Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Discrete Semiconductor Products > Diodes > Rectifiers > Single Diodes

STMicroelectronics FERD30H100SB-TR

Name: FERD30H100SB-TR
Brand: STMicroelectronics
SKU: FERD30H100SB-TR
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: FERD30H100SB-TR

Manufacturer:: STMicroelectronics

Category:: Single Diodes

Package:: TO-252-3, DPAK (2 Leads + Tab), SC-63

Datasheet:: FERD30H100SB-TR.pdf

Description:: DIODE FERD 100V 30A DPAK

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:11,153

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

FERD30H100SB-TR from STMicroelectronics is a 100 V field-effect rectifier diode in DPAK package, rated for 30 A average forward current, 0.405 V max forward voltage at 30 A/125 °C, and 130 µA max reverse leakage at 25 °C/V_RRM. It replaces Schottky diodes in high-efficiency, thermally constrained AC/DC front-ends and switch-mode power supplies.

For engineers reviewing the FERD30H100SB-TR datasheet, FERD30H100SB-TR pinout, FERD30H100SB-TR application, or FERD30H100SB-TR equivalent, key selection criteria include its VF/IR trade-off stability over temperature, junction-to-case thermal resistance of 0.9 °C/W, ECOPACK®2 compliance, and suitability for confined-casing 100 V rectification where thermal runaway risk must be minimized.

Technical Context

This device uses ST's proprietary field-effect rectifier process to decouple forward voltage (VF) and reverse leakage (IR) dependencies on temperature-reducing thermal runaway risk versus conventional Schottky diodes. Its VF remains ≤0.745 V at 30 A/125 °C, while IR stays ≤16 mA at 125 °C/V_RRM.

Designed for high-frequency operation, it exhibits low junction capacitance (typ. 1000 pF at 0 V, 1 MHz), enabling use in PFC stages and resonant converters up to several hundred kHz. The DPAK package supports conduction cooling with verified thermal impedance performance across copper pad areas from 0 to 100 cm².

Key Specifications

Parameter	Value and Actual Design Meaning
V_RRM	100 V - Maximum repetitive reverse blocking voltage; defines safe operating limit in bridge or flyback snubber circuits.
I_F(AV)	30 A - Average forward current at T_C = 145 °C; sets continuous conduction capability in high-power rectifiers.
V_F (max)	0.405 V at 30 A / 125 °C - Low conduction loss enables >98% efficiency in 100 V output rails with minimal heatsink requirement.
I_R (max)	130 µA at 25 °C / V_RRM - Ultra-low leakage preserves standby power budget in energy-efficient adapters.
T_j(max)	175 °C - Enables operation in high-ambient environments (e.g., enclosed industrial PSUs) without derating penalties.
R_th(j–c)	0.9 °C/W - Confirmed thermal path from junction to case; allows accurate heatsink sizing using standard conduction models.
Package	DPAK - Surface-mount, thermally enhanced outline with exposed drain tab; compatible with automated reflow and wave soldering.

Pinout & Package

The FERD30H100SB-TR is a 3-terminal DPAK device: Anode (A), Cathode (K), and Drain (D) - where the Drain is internally tied to the cathode and forms the electrically active thermal pad. The package features an exposed metal tab (Drain) for direct PCB thermal coupling.

Pin/Terminal	Circuit Role	Design Meaning
Anode (A)	Input terminal for forward conduction	Connected to AC input or switching node; carries full load current during conduction phase.
Cathode (K)	Output terminal for forward conduction	Connected to DC bus or output capacitor; serves as common reference for gate drivers in synchronous designs.
Drain (D) / Tab	Thermal and electrical connection to cathode	Must be soldered to large copper pour for thermal management; electrically identical to cathode; no isolation required.

Key Features

Feature	Design Value
ST advanced rectifier process	Enables VF/IR optimization unattainable with standard Schottky or PN processes-verified by 0.405 V/30 A and 130 µA specs.
Stable leakage vs. temperature	IR increases only 123× (130 µA → 16 mA) from 25 °C to 125 °C-vs. >1000× for typical Schottkys-reducing thermal runaway probability.
Low VF at high T_j	0.745 V max at 30 A/125 °C ensures <10 W conduction loss in 1 kW PFC stage, minimizing heatsink volume.
ECOPACK®2 compliance	Halogen-free, RoHS-compliant epoxy meets UL94 V0 flammability rating-validates use in safety-certified end equipment.
High-frequency capability	Junction capacitance ≤1000 pF at 0 V enables clean turn-off in 300–500 kHz LLC resonant converters without excessive ringing.

Applications

Server PSU Front-End Rectification

Industrial AC/DC Adapter

Use Scenario: High-density 1U server power supply with 100 V output rail and <15 mm height constraint.

IC Role / Device Role / Timing Role: Primary-side freewheeling rectifier in active clamp forward topology.

Use Value: 0.9 °C/W R_th(j–c) and 30 A rating allow full-load operation with 25 cm² copper pour-eliminating external heatsink.

Use Scenario: DIN-rail mounted 24 V/48 V industrial adapter operating continuously at 60 °C ambient.

IC Role / Device Role / Timing Role: Output rectifier in asymmetric half-bridge converter.

Use Value: Stable 0.405 V V_F at 125 °C maintains <2% output regulation drift across temperature, avoiding feedback loop recalibration.

Telecom Power Shelf

EV Onboard Charger Auxiliary Supply

Use Scenario: -40 °C to +70 °C telecom rectifier module requiring zero derating at full load.

IC Role / Device Role / Timing Role: Input rectifier in dual-active-bridge isolated DC/DC stage.

Use Value: 175 °C T_j(max) and low IR drift enable operation at 145 °C case temperature without lifetime penalty.

Use Scenario: Auxiliary 12 V supply in 6.6 kW OBC, sharing thermal plane with main SiC MOSFETs.

IC Role / Device Role / Timing Role: Secondary-side synchronous rectifier replacement in flyback auxiliary winding.

Use Value: Cathode-tied drain tab allows shared thermal pad with primary-side controller IC-reducing board layer count by one.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-efficiency 100 V rectification applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
STTH30L06CW	60 V V_RRM, 30 A I_F(AV), 0.95 V V_F (max) at 30 A/125 °C - higher VF, lower voltage rating.	Only suitable for ≤60 V systems; cannot replace in 100 V PFC or telecom rectifiers.	Select only if system V_RRM margin is <65 V and thermal design tolerates +5.5 W extra loss.
Vishay VS-30CPH06-M3	60 V V_RRM, 30 A I_F(AV), 0.62 V V_F (typ) at 30 A/125 °C - lower VF than STTH30L06CW but still 50% higher than FERD30H100SB-TR.	Limited to 60 V applications; lacks documented thermal stability data across 25–125 °C.	Acceptable only in cost-sensitive 60 V designs where 0.22 V higher VF is acceptable and thermal runaway risk is mitigated externally.

Compared with STTH30L06CW and VS-30CPH06-M3, FERD30H100SB-TR uniquely delivers 100 V blocking with sub-0.41 V VF at full load and 125 °C-enabling smaller heatsinks, higher power density, and elimination of forced air cooling in 100 V systems.

Availability

FERD30H100SB-TR is available at Aetrix Electronics and suitable for server power supplies, industrial AC/DC adapters, telecom rectifier modules, and EV onboard charger auxiliary supplies requiring stable component supply, long-term lifecycle support, and consistent thermal performance across temperature extremes.

Supply support for FERD30H100SB-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, designing and manufacturing microcontrollers, power devices, analog ICs, and sensors for automotive, industrial, and consumer markets.

This device belongs to ST's Field-Effect Rectifier (FERD) product line-engineered specifically to overcome thermal instability limitations of Schottky diodes in high-voltage, high-current rectification applications.

FAQ

What is the maximum allowable case temperature for continuous operation?

The device is rated for I_F(AV) = 30 A at T_C = 145 °C per datasheet Table 2. Operation above this temperature requires linear derating per Figure 1; at T_C = 160 °C, I_F(AV) drops to ~22 A. Exceeding 175 °C junction temperature violates absolute maximum ratings and risks permanent failure.

Can FERD30H100SB-TR be used as a drop-in replacement for Schottky diodes in existing designs?

No direct drop-in replacement is guaranteed: although pin-compatible in DPAK, its cathode-connected drain tab requires matching PCB thermal pad layout. Also, its lower VF reduces conduction loss but may alter snubber timing or control loop dynamics-validation under worst-case load and temperature is mandatory.

Is the DPAK variant lead-free and RoHS compliant?

Yes. FERD30H100SB-TR is manufactured in an ECOPACK®2-compliant process: halogen-free, lead-free, and fully RoHS 2011/65/EU compliant. The "-TR" suffix confirms tape-and-reel packaging with moisture sensitivity level (MSL) 1 rating for standard SMT handling.

How does its thermal resistance compare between DPAK and TO-220AB variants?

R_th(j–c) is identical (0.9 °C/W) for both DPAK (FERD30H100SB-TR) and TO-220AB (FERD30H100STS) packages per Table 3. However, DPAK relies on PCB copper area for heat spreading, while TO-220AB uses bolted heatsinks-making DPAK more sensitive to PCB layout but eliminating mechanical assembly steps.

FERD30H100SB-TR Specifications

Product attributes: Attribute value

Manufacturer:: STMicroelectronics

Series:: -

Package/Case:: TO-252-3, DPAK (2 Leads + Tab), SC-63

Packaging:: Tape & Reel (TR)

Product Status:: Active

Technology:: FERD (Field Effect Rectifier Diode)

Voltage - DC Reverse (Vr) (Max):: 100 V

Current - Average Rectified (Io):: 30A

Voltage - Forward (Vf) (Max) @ If:: -

Speed:: Fast Recovery =< 500ns, > 200mA (Io)

Reverse Recovery Time (trr):: -

Current - Reverse Leakage @ Vr:: -

Capacitance @ Vr, F:: -

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:: DPAK

Operating Temperature - Junction:: 175°C (Max)

FERD30H100SB-TR FAQ

1.How can I place an order for FERD30H100SB-TR through Aetrix?

Please submit a Request for Quotation (RFQ) for FERD30H100SB-TR on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for FERD30H100SB-TR reliable?

The price and inventory of FERD30H100SB-TR are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FERD30H100SB-TR is usually 5 days.

3.What payment methods are accepted for FERD30H100SB-TR?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FERD30H100SB-TR transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for FERD30H100SB-TR?

FERD30H100SB-TR orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your FERD30H100SB-TR order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for FERD30H100SB-TR?

For technical support, including FERD30H100SB-TR datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FERD30H100SB-TR requirements.

6.How does Aetrix verify that FERD30H100SB-TR is sourced from the original manufacturer or authorized distributors?

All FERD30H100SB-TR products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FERD30H100SB-TR meets industry standards.

7.What is the process for return or replacement of FERD30H100SB-TR?

All FERD30H100SB-TR units undergo pre-shipment inspection (PSI). If there is an issue with FERD30H100SB-TR, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The FERD30H100SB-TR part is unused and in its original packaging.

Return procedure for FERD30H100SB-TR:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-09 Counterfeit Electronic Components: How to Detect, Authenticate, and Test Suspect Parts

Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …

2026-09-08 Obsolete Electronic Components: How to Source and Evaluate Replacements

A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…