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Infineon Technologies FF1700XTR17IE5DBPSA1
- Part No.:
- FF1700XTR17IE5DBPSA1
- Manufacturer:
- Infineon Technologies
- Category:
- FETs, MOSFETs
- Package:
- -
- Datasheet:
-
FF1700XTR17IE5DBPSA1.pdf
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- PP IHM I
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Product details
Overview
FF1700XTR17IE5DBPSA1 from Infineon is a PrimePACK™3+ B-series power module integrating a 1700 V, 1700 A Trench/Fieldstop IGBT5 inverter leg with enlarged emitter-controlled 5-diode configuration and integrated NTC thermistor. It delivers low switching losses (Eon = 720 mJ, Eoff = 540 mJ at Tvj = 175 °C), high surge capability (ICRM = 3400 A), and operates up to 175 °C junction temperature - deployed in high-power three-phase inverters for wind turbine converters.
For engineers reviewing the FF1700XTR17IE5DBPSA1 datasheet, FF1700XTR17IE5DBPSA1 pinout, FF1700XTR17IE5DBPSA1 application, or FF1700XTR17IE5DBPSA1 equivalent, key selection criteria include validated thermal cycling robustness, CTI > 400 insulation, 36 mm creepage to heatsink, and dual IGBT/diode thermal resistance specs (RthJC = 19.2 / 28.2 K/kW) for industrial traction and grid-connected systems.
Technical Context
This module implements a half-bridge inverter topology with discrete IGBT and freewheeling diode dies mounted on a common Cu baseplate. The IGBT uses Trench/Fieldstop IGBT5 technology with optimized gate charge (QG = 6.75 µC) and low Cies (81 nF), enabling fast, low-loss switching under high dv/dt (2650 V/µs) and di/dt (9300 A/µs) conditions.
The integrated NTC thermistor (R25 = 5 kΩ, B25/100 = 3433 K) provides direct junction temperature monitoring of both IGBT and diode dies, while the enlarged 5-diode structure improves reverse recovery softness (IRM = 1870 A, Qr = 865 µC at Tvj = 175 °C) and I²t rating (1080 kA²s at 175 °C).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCES | 1700 V - Withstands DC link voltages up to 1200 V nominal systems with 1.4× safety margin for transient overvoltage. |
| IC nom / ICRM | 1700 A continuous / 3400 A peak - Supports high-current motor drives and traction inverters with short-circuit withstand time ≤10 µs. |
| VCE(sat) | 2.55–2.97 V @ 1700 A, 175 °C - Enables <1.5 kW conduction loss per IGBT at rated current, critical for thermal management in sealed enclosures. |
| Eon / Eoff | 720 mJ / 540 mJ @ 1700 A, 900 V, 175 °C - Total switching energy <1.26 J per pulse enables 1–2 kHz operation in high-power converters without excessive heatsinking. |
| RthJC (IGBT/Diode) | 19.2 / 28.2 K/kW - Low thermal resistance allows direct mounting to liquid-cooled cold plates, supporting >3 MW/m² power density in compact converter designs. |
| Creepage/Clearance | 36.0 / 21.0 mm (terminal-to-heatsink) - Meets IEC 61800-5-1 reinforced insulation requirements for 1000 V AC drive systems. |
| NTC R25 / B25/100 | 5 kΩ ±5% / 3433 K - Enables ±1.5 °C temperature measurement accuracy across –40 to +175 °C for real-time thermal derating control. |
Pinout & Package
FF1700XTR17IE5DBPSA1 is housed in the PrimePACK™3+ B-series insulated metal-base package (1400 g, Cu baseplate), featuring reinforced creepage/clearance, CTI > 400 material, and M5/M4/M8 screw-mount terminals. The module integrates one IGBT inverter leg (C1/E1), one enlarged 5-diode inverter leg (C2/E2), and dual NTC terminals (T1/T2).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| C1, E1 | IGBT collector/emitter | High-current main switching path for upper inverter leg; rated for 1700 A DC and 3400 A surge. |
| C2, E2 | Diode cathode/anode | Enlarged 5-diode structure with enhanced I²t (1080 kA²s) and soft recovery for reduced EMI in high-dV/dt applications. |
| T1, T2 | NTC thermistor terminals | Two-wire interface for junction temperature sensing; calibrated R25 = 5 kΩ enables accurate thermal feedback to gate driver ICs. |
| GE1, GE2 | IGBT/diode gate-emitter | Isolated gate connections with internal RGint = 0.92 Ω; require external gate resistors (RGon = 0.39 Ω, RGoff = 1.1 Ω) for optimized switching. |
Key Features
| Feature | Design Value |
|---|---|
| Trench/Fieldstop IGBT5 die | Reduces VCE(sat) drift over temperature and improves short-circuit ruggedness (SC withstand tP ≤ 10 µs at 7200 A). |
| Enlarged emitter-controlled 5-diode | Delivers 20% higher IFRM and 15% lower Qr vs. standard 3-diode variants, reducing reverse recovery losses in regenerative braking. |
| Integrated NTC thermistor | Monitors combined IGBT/diode junction temperature with ±1.5 °C accuracy, enabling dynamic current derating in wind turbine pitch control systems. |
| CTI > 400 baseplate insulation | Supports long-term reliability in humid, dusty environments (e.g., offshore wind nacelles) without conformal coating. |
| 175 °C maximum operating temperature | Enables compact thermal design by raising coolant inlet temperature limits, reducing chiller size and system weight in traction drives. |
Applications
| Wind Turbine Converters | High-Power Industrial Drives |
|---|---|
|
Use Scenario: Back-to-back three-level converter in 3–6 MW wind turbine nacelles, handling variable-speed generator output and grid synchronization. IC Role / Device Role / Timing Role: IGBT/diode power stage in active front-end and machine-side inverter legs, switching at 1–2 kHz with precise torque control. Use Value: High I²t rating (1080 kA²s) and 175 °C operation enable reliable fault ride-through during grid dips without forced derating. |
Use Scenario: Medium-voltage (690 V AC) extruder and compressor drives in petrochemical plants requiring continuous 24/7 operation. IC Role / Device Role / Timing Role: Half-bridge inverter module delivering 1700 A RMS output current with low conduction loss (VCE(sat) ≤ 2.97 V) and thermal stability. Use Value: CTI > 400 insulation and 36 mm creepage ensure compliance with IEC 61800-5-1 for hazardous-area installations without additional barriers. |
| Rail Traction Inverters | Grid-Scale Energy Storage Systems |
|
Use Scenario: Propulsion inverter for 3 kV DC metro trains, converting overhead line voltage to variable-frequency AC for asynchronous traction motors. IC Role / Device Role / Timing Role: Main switching device in 2-level or 3-level NPC topologies, handling 3400 A surge during emergency braking regeneration. Use Value: Low stray inductance (LsCE = 10 nH) and matched IGBT/diode timing minimize voltage overshoot and snubber losses at 1.5 kHz switching. |
Use Scenario: Bi-directional PCS (Power Conversion System) in 1–5 MW battery storage containers interfacing with 35 kV medium-voltage grids. IC Role / Device Role / Timing Role: Core switching element in modular multilevel converter (MMC) submodules, managing bidirectional 1700 A current flow. Use Value: Integrated NTC enables per-module thermal balancing across hundreds of parallel units, extending system lifetime by 25% under partial-load cycling. |
Availability
FF1700XTR17IE5DBPSA1 is available at Aetrix Electronics and suitable for wind turbine converters, high-power industrial drives, rail traction inverters, and grid-scale energy storage systems requiring stable component supply, long-life qualification, and traceable sourcing.
Supply support for FF1700XTR17IE5DBPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a German semiconductor manufacturer specializing in power electronics, automotive microcontrollers, and security solutions, with global R&D and manufacturing infrastructure.
This part belongs to the PrimePACK™3+ B-series high-power IGBT module product line, engineered for industrial and traction applications demanding >1 MW power density, extended thermal cycling life (>100,000 cycles), and reinforced insulation integrity.
FAQ
What is the maximum allowable gate-emitter voltage for FF1700XTR17IE5DBPSA1?
The absolute maximum gate-emitter voltage is ±20 V, as specified in Table 3 of the datasheet. Operation beyond this range risks permanent gate oxide damage. Recommended gate drive is ±15 V with tight layout control to limit overshoot; internal gate resistor is 0.92 Ω, requiring external RGon = 0.39 Ω and RGoff = 1.1 Ω for optimal switching performance.
Does FF1700XTR17IE5DBPSA1 include both IGBT and diode dies in one package?
Yes - it integrates one Trench/Fieldstop IGBT5 die and one enlarged emitter-controlled 5-diode die in a single PrimePACK™3+ B-series housing. The IGBT and diode share the same Cu baseplate but have independent terminals (C1/E1 for IGBT, C2/E2 for diode), enabling full half-bridge functionality with matched thermal characteristics.
How is the NTC thermistor calibrated, and what is its accuracy range?
The integrated NTC has R25 = 5 kΩ ±5% at 25 °C and B25/100 = 3433 K. Its deviation is specified as ±5% at 100 °C (ΔR/R), enabling ±1.5 °C temperature measurement accuracy from –40 to +175 °C when used with a precision 10 µA bias current and 16-bit ADC, per Infineon Application Note AN2009-10.
What mechanical mounting torque values are required for FF1700XTR17IE5DBPSA1?
Mounting torque depends on screw type: M5 screws require 3–6 Nm, M4 screws 1.8–2.1 Nm, and M8 screws 8–10 Nm. These values are defined in Table 2 of the datasheet and must be applied using calibrated torque tools in sequence per the Infineon application note to ensure uniform baseplate clamping pressure and optimal thermal contact resistance (<0.05 K/W).
FF1700XTR17IE5DBPSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tray
- Product Status:
- Active
- FET Type:
- -
- Technology:
- -
- Drain to Source Voltage (Vdss):
- -
- Current - Continuous Drain (Id) @ 25°C:
- -
- Drive Voltage (Max Rds On, Min Rds On):
- -
- Rds On (Max) @ Id, Vgs:
- -
- Vgs(th) (Max) @ Id:
- -
- Gate Charge (Qg) (Max) @ Vgs:
- -
- Vgs (Max):
- -
- Input Capacitance (Ciss) (Max) @ Vds:
- -
- FET Feature:
- -
- Power Dissipation (Max):
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
FF1700XTR17IE5DBPSA1 FAQ
1.How can I place an order for FF1700XTR17IE5DBPSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for FF1700XTR17IE5DBPSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FF1700XTR17IE5DBPSA1 reliable?
The price and inventory of FF1700XTR17IE5DBPSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FF1700XTR17IE5DBPSA1 is usually 5 days.
3.What payment methods are accepted for FF1700XTR17IE5DBPSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FF1700XTR17IE5DBPSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FF1700XTR17IE5DBPSA1?
FF1700XTR17IE5DBPSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FF1700XTR17IE5DBPSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FF1700XTR17IE5DBPSA1?
For technical support, including FF1700XTR17IE5DBPSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FF1700XTR17IE5DBPSA1 requirements.
6.How does Aetrix verify that FF1700XTR17IE5DBPSA1 is sourced from the original manufacturer or authorized distributors?
All FF1700XTR17IE5DBPSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FF1700XTR17IE5DBPSA1 meets industry standards.
7.What is the process for return or replacement of FF1700XTR17IE5DBPSA1?
All FF1700XTR17IE5DBPSA1 units undergo pre-shipment inspection (PSI). If there is an issue with FF1700XTR17IE5DBPSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FF1700XTR17IE5DBPSA1 part is unused and in its original packaging.
Return procedure for FF1700XTR17IE5DBPSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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