STMicroelectronics FERD30SM100DJFTR

Overview

FERD30SM100DJFTR from STMicroelectronics is a 100 V, 30 A field-effect rectifier diode in PowerFLAT™ 5x6 package, featuring 0.665 V typical forward voltage at 30 A/125 °C, 2.6 °C/W junction-to-case thermal resistance, and stable leakage current up to 16 mA at 125 °C/100 V - optimized for high-efficiency DC/DC converters and notebook adapters.

For engineers reviewing the FERD30SM100DJFTR datasheet, FERD30SM100DJFTR pinout, FERD30SM100DJFTR application, or FERD30SM100DJFTR equivalent, this device delivers verified low conduction loss, high-frequency switching capability, ECOPACK®2 compliance, and thermal performance validated for confined-space power designs requiring >175 °C junction operation.

Technical Context

This ST-patented field-effect rectifier uses a silicon process engineered to maximize VF/IR trade-off, enabling lower forward drop without sacrificing reverse leakage stability across temperature and voltage. Its unidirectional conduction architecture eliminates minority-carrier storage delay, supporting clean turn-off in MHz-range switching topologies.

The PowerFLAT™ 5x6 package integrates a thermally enhanced exposed copper die pad directly bonded to PCB copper, achieving 2.6 °C/W Rth(j-c) and enabling >45 A RMS handling with proper board layout - critical for compact adapter and LED driver thermal management.

Key Specifications

Pinout & Package

Package: PowerFLAT™ 5x6 - thermally enhanced, dual-side cooling capable, exposed copper thermal pad on bottom side, UL 94 V0 epoxy, 95 mg unit weight.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar field-effect rectifier applications.

Compared with STTH30L06CW and VS-30CPH06-M3, FERD30SM100DJFTR uniquely combines 100 V rating, sub-0.67 V VF, and 2.6 °C/W thermal resistance in a surface-mount package - making it the only option for space-constrained, high-efficiency 100 V rectification where thermal headroom and voltage margin are both critical.

Availability

FERD30SM100DJFTR is available at Aetrix Electronics and suitable for notebook adapters, LED lighting drivers, and DC/DC converters requiring stable component supply, high thermal reliability, and ECOPACK®2 environmental compliance.

Supply support for FERD30SM100DJFTR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader delivering intelligent power, analog, MEMS, and microcontroller solutions for automotive, industrial, and consumer markets.

FERD30SM100DJFTR belongs to ST's high-efficiency field-effect rectifier product line, designed specifically for high-frequency, high-density power conversion where low VF, stable IR, and superior thermal performance are mandatory.

FAQ

What is the maximum allowable case temperature for continuous operation?

The device is rated for IF(AV) = 30 A at TC = 100 °C, with absolute maximum junction temperature of +175 °C. Using Rth(j-c) = 2.6 °C/W, sustained case temperature must remain ≤100 °C to maintain safe junction margin - verified via thermal simulation or IR measurement under actual PCB copper area and airflow conditions.

Does FERD30SM100DJFTR have reverse recovery charge (Qrr)?

No - as a field-effect rectifier, it operates without minority-carrier injection and exhibits negligible reverse recovery charge. Datasheet curves confirm near-zero Qrr, eliminating switching loss and associated EMI seen in conventional PN diodes or even SiC Schottkys with tail current.

Can this diode replace a standard Schottky in an existing design?

Yes, provided the 100 V VRRM meets system requirements and the PowerFLAT™ 5x6 footprint matches layout. Its lower VF reduces conduction loss, but thermal pad soldering must follow AN5046 guidelines - insufficient copper area will cause excessive junction temperature rise despite identical electrical ratings.

Is the thermal pad electrically isolated?

No - the exposed thermal pad is internally connected to the cathode (K) terminal. PCB layout must treat the pad as part of the cathode net: no isolation gaps, no floating copper, and no connection to ground or other potentials unless cathode is referenced to that node.