STMicroelectronics FERD20U50DJF-TR

Overview

FERD20U50DJF-TR from STMicroelectronics is a 50 V, 20 A field-effect rectifier diode in PowerFLAT™ 5x6 package, featuring 0.44 V typical forward voltage at 20 A and 125 °C, stable leakage current up to 60 mA at 125 °C, and optimized for high-frequency freewheeling in DC/DC converters and battery chargers.

For engineers reviewing the FERD20U50DJF-TR datasheet, FERD20U50DJF-TR pinout, FERD20U50DJF-TR application, or FERD20U50DJF-TR equivalent, key selection criteria include junction-to-case thermal resistance (2.6 °C/W), repetitive peak reverse voltage (50 V), average forward current rating (20 A at TC = 115 °C), and ECOPACK®2 compliance for environmental design.

Technical Context

This device employs ST's patented field-effect rectifier process to achieve superior VF/IR trade-off on minimal silicon area. It operates with low conduction loss (P = 0.25 × IF(AV) + 0.011 × IF²(RMS)) and supports high-frequency switching due to low junction capacitance (e.g., ~1000 pF at 1 V VR, 1 MHz).

Thermal performance is defined by Rth(j–c) = 2.6 °C/W and maximum junction temperature of 150 °C, requiring PCB copper area optimization per Figure 7 (e.g., ~7 cm² for Rth(j–a) ≈ 4 °C/W on FR4). Reverse leakage remains controlled across temperature (800 µA at 25 °C, 60 mA at 125 °C).

Key Specifications

Pinout & Package

Package: PowerFLAT™ 5x6 - 5 mm × 6 mm × 1.0 mm body with exposed thermal pad (cathode-connected) on bottom side; designed for conduction cooling via PCB copper pour.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-current, low-VF rectifier applications.

Compared with STTH20L05DJF-TR and MBR2050CTG, FERD20U50DJF-TR delivers the lowest conduction loss at elevated temperature and superior leakage stability-critical for sealed, high-power-density converters where thermal margin is constrained.

Availability

FERD20U50DJF-TR is available at Aetrix Electronics and suitable for set-top box power supplies, battery charger output stages, and DC/DC converter freewheeling applications requiring stable component supply, high thermal reliability, and RoHS-compliant packaging.

Supply support for FERD20U50DJF-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, power, microcontroller, and sensor solutions for industrial, automotive, and consumer markets.

FERD20U50DJF-TR belongs to ST's Power Rectifiers product line, engineered specifically for high-efficiency, high-reliability switch-mode power conversion where low forward voltage and thermal robustness are primary design constraints.

FAQ

What is the thermal pad connection requirement for FERD20U50DJF-TR?

The exposed thermal pad on the bottom of the PowerFLAT™ 5x6 package is internally connected to the cathode (K). It must be soldered to a minimum 7 cm² copper area on the PCB for optimal thermal performance (Rth(j–a) ≈ 4 °C/W). No isolation or floating layout is permitted-this pad serves both thermal and electrical return functions.

Does FERD20U50DJF-TR support synchronous rectification drive?

No. FERD20U50DJF-TR is a passive unidirectional rectifier diode-not a MOSFET or integrated driver-and cannot be actively controlled. It operates solely by forward bias conduction and reverse blocking. Synchronous rectification requires externally driven N-channel MOSFETs with gate timing control.

How does its leakage current compare to standard Schottky diodes at 125 °C?

At 125 °C and VRRM = 50 V, FERD20U50DJF-TR exhibits ≤60 mA IR-significantly more stable than typical Schottkys (e.g., MBR2050CTG shows >500 mA IR under same conditions). This stability avoids thermal runaway in high-ambient environments where Schottky leakage would escalate uncontrollably.

Can it replace a 20 A TO-220 rectifier in existing layouts?

No direct footprint replacement is possible: FERD20U50DJF-TR uses PowerFLAT™ 5x6 (5×6 mm SMT), while TO-220 packages require through-hole mounting, larger keep-out, and different thermal vias. Layout redesign-including copper pour, stencil aperture, and reflow profile-is required to leverage its superior thermal resistance and low-profile form factor.