but unsuitable for high-temp or humid environments | Prefer ESH3C where junction temperature exceeds 125 °C or reliability under humidity is required |
Compared with STTH3L06S and MBR3150, the ESH3C delivers optimal balance of speed (20 ns), thermal robustness (175 °C), and package compactness (SMC) for high-density, high-reliability telecom and industrial SMPS - without sacrificing voltage margin or moisture resilience.
Availability
ESH3C is available at Aetrix Electronics and suitable for telecom AC-DC adapters, server VRM freewheeling paths, and industrial PLC power supplies requiring stable component supply, long-lifecycle assurance, and J-STD-020 Level 1 handling.
Supply support for ESH3C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS devices, and MOSFETs for industrial and computing markets.
The ESH3x series belongs to TSC's ultra-fast rectifier product line, engineered specifically for high-frequency switching power conversion where low trr, stable VF, and rugged packaging are essential for efficiency and reliability.
FAQ
What is the maximum repetitive peak reverse voltage (VRRM) for ESH3C?
The ESH3C has a maximum repetitive peak reverse voltage (VRRM) of 150 V, as specified in the Absolute Maximum Ratings table. This value is fixed for the ESH3C variant and distinguishes it from ESH3B (100 V) and ESH3D (200 V). The 150 V rating ensures safe operation in 48 V and 110 V DC systems with transient margin, and is validated per JEDEC test conditions.
Does ESH3C support automated SMT assembly?
Yes, the ESH3C supports automated surface-mount assembly. Its DO-214AB (SMC) package features matte tin-plated leads compliant with J-STD-002, low-profile geometry, and J-STD-020 Level 1 moisture sensitivity - eliminating bake requirements and enabling direct use from sealed tape-and-reel packaging in standard reflow lines.
What is the reverse recovery time (trr) of ESH3C and how is it measured?
The ESH3C has a maximum reverse recovery time (trr) of 20 ns, measured under IF = 0.5 A, IR = 1.0 A, and Irr = 0.25 A per the Electrical Specifications table. This ultra-fast recovery is achieved via optimized carrier lifetime control and is critical for minimizing switching loss in converters operating above 100 kHz.
Is ESH3C RoHS and halogen-free compliant?
Yes, the ESH3C is fully RoHS compliant per EU Directive 2011/65/EU and halogen-free per IEC 61249-2-21. These compliance statements are confirmed in the Features section and verified through material declarations provided by Taiwan Semiconductor, supporting global market access and green manufacturing requirements.
What thermal performance metrics are specified for ESH3C?
The ESH3C specifies a junction-to-lead thermal resistance (RθJL) of 12 °C/W and junction-to-ambient (RθJA) of 47 °C/W. These values enable accurate thermal design: RθJL supports direct copper pour heat sinking, while RθJA applies to standard 1-inch² 2-oz copper pad per JEDEC 51-3.
ESH3C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- DO-214AB, SMC
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 150 V
- Current - Average Rectified (Io):
- 3A
- Voltage - Forward (Vf) (Max) @ If:
- -
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 20 ns
- Current - Reverse Leakage @ Vr:
- 5 µA @ 150 V
- Capacitance @ Vr, F:
- 45pF @ 4V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DO-214AB (SMC)
- Operating Temperature - Junction:
- -55°C ~ 175°C
ESH3C FAQ
1.How can I place an order for ESH3C through Aetrix?
Please submit a Request for Quotation (RFQ) for ESH3C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for ESH3C reliable?
The price and inventory of ESH3C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for ESH3C is usually 5 days.
3.What payment methods are accepted for ESH3C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for ESH3C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for ESH3C?
ESH3C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your ESH3C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for ESH3C?
For technical support, including ESH3C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your ESH3C requirements.
6.How does Aetrix verify that ESH3C is sourced from the original manufacturer or authorized distributors?
All ESH3C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that ESH3C meets industry standards.
7.What is the process for return or replacement of ESH3C?
All ESH3C units undergo pre-shipment inspection (PSI). If there is an issue with ESH3C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The ESH3C part is unused and in its original packaging.
Return procedure for ESH3C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
ESH3C Tags

-
1N4448X-TP
Micro Commercial Co

-
1N4148WX-TP
Micro Commercial Co

-
1N4148TR
onsemi

-
MMSD4148T1G
onsemi

-
MMBD914LT3G
onsemi

-
BAS16HT1G
onsemi

-
1N914BWT
onsemi

-
BAS21LT1G
onsemi

-
LL4148
onsemi

-
BAS16LT1G
onsemi

-
MMSD914T1G
onsemi

-
BAV21W-7-F
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
