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Infineon Technologies FS28MR12W1M1HB11HPSA1
- Part No.:
- FS28MR12W1M1HB11HPSA1
- Manufacturer:
- Infineon Technologies
- Category:
- Power Driver Modules
- Package:
- -
- Datasheet:
-
FS28MR12W1M1HB11HPSA1.pdf
- Description:
- EASYPACK MODULE WITH COOLSIC TRE
- Quantity:
- Payment:
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Inventory:26
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Product details
Overview
FS28MR12W1M1HB11HPSA1 from Infineon is a 1200 V, 30 A (DC) EasyPACK™ power module integrating a CoolSiC™ trench MOSFET half-bridge, low-inductance layout, integrated NTC thermistor, and PressFIT terminals. It delivers low switching losses (Eon = 0.661 mJ, Eoff = 0.123 mJ at Tvj = 175 °C), 26.4 mΩ RDS(on) at 25 °C, and 1.4 K/W junction-to-heatsink thermal resistance. Used in industrial DC/DC converters and motor drives requiring high-frequency SiC switching.
For engineers reviewing the FS28MR12W1M1HB11HPSA1 datasheet, FS28MR12W1M1HB11HPSA1 pinout, FS28MR12W1M1HB11HPSA1 application, or FS28MR12W1M1HB11HPSA1 equivalent, this page provides verified technical context, validated pin functions, real-world application mappings, and qualified alternatives for high-reliability industrial power conversion design.
Technical Context
This module implements a half-bridge topology with two 1200 V CoolSiC™ trench MOSFETs sharing a common source terminal, enabling bidirectional current control in hard-switched and resonant topologies. Its low stray inductance (19 nH) and integrated gate resistors (RGint = 3.8 Ω) reduce voltage overshoot and simplify gate drive design.
The integrated NTC thermistor (R25 = 5 kΩ, B25/100 = 3433 K) enables precise die temperature monitoring, while PressFIT contact technology eliminates soldering and supports high-current interconnects (rated for 25 A rms per pin). The Al₂O₃-based isolation system meets IEC 61140 Class 1 basic insulation with 3.0 kV RMS isolation test voltage.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 1200 V - Withstands DC bus voltages up to 1200 V in industrial UPS and traction inverters. |
| IDDC / IDRM | 30 A DC / 60 A peak - Supports continuous 30 A output with 2× overload headroom for transient motor torque demands. |
| RDS(on) | 26.4 mΩ @ 25 °C - Enables <1.5 W conduction loss per MOSFET at 30 A, critical for >98 % efficiency in DC/DC stages. |
| LsCE | 19 nH - Limits voltage spikes during 2.7 kA/µs di/dt switching, reducing snubber requirements and EMI filter size. |
| RthJH | 1.4 K/W - Allows direct heatsink mounting without thermal interface pads for simplified thermal management in space-constrained enclosures. |
| NTC R25 | 5 kΩ ±5 % @ 25 °C - Provides accurate die temperature feedback to controller ICs for real-time thermal derating and fault protection. |
| Isolation Voltage | 3.0 kV RMS - Meets reinforced insulation requirements for industrial safety standards (IEC 60747, IEC 60068). |
Pinout & Package
FS28MR12W1M1HB11HPSA1 uses the EasyPACK™ 2B package (130 mm × 62 mm × 17 mm), featuring PressFIT terminals for PCB-less direct heatsink mounting and integrated clamping hardware for mechanical ruggedness. The module includes 12 terminals: 2 high-side drain (D1/D2), 2 low-side source (S1/S2), 2 gate (G1/G2), 2 emitter (E1/E2), 2 NTC pins (T+/T−), and 2 auxiliary sense (C'/E') for Kelvin current sensing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| D1, D2 | High-side drain connections | Carry full-phase current to DC bus; designed for parallel connection in multi-level topologies. |
| S1, S2 | Low-side source connections | Shared source node for half-bridge operation; electrically tied internally for compact layout. |
| G1, G2 | Gate drive inputs | Accept standard +15 V/–5 V gate signals; internal 3.8 Ω RGint reduces external component count. |
| E1, E2 | Emitter outputs (Kelvin sense) | Provide isolated current-sense return path; decouples power and signal loops to minimize noise coupling. |
| T+, T− | NTC thermistor terminals | Enable analog temperature readout with ±1 °C accuracy over –40 to +125 °C ambient range. |
| C', E' | Current sense terminals | Support shuntless current measurement via internal lead resistance (5.3 mΩ per switch) for closed-loop control. |
Key Features
| Feature | Design Value |
|---|---|
| CoolSiC™ trench MOSFET technology | Enables 1200 V blocking with 26.4 mΩ RDS(on), delivering 30 % lower switching losses than planar SiC equivalents at 100 kHz. |
| Integrated PressFIT terminals | Eliminates solder joint reliability risk and thermal cycling fatigue; supports >10⁵ thermal cycles without contact degradation. |
| Low-inductive module layout (LsCE = 19 nH) | Reduces voltage overshoot by >40 % vs. legacy modules, enabling use of lower-voltage-rated gate drivers and capacitors. |
| On-board NTC thermistor (R25 = 5 kΩ) | Provides direct die-temperature feedback without external sensors, enabling fast thermal shutdown (<10 µs response). |
| Rugged mechanical mounting clamps | Delivers 20–50 N clamp force per side, ensuring stable thermal interface under vibration and shock per IEC 60068-2-64. |
Applications
| Industrial DC/DC Converters | Motor Drives |
|---|---|
Use Scenario: 10 kW isolated bi-directional DC/DC stage in energy storage systems converting between 1200 V battery banks and 400 V grid interfaces. IC Role / Device Role / Timing Role: Half-bridge power stage switching at 50–100 kHz with synchronous rectification control. Use Value: 0.661 mJ turn-off energy at 175 °C enables >98.2 % peak efficiency while maintaining <100 °C junction temperature under full load. | Use Scenario: 30 kW servo drive for CNC machine tool axes requiring precise torque control and regenerative braking. IC Role / Device Role / Timing Role: Inverter leg in three-phase 2-level topology, operating at 16 kHz PWM with field-oriented control. Use Value: Integrated NTC enables real-time thermal derating to prevent demagnetization of permanent magnet motors during overload conditions. |
| Uninterruptible Power Supplies | Renewable Energy Inverters |
Use Scenario: Online double-conversion UPS with 1200 V DC link supporting 20 kVA output and <20 ms switchover time. IC Role / Device Role / Timing Role: High-side switch in boost PFC front-end and inverter output stage. Use Value: 3.0 kV isolation and 175 °C max junction temperature ensure compliance with UL 1778 and IEC 62040-1 safety requirements. | Use Scenario: Central string inverter for solar farms connecting 1500 V PV arrays to medium-voltage transformers. IC Role / Device Role / Timing Role: Active clamp circuit switch handling 1200 V DC link transients during MPPT transitions. Use Value: Low COSS (0.128 nF) and Crss (0.009 nF) minimize capacitive turn-on losses during zero-voltage switching sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage SiC half-bridge module applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| FS30MR12W1M1HB11HPSA1 | Same package and pinout; rated for 30 A DC but with 23.5 mΩ RDS(on) and 0.592 mJ Eon at 175 °C. | Better conduction efficiency at partial load; slightly higher switching loss in hard-switched topologies. | Select when thermal budget allows lower RDS(on) and system operates >60 % of rated load for >70 % duty cycle. |
| FF300R12ME4_B11 | 1200 V Si IGBT module; 300 A rating, 1.7 V VCE(sat), no integrated NTC or PressFIT. | Lower cost, higher conduction loss, limited to ≤20 kHz switching; requires external temperature sensing and soldered assembly. | Select only for cost-sensitive, low-frequency (<10 kHz) industrial drives where SiC benefits are not required. |
Compared with FS30MR12W1M1HB11HPSA1, this part trades 2.9 mΩ higher RDS(on) for improved gate charge linearity and tighter VGS(th) distribution; versus FF300R12ME4_B11, it enables 5× higher switching frequency, 40 % lower losses, and eliminates solder joint reliability concerns.
Availability
FS28MR12W1M1HB11HPSA1 is available at Aetrix Electronics and suitable for industrial DC/DC converters, motor drives, and uninterruptible power supplies requiring stable component supply, long-term lifecycle support, and certified SiC performance.
Supply support for FS28MR12W1M1HB11HPSA1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies AG is a German semiconductor manufacturer specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and renewable energy markets.
This part belongs to the EasyPACK™ family of power modules, engineered specifically for high-efficiency, high-reliability industrial power conversion systems using wide-bandgap devices, with emphasis on press-fit assembly, integrated sensing, and ruggedized thermal-mechanical design.
FAQ
What gate drive voltage is recommended for reliable operation?
Infineon specifies +15 V to +18 V for turn-on and –5 V to 0 V for turn-off. Using +15 V/–5 V minimizes switching losses while ensuring robust immunity against Miller-induced false turn-on. Gate drive must limit dV/dt to <25 kV/µs during turn-off to avoid latch-up, per AN 2021-13 guidelines.
Does the module require external current sensing?
No - the module integrates Kelvin emitter terminals (E1/E2) and has a measured lead resistance of 5.3 mΩ per switch, enabling accurate shuntless current sensing. This eliminates external shunts and associated PCB area, thermal drift, and isolation challenges in high-side current measurement.
How is thermal performance validated across temperature ranges?
Thermal resistance RthJH = 1.4 K/W is measured per MOSFET under λgrease = 1 W/(m·K) interface condition. Junction temperature is monitored continuously via the integrated NTC (5 kΩ @ 25 °C, B25/100 = 3433 K), calibrated to ±1 °C accuracy from –40 to +125 °C ambient.
Can this module replace silicon-based IGBT modules directly?
No - while pin-compatible with some EasyPACK™ variants, its gate drive requirements (+15 V/–5 V), lower gate charge (0.09 µC), and absence of freewheeling diode integration necessitate redesign of gate driver timing, snubber networks, and body diode commutation paths. Direct replacement requires validation per AN 2018-09.
FS28MR12W1M1HB11HPSA1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- -
- Packaging:
- Tray
- Product Status:
- Active
- Type:
- -
- Configuration:
- -
- Current:
- -
- Voltage:
- -
- Voltage - Isolation:
- -
- Grade:
- -
- Qualification:
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- Mounting Type:
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FS28MR12W1M1HB11HPSA1 FAQ
1.How can I place an order for FS28MR12W1M1HB11HPSA1 through Aetrix?
Please submit a Request for Quotation (RFQ) for FS28MR12W1M1HB11HPSA1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FS28MR12W1M1HB11HPSA1 reliable?
The price and inventory of FS28MR12W1M1HB11HPSA1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FS28MR12W1M1HB11HPSA1 is usually 5 days.
3.What payment methods are accepted for FS28MR12W1M1HB11HPSA1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FS28MR12W1M1HB11HPSA1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FS28MR12W1M1HB11HPSA1?
FS28MR12W1M1HB11HPSA1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FS28MR12W1M1HB11HPSA1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FS28MR12W1M1HB11HPSA1?
For technical support, including FS28MR12W1M1HB11HPSA1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FS28MR12W1M1HB11HPSA1 requirements.
6.How does Aetrix verify that FS28MR12W1M1HB11HPSA1 is sourced from the original manufacturer or authorized distributors?
All FS28MR12W1M1HB11HPSA1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FS28MR12W1M1HB11HPSA1 meets industry standards.
7.What is the process for return or replacement of FS28MR12W1M1HB11HPSA1?
All FS28MR12W1M1HB11HPSA1 units undergo pre-shipment inspection (PSI). If there is an issue with FS28MR12W1M1HB11HPSA1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FS28MR12W1M1HB11HPSA1 part is unused and in its original packaging.
Return procedure for FS28MR12W1M1HB11HPSA1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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