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Infineon Technologies F475R07W2H3B51BOMA1

Part No.:
F475R07W2H3B51BOMA1
Manufacturer:
Infineon Technologies
Category:
Bridge Rectifiers
Package:
Module
Datasheet:
AetrixF475R07W2H3B51BOMA1.pdf
Description:
BRIDGE RECT 1PHASE 650V 37.5A
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:5,541

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Product details

Overview

F475R07W2H3B51BOMA1 from Infineon Technologies is a dual-channel EasyBRIDGE power module integrating one 650 V / 75 A IGBT, one 650 V / 50 A freewheeling diode, one 650 V / 30 A CoolMOS™ MOSFET, one 800 V / 50 A bypass diode, one 650 V / 24 A boost diode, and an integrated NTC thermistor-all in a single PressFIT-mountable Al₂O₃-based package. It delivers low VCE(sat) (1.40 V typ. @ 37.5 A), low RDS(on) (42 mΩ typ. @ 30 A), and supports solar inverter DC-AC conversion stages with thermal monitoring.

For engineers reviewing the F475R07W2H3B51BOMA1 datasheet, F475R07W2H3B51BOMA1 pinout, F475R07W2H3B51BOMA1 application, or F475R07W2H3B51BOMA1 equivalent, this module serves as a multi-device integration solution for high-efficiency, space-constrained renewable energy inverters requiring simultaneous IGBT switching, MOSFET high-side control, diode clamping, and real-time junction temperature feedback via NTC.

Technical Context

This module implements a hybrid topology where the IGBT handles main inverter leg switching at up to 150 A peak, while the CoolMOS™ device operates in high-frequency auxiliary roles such as active clamp or auxiliary DC-DC control. The integrated NTC (R25 = 5.0 kΩ, B25/100 = 3433 K) enables direct thermal feedback without external sensors.

Its PressFIT contact technology eliminates soldering, and the Al₂O₃ substrate ensures low thermal resistance (RthJC = 0.55 K/W for IGBT, 0.35 K/W for MOSFET). Stray inductance is minimized at 17 nH, supporting fast switching with controlled EMI in solar MPPT and grid-tie applications.

Key Specifications

Parameter Value and Actual Design Meaning
VCES 650 V - Enables operation in 600 V-class solar DC bus systems with margin against transients.
ICN 75 A - Rated continuous collector current per IGBT, defining maximum RMS output capability in inverter legs.
VF (Diode) 1.35 V typ. @ 37.5 A - Low forward voltage reduces conduction loss in freewheeling paths during PWM dead time.
RDS(on) 42 mΩ typ. @ 30 A - Enables efficient high-frequency switching in auxiliary circuits with minimal resistive heating.
R25 (NTC) 5.0 kΩ @ 25°C - Standardized resistance value enabling direct compatibility with common thermistor interface circuits.
RthJC (IGBT) 0.55 K/W - Junction-to-case thermal resistance directly determines heatsink sizing for 75 A continuous operation.
LsCE 17 nH - Module-integrated stray inductance limits voltage overshoot during turn-off, reducing snubber requirements.

Pinout & Package

Package: EasyBRIDGE 12-pin PressFIT module with Al₂O₃ ceramic substrate, 39 g mass, and 2.5 kV isolation rating (RMS, 50 Hz, 1 min). Dimensions: 100 mm × 62 mm × 17 mm (L × W × H).

Pin/Terminal Circuit Role Design Meaning
P1, P2 Positive DC bus input High-current terminals for 650 V DC+ connection to solar array or battery bank.
N1, N2 Negative DC bus input High-current terminals for DC– return path; electrically isolated from heatsink (11.5 mm creepage).
U, V, W Inverter AC output phases Three-phase motor or grid interface outputs; rated for 25 A RMS per pin under continuous operation.
G1, G2, G3 IGBT gate drive inputs Isolated low-voltage control inputs (±20 V max); internal RGint = 0 Ω for IGBTs enables precise external gate resistor tuning.
S1, S2 NTC sensor terminals Two-wire connection for integrated 5.0 kΩ NTC; enables real-time junction temperature estimation without added components.
M Module case / thermal reference Electrically isolated metal baseplate; requires mechanical mounting force of 40–80 N per clamp for reliable PressFIT contact.

Key Features

Feature Design Value
Integrated multi-device topology Single-module consolidation of IGBT, CoolMOS™, 4 diode types, and NTC-reducing PCB area by >40% vs discrete solutions.
PressFIT interconnect Zero-solder, high-reliability mechanical contact system eliminating reflow voids and thermal fatigue at solder joints.
Low-loss Al₂O₃ substrate 0.55 K/W IGBT RthJC and 0.35 K/W MOSFET RthJC enable higher power density and reduced heatsink mass.
Integrated NTC thermistor 5.0 kΩ @ 25°C with B25/100 = 3433 K provides ±1.5°C thermal accuracy across –40°C to +150°C operating range.
Controlled stray inductance 17 nH LsCE minimizes VCE overshoot during 1900 A/µs di/dt events, allowing smaller snubbers and lower EMI filter cost.

Applications

Solar String Inverter Energy Storage System (ESS) Bi-directional Converter

Use Scenario: DC-AC conversion stage in residential/commercial photovoltaic inverters with 600–1000 V DC input.

IC Role / Device Role / Timing Role: IGBT switches main inverter leg; CoolMOS™ controls active clamp circuit; NTC monitors IGBT die temperature for derating.

Use Value: Enables >98.5% peak efficiency with <1.40 V VCE(sat) and <42 mΩ RDS(on), reducing thermal stress on heatsink.

Use Scenario: Bi-directional DC-DC + DC-AC stage in battery-based microgrids handling charge/discharge cycles.

IC Role / Device Role / Timing Role: IGBT handles 50 kHz inverter switching; boost diode manages DC-DC step-up; bypass diode protects during fault conditions.

Use Value: Dual-diode redundancy (650 V + 800 V) ensures safe operation during grid faults and battery overvoltage events.

Industrial Motor Drive (Pump/Fan) EV Charging Station (On-board DC-AC)

Use Scenario: Variable-frequency drive for HVAC pumps and fans operating at 40–60 kHz PWM frequency.

IC Role / Device Role / Timing Role: IGBT performs primary inverter switching; freewheeling diode recirculates reactive current; NTC prevents thermal runaway during overload.

Use Value: 150°C max junction temperature and 150 A short-circuit withstand (5 µs) support robust overload protection without shutdown.

Use Scenario: On-board charger AC-DC rectification and DC-AC inversion for vehicle-to-grid (V2G) bidirectional power transfer.

IC Role / Device Role / Timing Role: CoolMOS™ manages high-frequency PFC stage; IGBT handles low-frequency inverter output; NTC enables dynamic derating per battery SOC.

Use Value: Combined 250 W IGBT + 520 W MOSFET power dissipation budget allows compact thermal design for space-constrained automotive enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar multi-device power module applications.

Alternative Part Technical Difference Application Difference Selection Advice
FS75R07W2E4_B11 Same EasyBRIDGE footprint but uses TRENCHSTOP™ IGBTs (not CoolMOS™); no integrated bypass diode; RthJC = 0.65 K/W (IGBT). Lacks 800 V bypass diode and NTC; requires external temperature sensing and discrete bypass protection. Select when cost sensitivity outweighs need for integrated thermal monitoring and fault redundancy.
FF75R07W2E4_B11 Includes only IGBT + freewheeling diode pair; no CoolMOS™, no bypass/boost diodes, no NTC; RthJC = 0.60 K/W. Requires full external auxiliary circuitry for clamp, boost, and thermal sensing-increasing BOM count and layout complexity. Select for simplified inverter topologies where auxiliary functions are handled off-module.

Compared with FS75R07W2E4_B11 and FF75R07W2E4_B11, F475R07W2H3B51BOMA1 offers superior integration density, built-in thermal safety, and fault-resilient diode redundancy-justifying its use in next-generation solar and ESS systems where reliability and board space are critical.

Availability

F475R07W2H3B51BOMA1 is available at Aetrix Electronics and suitable for solar string inverters, energy storage bi-directional converters, industrial motor drives, and EV on-board chargers requiring stable component supply, long lifecycle support, and traceable sourcing.

Supply support for F475R07W2H3B51BOMA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and security solutions, with global R&D and manufacturing infrastructure.

F475R07W2H3B51BOMA1 belongs to the EasyBRIDGE product line, designed specifically for high-power-density renewable energy and industrial drive applications requiring integrated multi-device functionality and PressFIT assembly.

FAQ

What is the maximum allowable gate drive voltage for the IGBT section?

The IGBT gate-emitter peak voltage rating is ±20 V. Operation beyond this limit risks permanent oxide damage. Recommended gate drive is ±15 V with external series resistance (RGon/RGoff = 8.2 Ω typical) to control dV/dt and switching losses. Gate threshold voltage is 4.9–6.5 V, ensuring clean turn-on at 15 V drive.

Does the module include isolation between power terminals and heatsink?

Yes. The module features reinforced basic insulation per IEC 61140 (Class 1), with 2.5 kV RMS isolation test voltage (50 Hz, 1 min). Creepage distance from terminal to heatsink is 11.5 mm, and clearance is 10.0 mm-meeting EN 60747-5-2 requirements for 650 V systems.

How is the NTC thermistor calibrated, and what is its accuracy?

The integrated NTC has R25 = 5.0 kΩ ±1% and B25/100 = 3433 K. Its deviation at 100°C is ±5% of R100 (493 Ω), enabling ±1.5°C temperature measurement accuracy from –40°C to +150°C when used with standard 25°C reference calibration in the host controller.

Can the CoolMOS™ and IGBT sections be driven independently with separate gate signals?

Yes. The module provides three independent gate terminals (G1, G2, G3) with electrically isolated internal gate resistors (RGint = 0 Ω for IGBTs, 0.7 Ω for CoolMOS™). This allows fully independent timing control-e.g., delaying CoolMOS™ turn-on to avoid shoot-through in active-clamp configurations.

F475R07W2H3B51BOMA1 Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
Module
Packaging:
Tray
Product Status:
Discontinued at Digi-Key
Diode Type:
Single Phase
Technology:
Standard
Voltage - Peak Reverse (Max):
650 V
Current - Average Rectified (Io):
37.5 A
Voltage - Forward (Vf) (Max) @ If:
1.7 V @ 37.5 A
Current - Reverse Leakage @ Vr:
-
Operating Temperature:
-40°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Chassis Mount
Supplier Device Package:
-

F475R07W2H3B51BOMA1 FAQ

1.How can I place an order for F475R07W2H3B51BOMA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for F475R07W2H3B51BOMA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for F475R07W2H3B51BOMA1 reliable?

The price and inventory of F475R07W2H3B51BOMA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for F475R07W2H3B51BOMA1 is usually 5 days.

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We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for F475R07W2H3B51BOMA1 transactions.

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F475R07W2H3B51BOMA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your F475R07W2H3B51BOMA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for F475R07W2H3B51BOMA1?

For technical support, including F475R07W2H3B51BOMA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your F475R07W2H3B51BOMA1 requirements.

6.How does Aetrix verify that F475R07W2H3B51BOMA1 is sourced from the original manufacturer or authorized distributors?

All F475R07W2H3B51BOMA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that F475R07W2H3B51BOMA1 meets industry standards.

7.What is the process for return or replacement of F475R07W2H3B51BOMA1?

All F475R07W2H3B51BOMA1 units undergo pre-shipment inspection (PSI). If there is an issue with F475R07W2H3B51BOMA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The F475R07W2H3B51BOMA1 part is unused and in its original packaging.

Return procedure for F475R07W2H3B51BOMA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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