STMicroelectronics FERD20U60DJF-TR

Overview

FERD20U60DJF-TR from STMicroelectronics is a field-effect rectifier diode in PowerFLAT™ 5x6 package, rated for 20 A average forward current and 60 V repetitive peak reverse voltage, with typical forward voltage drop of 350 mV at 10 A and 25 °C, designed for high-frequency freewheeling and output rectification in switch-mode power supplies.

For engineers reviewing the FERD20U60DJF-TR datasheet, FERD20U60DJF-TR pinout, FERD20U60DJF-TR application, or FERD20U60DJF-TR equivalent, key selection criteria include low conduction loss (VF/IR trade-off), thermal resistance (Rth(j-c) = 2.6 °C/W), junction temperature limit (150 °C), and PowerFLAT 5x6 surface-mount compatibility for compact, high-efficiency DC-DC converters.

Technical Context

This device employs ST's proprietary field-effect rectifier technology to minimize forward voltage while maintaining stable reverse leakage across temperature-typical IR is 800 µA at 25 °C and rises to 70 mA at 125 °C under VRRM. Its low VF (0.35–0.51 V depending on IF and Tj) directly reduces conduction losses in high-duty-cycle SMPS topologies.

The PowerFLAT 5x6 package enables efficient conduction cooling with Rth(j-c) = 2.6 °C/W and supports high RMS current handling (IF(RMS) = 45 A), making it suitable for synchronous rectifier replacement where fast recovery and minimal reverse recovery charge are not required-but low VF and thermal robustness are critical.

Key Specifications

Pinout & Package

Package: PowerFLAT™ 5x6 (8-lead, exposed thermal pad), JEDEC-compliant surface-mount package with UL94 V0 epoxy and conduction-cooling optimized layout.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar field-effect rectifier applications.

Compared with STTH2006DI and MBR2060CT, FERD20U60DJF-TR delivers lowest conduction loss in SMT form factor, superior thermal coupling via PowerFLAT pad, and optimized VF/IR balance for 60 V-class secondary-side rectification-making it the preferred choice for space-constrained, efficiency-critical SMPS outputs.

Availability

FERD20U60DJF-TR is available at Aetrix Electronics and suitable for server VRMs, industrial PLC power supplies, laptop AC-DC adapters, and LED driver constant-current stages requiring stable component supply and long-term production continuity.

Supply support for FERD20U60DJF-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing analog, microcontroller, power, and sensor solutions for industrial, automotive, and consumer markets.

This device belongs to ST's Power Devices portfolio, specifically engineered for high-efficiency, high-reliability power conversion-targeting next-generation switch-mode power supplies where low VF, thermal robustness, and SMT manufacturability are essential.

FAQ

What is the thermal pad connection requirement for FERD20U60DJF-TR?

The exposed thermal pad (anode) must be soldered to a minimum 4.11 mm × 4.31 mm copper area on the PCB, with ≥35 µm copper thickness, to achieve the specified Rth(j-c) = 2.6 °C/W. Thermal vias to inner ground planes are recommended for sustained 20 A operation.

Does FERD20U60DJF-TR have a specified reverse recovery time (t_rr)?

No-this is a field-effect rectifier, not a PN-junction or Schottky diode. It exhibits no minority-carrier storage, so t_rr is not defined or measured. Its switching behavior is governed solely by junction capacitance (C_j ≈ 1000 pF @ 0 V), enabling clean turn-off without reverse recovery spikes.

Can FERD20U60DJF-TR replace a standard Schottky diode in an existing design?

Yes-if the circuit operates ≤60 V reverse bias and benefits from lower VF. However, its anode-is-tab construction requires PCB layout revision: the thermal pad must connect to the high-side net, unlike Schottky packages where the tab is typically cathode. Verify net connectivity before substitution.

What is the surge current rating and test condition for FERD20U60DJF-TR?

IFSM = 180 A for tp = 10 ms sinusoidal half-cycle at 25 °C ambient. This rating assumes ideal heat sinking-actual surge capability drops significantly if case temperature exceeds 115 °C or if multiple surges occur without sufficient cooling interval.