Vishay General Semiconductor - Diodes Division FESB16CT-E3/45
- Part No.:
- FESB16CT-E3/45
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- Single Diodes
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
FESB16CT-E3/45.pdf
- Description:
- DIODE GEN PURP 150V 16A TO263AB
- Quantity:
- Payment:

- Shipping:

Inventory:3,286
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Product details
Overview
FESB16CT-E3/45 from Vishay General Semiconductor is an ultrafast plastic rectifier diode in D2PAK (TO-263AB) package, rated for 150 V repetitive peak reverse voltage (VRRM), 16 A average forward current (IF(AV)), and 35 ns reverse recovery time (trr). It delivers low forward voltage drop (1.30 V at 16 A), high surge capability (250 A IFSM), and operates up to 150 °C junction temperature-ideal for high-frequency rectification in DC/DC converters and switching power supplies.
For engineers reviewing the FESB16CT-E3/45 datasheet, FESB16CT-E3/45 pinout, FESB16CT-E3/45 application, or FESB16CT-E3/45 equivalent, key selection criteria include its 150 V VRRM, 35 ns trr, D2PAK thermal resistance (1.2 °C/W), RoHS-compliant matte tin plating, and suitability for space-constrained, high-efficiency power conversion designs requiring fast switching and low conduction loss.
Technical Context
The FESB16CT-E3/45 is a single-die, single-anode ultrafast recovery rectifier with glass-passivated pellet chip junction and optimized carrier lifetime control. Its 35 ns reverse recovery time and 1.30 V forward voltage at 16 A reflect a balanced trade-off between switching speed and conduction loss for 100–500 kHz SMPS topologies.
Designed for surface-mount assembly on thermally enhanced PCBs, it leverages the D2PAK (TO-263AB) package's low thermal resistance (RθJC = 1.2 °C/W) and meets JESD 201 Class 1A whisker testing. It is RoHS-compliant and commercial-grade (E3 suffix), not AEC-Q101 qualified-distinct from HM3-suffix variants.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 150 V - blocks up to 150 V repetitive reverse voltage without breakdown in flyback or boost stages |
| IF(AV) | 16 A at TC = 100 °C - supports continuous 16 A conduction with heatsinked PCB copper area |
| trr | 35 ns - enables efficient operation in 200–500 kHz switching converters with minimal switching loss |
| VF | 1.30 V at 16 A - reduces conduction loss vs. standard fast rectifiers, improving system efficiency |
| IFSM | 250 A (8.3 ms half-sine) - withstands high-energy inrush and transient surges during startup or fault |
| RθJC | 1.2 °C/W - allows direct thermal path from junction to heatsinked pad, critical for compact power designs |
| Junction temp | −65 °C to +150 °C - supports operation in industrial ambient environments without derating below 100 °C case temp |
Pinout & Package
Package: D2PAK (TO-263AB), surface-mount, 3-terminal configuration with isolated tab (cathode-connected tab). Mounting requires solderable matte tin-plated terminals per J-STD-002; maximum solder dip 275 °C for 10 s.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Anode) | Anode connection | Input terminal for forward current flow; electrically isolated from tab and Pin 2 |
| Pin 2 (Cathode) | Cathode connection | Output terminal; tied internally to metal tab for low-inductance, high-current return path |
| Tab (K) | Cathode thermal & electrical path | Exposed copper pad serving as cathode node and primary heat dissipation interface to PCB |
Key Features
| Feature | Design Value |
|---|---|
| Glass passivated junction | Ensures stable leakage current (<10 μA at 25 °C) and long-term reliability under thermal cycling |
| Ultrafast 35 ns trr | Reduces reverse recovery charge (Qrr) and associated EMI in high-frequency hard-switched topologies |
| D2PAK thermal performance | 1.2 °C/W RθJC enables >12 W power dissipation with 10 cm² 2-oz copper pad, eliminating need for external heatsink |
| RoHS-compliant E3 suffix | Meets EU RoHS Directive 2011/65/EU; matte tin plating ensures solderability and whisker resistance (JESD 201 Class 1A) |
Applications
| High-Frequency DC/DC Converters | Switch-Mode Power Supplies (SMPS) |
|---|---|
Use Scenario: Secondary-side synchronous rectification in 300–500 kHz isolated buck-derived converters for telecom and server PSUs. IC Role / Device Role / Timing Role: Ultrafast freewheeling diode replacing slower alternatives to minimize dead-time losses and improve light-load efficiency. Use Value: 35 ns trr and 1.30 V VF reduce total power loss by ~18% vs. standard fast rectifiers at 12 A load, verified in 48 V–12 V step-down designs. | Use Scenario: Output rectification in 100–300 kHz AC/DC adapters and open-frame power supplies. IC Role / Device Role / Timing Role: Primary output rectifier handling continuous 16 A average current with high peak surge tolerance. Use Value: 250 A IFSM rating ensures robustness against line transients and inrush, while D2PAK mounting simplifies thermal layout on cost-sensitive consumer PCBs. |
| Inverters & Motor Drives | Industrial Freewheeling Diodes |
Use Scenario: Freewheeling path in 3-phase IGBT-based inverters for HVAC compressors and pump controllers. IC Role / Device Role / Timing Role: Clamp diode across inductive loads to suppress voltage spikes during IGBT turn-off. Use Value: 150 °C max junction temperature and 1.2 °C/W RθJC allow reliable operation in sealed enclosures with limited airflow, reducing thermal margin risk. | Use Scenario: Snubber and clamp diodes in industrial PLC output modules and solenoid drivers. IC Role / Device Role / Timing Role: Fast-recovery path for inductive kickback energy, preventing MOSFET/IGBT avalanche failure. Use Value: 35 ns trr limits reverse recovery tail current, minimizing cross-conduction risk in half-bridge configurations with tight gate timing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultrafast rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay FES16CT-E3/45 | TO-220AC package; higher RθJC (1.2 °C/W same, but case-to-ambient less efficient); identical VRRM, trr, VF | Requires through-hole mounting and external heatsink; better for prototyping or lower-volume assemblies | Select when manual assembly, legacy footprint compatibility, or higher case-to-ambient thermal margin is needed |
| ON Semiconductor MUR1620CTG | 200 V VRRM; 60 ns trr; 1.25 V VF at 16 A; TO-220AB package; no RoHS E3 suffix in base part number | Higher voltage rating suits 200 V bus systems; slower recovery increases switching loss above 250 kHz | Select only if 200 V blocking is required and operating frequency stays ≤200 kHz to avoid efficiency penalty |
Compared with FES16CT-E3/45 and MUR1620CTG, the FESB16CT-E3/45 offers superior high-frequency performance (35 ns vs. 60 ns) and surface-mount scalability, while maintaining identical electrical specs to the TO-220 variant-making it optimal for automated, thermally dense, and high-efficiency power stage layouts.
Availability
FESB16CT-E3/45 is available at Aetrix Electronics and suitable for high-frequency DC/DC converters, switch-mode power supplies, and industrial freewheeling diode applications requiring stable component supply, consistent lead-time visibility, and full traceability.
Supply support for FESB16CT-E3/45 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay General Semiconductor is a global leader in discrete semiconductors, specializing in diodes, rectifiers, MOSFETs, and optoelectronics with emphasis on power efficiency and reliability.
The FESB16CT-E3/45 belongs to the FESB16xT ultrafast rectifier family, engineered specifically for high-frequency, high-efficiency power conversion where low trr, low VF, and robust surge capability are critical-targeting next-generation SMPS, telecom infrastructure, and industrial motor controls.
FAQ
What is the maximum junction temperature rating for the FESB16CT-E3/45?
The FESB16CT-E3/45 has a maximum junction temperature (TJ) of +150 °C, enabling operation in demanding industrial and telecom environments. This rating is validated under specified thermal conditions and must be maintained via proper PCB copper area design to keep TJ within limit during 16 A continuous conduction. Derating curves in the Vishay datasheet (Doc #88599) define safe operating area versus case temperature.
Is the FESB16CT-E3/45 AEC-Q101 qualified?
No, the FESB16CT-E3/45 is not AEC-Q101 qualified. It carries the E3 suffix, indicating RoHS-compliant commercial grade. For automotive applications, Vishay offers the HM3-suffix variant (e.g., FESB16CTHM3/I), which is explicitly AEC-Q101 qualified and undergoes additional stress testing per the standard. Always verify qualification status using the full ordering code.
What is the reverse recovery time (trr) of the FESB16CT-E3/45 and how is it measured?
The FESB16CT-E3/45 has a typical reverse recovery time (trr) of 35 ns, measured under standardized conditions: IF = 0.5 A, IR = 1.0 A, and Irr = 0.25 A. This value is confirmed in Vishay's official datasheet (Document Number 88599, page 2) and reflects the device's ultrafast switching behavior essential for minimizing switching loss in high-frequency power circuits.
Can the FESB16CT-E3/45 replace the FES16CT-E3/45 in a design?
Yes, the FESB16CT-E3/45 can replace the FES16CT-E3/45 electrically, as both share identical VRRM (150 V), trr (35 ns), VF (1.30 V), and IF(AV) (16 A). However, the FESB16CT-E3/45 uses D2PAK (TO-263AB) packaging versus TO-220AC, requiring PCB footprint and thermal pad redesign. No electrical revalidation is needed, but thermal and mechanical layout changes are mandatory.
What is the thermal resistance junction-to-case (RθJC) for the FESB16CT-E3/45?
The thermal resistance junction-to-case (RθJC) for the FESB16CT-E3/45 is 1.2 °C/W, as specified in the Vishay datasheet (Document Number 88599, page 2, Thermal Characteristics table). This value assumes proper soldering to a thermally enhanced PCB pad and is critical for calculating junction temperature rise under 16 A load conditions.
FESB16CT-E3/45 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tube
- Product Status:
- Obsolete
- Technology:
- Standard
- Voltage - DC Reverse (Vr) (Max):
- 150 V
- Current - Average Rectified (Io):
- 16A
- Voltage - Forward (Vf) (Max) @ If:
- 975 mV @ 16 A
- Speed:
- Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr):
- 35 ns
- Current - Reverse Leakage @ Vr:
- 10 µA @ 150 V
- Capacitance @ Vr, F:
- 175pF @ 4V, 1MHz
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263AB (D2PAK)
- Operating Temperature - Junction:
- -65°C ~ 150°C
FESB16CT-E3/45 FAQ
1.How can I place an order for FESB16CT-E3/45 through Aetrix?
Please submit a Request for Quotation (RFQ) for FESB16CT-E3/45 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FESB16CT-E3/45 reliable?
The price and inventory of FESB16CT-E3/45 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FESB16CT-E3/45 is usually 5 days.
3.What payment methods are accepted for FESB16CT-E3/45?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FESB16CT-E3/45 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FESB16CT-E3/45?
FESB16CT-E3/45 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FESB16CT-E3/45 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FESB16CT-E3/45?
For technical support, including FESB16CT-E3/45 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FESB16CT-E3/45 requirements.
6.How does Aetrix verify that FESB16CT-E3/45 is sourced from the original manufacturer or authorized distributors?
All FESB16CT-E3/45 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FESB16CT-E3/45 meets industry standards.
7.What is the process for return or replacement of FESB16CT-E3/45?
All FESB16CT-E3/45 units undergo pre-shipment inspection (PSI). If there is an issue with FESB16CT-E3/45, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FESB16CT-E3/45 part is unused and in its original packaging.
Return procedure for FESB16CT-E3/45:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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