STMicroelectronics FERD40U45CG-TR

Overview

FERD40U45CG-TR from STMicroelectronics is a dual-field-effect rectifier (FER) in D2PAK package, designed for high-frequency switch-mode power supplies and automotive-grade DC/DC conversion. It delivers 2 × 20 A average forward current per diode, 45 V repetitive peak reverse voltage, and typ. 0.31 V forward voltage drop at 125 °C/20 A - enabling low conduction loss in compact 48 V automotive auxiliary supplies.

For engineers reviewing the FERD40U45CG-TR datasheet, FERD40U45CG-TR pinout, FERD45CG-TR application, or FERD40U45CG-TR equivalent, key selection criteria include thermal resistance (R_th(j-c) = 1.1 °C/W total), stable leakage (<100 mA @ 125 °C/V_RRM), junction-to-case coupling (0.5 °C/W), and ECOPACK®-compliant RoHS packaging for industrial and automotive production environments.

Technical Context

This dual-diode rectifier uses ST's proprietary field-effect rectifier process to minimize VF/IR trade-off across temperature and voltage. Each die operates independently with shared thermal path through the common D2PAK copper tab, supporting simultaneous conduction without thermal runaway when dP_tot/dT_j < 1/R_th(j-a).

It is optimized for high-frequency operation (capacitance <10,000 pF @ 1 V_R, f = 1 MHz) and exhibits stable reverse leakage up to 125 °C - critical for under-hood automotive converters where ambient exceeds 105 °C and transient voltage spikes demand robust 45 V V_RRM margin.

Key Specifications

Pinout & Package

Package: D2PAK (TO-263AB), surface-mount, single-sided heatsink interface with exposed copper drain tab (pin 3). UL94 V0 epoxy, ECOPACK® compliant.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-field-effect rectifier applications.

Compared with STTH30L06D and MBR4045CT, FERD40U45CG-TR uniquely balances low V_F, controlled I_R, and integrated thermal coupling - making it optimal for space-constrained, high-efficiency 48 V automotive and telecom converters where thermal management and EMI are co-design constraints.

Availability

FERD40U45CG-TR is available at Aetrix Electronics and suitable for automotive DC/DC converters, server power supply secondary stages, and industrial motor drive auxiliary supplies requiring stable component supply, long-lifecycle support, and AEC-Q101-aligned manufacturing traceability.

Supply support for FERD40U45CG-TR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

STMicroelectronics is a global semiconductor leader headquartered in Geneva, Switzerland, designing and manufacturing microcontrollers, power devices, sensors, and analog ICs for automotive, industrial, and consumer markets.

This device belongs to ST's Field Effect Rectifier (FER) product line - engineered specifically to replace Schottky diodes in 30–60 V high-frequency power conversion where thermal stability and low forward voltage are jointly critical.

FAQ

What is the maximum junction temperature for continuous operation?

The absolute maximum junction temperature is 175 °C, but continuous operation above 150 °C requires derating per Figure 2 in the datasheet. At T_c = 145 °C, the device supports 20 A per diode (40 A total) with proper PCB copper area and airflow. Thermal runaway is prevented by design when dP_tot/dT_j < 1/R_th(j-a).

Can FERD40U45CG-TR be used in place of a standard Schottky diode?

Yes - it replaces Schottky diodes in 45 V-rated applications with superior thermal stability and lower V_F at elevated temperatures. Unlike Schottky devices, its leakage remains bounded (<100 mA @ 125 °C), eliminating thermal runaway risk. However, its D2PAK footprint differs from TO-277 or SMA packages, requiring PCB layout revision.

Is this device qualified for automotive applications?

While not AEC-Q101 certified, FERD40U45CG-TR is manufactured on ST's automotive-qualified process and explicitly intended for automotive applications per its datasheet description. It meets ECOPACK® environmental standards and has been deployed in production automotive DC/DC modules - qualification testing must be performed per end-system requirements.

What is the recommended PCB layout for thermal performance?

Mount the D2PAK tab directly to ≥15 cm² of 2-oz copper on the component layer, connected via ≥6 thermal vias (0.3 mm diameter, filled) to inner ground planes. Maintain ≥2 mm clearance from adjacent components per Figure 10 footprint. Avoid solder mask over the tab to ensure optimal thermal transfer to heatsink or chassis.