onsemi FES6G

Overview

FES6G from onsemi is an ultrafast surface-mount rectifier diode rated for 6 A average forward current and 400 V repetitive peak reverse voltage, featuring 1.20 V max forward voltage at 6 A and 25 ns typical reverse recovery time; it operates reliably from −55°C to +175°C and is AEC−Q101 qualified for automotive power conversion stages.

For engineers reviewing the FES6G datasheet, pinout, applications, or equivalent options, key selection criteria include its TO−277−3LD package with DAP option, low thermal resistance (6°C/W junction-to-lead), and stable performance at 150°C junction temperature in high-density DC/DC and motor drive designs.

Technical Context

The FES6G employs a planar epitaxial silicon structure optimized for ultrafast switching, with controlled carrier lifetime to achieve 25 ns reverse recovery time under IF = 0.5 A, IR = 1 A, IRR = 0.25 A test conditions. Its low VF (1.20 V @ 6 A, 25°C) and low CJ (45 pF @ 4 V, 1 MHz) support high-efficiency, low-noise operation in high-frequency rectification.

Thermally, the device uses a copper leadframe with direct-anode-package (DAP) construction, enabling 6°C/W junction-to-lead thermal resistance and continuous operation up to +175°C junction temperature-critical for under-hood automotive and industrial SMPS applications where thermal margin is constrained.

Key Specifications

Pinout & Package

Package: TO−277−3LD (Case 340BQ), 5.91 × 4.44 × 1.10 mm, very low profile (1.1 mm height), with Direct-Anode-Package (DAP) construction for enhanced thermal performance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast rectifier applications.

Compared with STTH6L04 and MBR640, the FES6G delivers superior high-frequency performance and voltage capability: its 25 ns Trr and 400 V rating enable efficient, compact designs in automotive and telecom where both speed and blocking voltage are critical-neither alternative matches this combination.

Availability

FES6G is available at Aetrix Electronics and suitable for automotive DC/DC converters, industrial motor drives, and telecom power supplies requiring stable component supply, AEC−Q101 compliance, and high-temperature reliability.

Supply support for FES6G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

onsemi (formerly ON Semiconductor) is a global semiconductor supplier focused on energy-efficient electronics, delivering power, analog, sensor, and connectivity solutions for automotive, industrial, and cloud infrastructure markets.

The FES6G belongs to onsemi's NRVFES6 ultrafast rectifier product line, engineered specifically for high-reliability, high-temperature automotive and industrial power conversion where fast recovery, low VF, and robust thermal performance are mandatory.

FAQ

What is the maximum junction temperature rating for the FES6G?

The FES6G has a specified operating junction temperature range of −55°C to +175°C. This wide range supports deployment in harsh environments such as under-hood automotive locations and sealed industrial enclosures. The device maintains stable electrical characteristics across this full range, with validated performance up to 150°C case temperature in continuous operation. Thermal design must respect the 6°C/W junction-to-lead resistance to avoid exceeding 175°C under worst-case load conditions. The FES6G datasheet confirms this rating under "Maximum Ratings" and "Thermal Characteristics" sections.

Is the FES6G pin-compatible with other devices in the FES6 series?

Yes, the FES6G shares identical TO−277−3LD (Case 340BQ) packaging and 3-pin pinout (Anode 1, Anode 2, Cathode) with FES6D and FES6J. All variants use the same mechanical footprint, thermal pad layout, and solder reflow profile. However, electrical parameters differ significantly-FES6G offers 400 V VRRM versus 200 V (FES6D) and 600 V (FES6J)-so voltage derating and circuit validation are required before substitution. The FES6G datasheet explicitly states shared package and marking compatibility across the series.

Does the FES6G meet automotive qualification standards?

Yes, the FES6G carries the NRV prefix and is AEC−Q101 qualified and PPAP capable. It undergoes stress testing including high-temperature reverse bias (HTRB), temperature cycling, and ESD per JESD47, with full traceability and process control at onsemi's qualified automotive sites. The "NRV Prefix" note in the ordering table and "AEC−Q101 Qualified" statement in the features section confirm its suitability for automotive powertrain, body, and ADAS applications. The FES6G is not just compliant-it is certified for production use in safety-critical systems.

What is the typical reverse recovery time (Trr) of the FES6G and under what conditions is it measured?

The FES6G has a typical reverse recovery time (Trr) of 25 ns, measured under IF = 0.5 A, IR = 1 A, and IRR = 0.25 A conditions. This value is confirmed in the "Electrical Characteristics" table of the official onsemi datasheet (Rev. 5, July 2024). A second test condition (IF = 1 A, di/dt = 50 A/μs, VR = 30 V) yields 45 ns-still ultrafast relative to standard FRDs. These measurements reflect real-world switching behavior in high-frequency converters, and the FES6G's consistent Trr across temperature makes it predictable in thermally varying environments.

Can the FES6G be used in surface-mount reflow processes without damage?

Yes, the FES6G is designed for standard lead-free reflow soldering per JEDEC J-STD-020. Its TO−277−3LD package supports peak temperatures up to 260°C for ≤30 seconds, with no degradation in electrical or thermal performance. The green molding compound complies with IEC61249 and withstands multiple thermal cycles. onsemi specifies compatible reflow profiles in their packaging documentation, and the FES6G's 1.1 mm profile ensures compatibility with automated pick-and-place and reflow ovens used in high-volume manufacturing. No special handling beyond standard SMD protocols is required.