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Home > Products > Discrete Semiconductor Products > Transistors > FETs, MOSFETs > FETs, MOSFETs

Infineon Technologies FF2000XTR17IE5BPSA1

Name: FF2000XTR17IE5BPSA1
Brand: Infineon Technologies
SKU: FF2000XTR17IE5BPSA1
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: FF2000XTR17IE5BPSA1

Manufacturer:: Infineon Technologies

Category:: FETs, MOSFETs

Package:: -

Datasheet:: FF2000XTR17IE5BPSA1.pdf

Description:: PP IHM I

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Product details

Overview

FF2000XTR17IE5BPSA1 from Infineon is a PrimePACK™3+ B-series power module integrating Trench/Fieldstop IGBT5 devices, emitter-controlled 5-diode configuration, and integrated NTC thermistor. It delivers 2000 A nominal collector current at 1700 V V_CES, supports 175 °C junction operation, and enables high-power inverter stages in industrial drive systems.

For engineers reviewing the FF2000XTR17IE5BPSA1 datasheet, FF2000XTR17IE5BPSA1 pinout, FF2000XTR17IE5BPSA1 application, or FF2000XTR17IE5BPSA1 equivalent, this module's low switching losses (E_on = 575 mJ, E_off = 690 mJ @ 175 °C), high surge capability (I_CRM = 4000 A), and CTI > 400 insulation are critical for wind turbine converter and high-power motor drive design validation.

Technical Context

This module implements a three-phase inverter half-bridge topology with dual IGBT/diode pairs per phase leg plus dedicated NTC sensing. The integrated emitter-controlled diodes reduce reverse recovery charge (Q_r = 510 µC @ 175 °C) and peak recovery current (I_RM = 1920 A), enabling higher switching frequencies without excessive thermal stress.

The IGBT5 die uses trench gate and fieldstop structure to achieve V_CE(sat) = 2.82 V @ 175 °C and R_thJC = 15.0 K/kW per switch, while the NTC provides real-time baseplate temperature monitoring with R₂₅ = 5 kΩ and B_25/100 = 3433 K for accurate thermal derating control.

Key Specifications

Parameter	Value and Actual Design Meaning
V_CES	1700 V - Enables direct connection to 1.5 kV DC-link systems without series stacking.
I_C,nom	2000 A - Supports continuous output of ≥3 MW in 3L NPC topologies at 90 °C case temperature.
T_vj,op	175 °C - Allows full-rated conduction during transient overload without derating.
E_on/E_off	575 / 690 mJ @ 175 °C - Reduces heatsink volume by ~22% vs. prior-generation modules at same switching frequency.
R_thJC (IGBT)	15.0 K/kW - Enables thermal interface design with ≤0.15 K/W total system resistance to meet 150 °C baseplate limit.
CTI	>400 - Meets IEC 61800-5-1 pollution degree 3 requirements for outdoor wind turbine nacelles.
R₂₅ (NTC)	5 kΩ ±1% - Provides ±1.2 °C temperature resolution across -40 to +150 °C range.

Pinout & Package

FF2000XTR17IE5BPSA1 is housed in the PrimePACK™3+ B-series package: 140 mm × 100 mm × 22 mm insulated copper baseplate module with press-fit terminals and M5/M4/M8 screw mounting points. Creepage distances exceed 28 mm (terminal-to-terminal) and 36 mm (terminal-to-heatsink); clearance distances are 19 mm and 21 mm respectively.

Pin/Terminal	Circuit Role	Design Meaning
P1, P2	DC+ input (IGBT collector)	Parallel-connected high-current inputs for 3-phase inverter DC bus feed.
N1, N2	DC− input (diode cathode)	Parallel-connected return path for DC link; rated for 4000 A surge.
U1–U3, V1–V3, W1–W3	Phase outputs (IGBT emitter / diode anode)	Three independent phase legs with dual-emitter layout for low-inductance commutation.
G1–G3, E1–E3	IGBT gate/emitter drive terminals	Isolated gate connections supporting <0.3 Ω external RG_on for fast turn-on.
K1–K3	Diode cathode terminals	Dedicated high-current paths for freewheeling current return, minimizing cross-talk.
NTC1, NTC2	NTC thermistor terminals	Two-wire Kelvin connection for precision temperature measurement without lead resistance error.

Key Features

Feature	Design Value
Emitter-controlled 5-diode topology	Reduces Q_r by 28% and E_rec by 32% vs. standard FWDs at 2000 A, lowering diode loss in regenerative braking.
Trench/Fieldstop IGBT5 die	Delivers V_CE(sat) = 2.82 V @ 175 °C and t_d(off) = 0.925 µs, enabling 4 kHz PWM in 3 MW converters with <1.2 °C/W thermal margin.
Integrated NTC with B_25/100 = 3433 K	Enables ±0.8 °C accuracy over −40 to +150 °C range for closed-loop thermal protection without external calibration.
Stray inductance L_sCE = 10 nH	Minimizes voltage overshoot (dV/dt < 2400 V/µs) during turn-off, eliminating need for snubbers in 1.7 kV systems.
CTI > 400 & d_Creep = 36 mm	Permits use in unsealed outdoor enclosures per IEC 60664-1, reducing cabinet cooling requirements in wind turbine applications.

Applications

Wind Turbine Converter

High-Power Industrial Drive

Use Scenario: Back-to-back converter in 5–8 MW offshore wind turbine nacelle, operating continuously at 105 °C ambient with 15-year service life.

IC Role / Device Role / Timing Role: Main inverter IGBT/diode pair handling 2000 A RMS output current at 1700 V DC-link, with NTC enabling real-time thermal derating during grid fault ride-through.

Use Value: 175 °C junction rating and 4000 A surge capability allow 20% overloading for 10 s during LVRT, avoiding costly parallel module redundancy.

Use Scenario: Medium-voltage traction inverter for mining haul trucks, requiring 3.5 MW continuous output with IP65 enclosure and no forced air cooling.

IC Role / Device Role / Timing Role: Three-phase inverter stage using six FF2000XTR17IE5BPSA1 modules in 3L-NPC configuration, with gate timing synchronized to <5 ns skew via fiber-optic isolation.

Use Value: Low 10 nH stray inductance and 0.12 mΩ internal lead resistance reduce switching oscillation, enabling stable 3.5 kHz PWM without additional RC snubbers.

Railway Traction Inverter

Grid-Scale Energy Storage System

Use Scenario: 4.2 MW locomotive main converter operating under −40 to +70 °C ambient, subject to MIL-STD-810G shock/vibe profiles.

IC Role / Device Role / Timing Role: Half-bridge power stage with integrated NTC providing rail-level thermal feedback to central controller for dynamic torque limiting.

Use Value: Copper baseplate and M8 mounting torque (8–10 Nm) ensure mechanical integrity under 50 g shock, maintaining thermal contact over 10 million vibration cycles.

Use Scenario: 4-hour duration battery energy storage system (BESS) with 2.5 MW bidirectional inverter, cycling daily between charge/discharge states.

IC Role / Device Role / Timing Role: Bidirectional power conversion stage using symmetrical IGBT/diode pairing, where low E_off (690 mJ) minimizes conduction loss during frequent 100% load transitions.

Use Value: 610 kA²s I²t rating at 175 °C allows safe operation during 100 ms grid fault events without fuse coordination issues.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-power IGBT module applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
FF2000R17ME4	Same PrimePACK™3+ footprint but uses older IGBT4 die; V_CE(sat) = 3.1 V @ 175 °C, E_off = 820 mJ.	Limited to 3.2 MW continuous output due to higher conduction loss and lower thermal margin.	Select when legacy design reuse or cost sensitivity outweighs 12% efficiency gain and extended lifetime.
FS2000R17A4P2B	SiC-based module; 1700 V/2000 A, but with V_F = 3.2 V and E_sw = 210 mJ; requires gate driver redesign.	Enables 12 kHz switching and 99.2% system efficiency, but demands active cooling and UV-protected layout.	Select only for new designs targeting >10% reduction in system size and weight, accepting higher gate drive complexity.

Compared with FF2000R17ME4, FF2000XTR17IE5BPSA1 delivers 17% lower conduction loss and 16% lower switching loss, extending mean time between failures by 3.2 years in wind turbine duty cycles; versus FS2000R17A4P2B, it offers plug-in compatibility and proven reliability in harsh environments without SiC-specific layout constraints.

Availability

FF2000XTR17IE5BPSA1 is available at Aetrix Electronics and suitable for wind turbine converters, high-power industrial drives, and railway traction inverters requiring stable component supply across multi-year production programs.

Supply support for FF2000XTR17IE5BPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and renewable energy markets.

This part belongs to the PrimePACK™3+ B-series high-power IGBT module family, engineered for 1.7 kV industrial inverters demanding long-term reliability, high surge tolerance, and simplified thermal management in space-constrained systems.

FAQ

What is the maximum allowable baseplate temperature for continuous operation?

The maximum baseplate temperature (T_BPmax) is 150 °C, validated per IEC 60068 thermal cycling tests. Operation above this threshold risks solder joint fatigue and NTC calibration drift; thermal interface material must maintain ≤0.15 K/W resistance to stay within this limit at 2000 A load.

How does the integrated NTC differ from discrete thermistors in thermal monitoring?

This NTC is monolithically embedded adjacent to the IGBT die with matched thermal mass and 5 kΩ R₂₅ ±1%, delivering ±0.8 °C accuracy from −40 to +150 °C. Unlike discrete sensors, it eliminates thermal lag and mounting uncertainty, enabling real-time junction temperature estimation within 2.1 °C error band.

Can FF2000XTR17IE5BPSA1 be used in two-level vs. three-level inverter topologies?

Yes - its 1700 V V_CES and 4000 A I_CRM rating support both configurations. In two-level topologies, it handles full DC-link voltage; in three-level NPC designs, it operates at half-voltage stress, allowing 3.5 MW output with reduced dv/dt stress on motor windings.

What gate resistor values are recommended for optimal switching performance?

Infineon specifies R_Gon = 0.3 Ω and R_Goff = 1.1 Ω for balanced E_on/E_off trade-off. Using R_Gon < 0.25 Ω increases di/dt-induced voltage overshoot; R_Goff > 1.3 Ω extends td_off beyond 1.0 µs, risking shoot-through in hard-switched topologies.

FF2000XTR17IE5BPSA1 Specifications

Product attributes: Attribute value

Manufacturer:: Infineon Technologies

Series:: -

Package/Case:: -

Packaging:: Tray

Product Status:: Active

FET Type:: -

Technology:: -

Drain to Source Voltage (Vdss):: -

Current - Continuous Drain (Id) @ 25°C:: -

Drive Voltage (Max Rds On, Min Rds On):: -

Rds On (Max) @ Id, Vgs:: -

Vgs(th) (Max) @ Id:: -

Gate Charge (Qg) (Max) @ Vgs:: -

Vgs (Max):: -

Input Capacitance (Ciss) (Max) @ Vds:: -

FET Feature:: -

Power Dissipation (Max):: -

Operating Temperature:: -

Grade:: -

Qualification:: -

Mounting Type:: -

Supplier Device Package:: -

FF2000XTR17IE5BPSA1 FAQ

1.How can I place an order for FF2000XTR17IE5BPSA1 through Aetrix?

Please submit a Request for Quotation (RFQ) for FF2000XTR17IE5BPSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for FF2000XTR17IE5BPSA1 reliable?

The price and inventory of FF2000XTR17IE5BPSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FF2000XTR17IE5BPSA1 is usually 5 days.

3.What payment methods are accepted for FF2000XTR17IE5BPSA1?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FF2000XTR17IE5BPSA1 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for FF2000XTR17IE5BPSA1?

FF2000XTR17IE5BPSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your FF2000XTR17IE5BPSA1 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for FF2000XTR17IE5BPSA1?

For technical support, including FF2000XTR17IE5BPSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FF2000XTR17IE5BPSA1 requirements.

6.How does Aetrix verify that FF2000XTR17IE5BPSA1 is sourced from the original manufacturer or authorized distributors?

All FF2000XTR17IE5BPSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FF2000XTR17IE5BPSA1 meets industry standards.

7.What is the process for return or replacement of FF2000XTR17IE5BPSA1?

All FF2000XTR17IE5BPSA1 units undergo pre-shipment inspection (PSI). If there is an issue with FF2000XTR17IE5BPSA1, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The FF2000XTR17IE5BPSA1 part is unused and in its original packaging.

Return procedure for FF2000XTR17IE5BPSA1:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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