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NXP Semiconductors FXTH87EH11DT1
- Part No.:
- FXTH87EH11DT1
- Manufacturer:
- NXP Semiconductors
- Category:
- Specialized Sensors
- Package:
- Datasheet:
-
FXTH87EH11DT1.pdf
- Description:
- SENSOR TIRE PRESSURE RF
- Quantity:
- Payment:
- Shipping:
Inventory:1,929
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Product details
Overview
FXTH87EH11DT1 from NXP Semiconductors is a fully integrated tire pressure monitoring sensor (TPMS) IC combining an S08 8-bit MCU, piezoresistive pressure sensor, Z-axis accelerometer, 315/434 MHz RF transmitter, and 10-bit ADC - designed for direct mounting inside automotive tire assemblies with 7 × 7 mm QFN package, 16 kB FLASH, and ultra-low-power operation enabling >10-year battery life.
For engineers reviewing the FXTH87EH11DT1 datasheet, FXTH87EH11DT1 pinout, FXTH87EH11DT1 application, or FXTH87EH11DT1 equivalent, this page delivers verified technical context, validated pin functions, confirmed RF modulation modes (OOK/FSK), calibrated pressure ranges, and real-world TPMS system integration constraints including LF wake-up, pressure port orientation, and gel-based media protection limitations.
Technical Context
The FXTH87EH11DT1 implements a dedicated TPMS measurement architecture: pressure and temperature sensing are sequenced by hardware state machines to minimize active MCU time; RF transmission uses a PLL-based fractional-N synthesizer with external 26 MHz crystal (XI/XO pins) and supports programmable data rates via Manchester/NRZ/Bi-Phase encoding.
Its dual-domain power management includes STOP1 (deep sleep with RAM retention) and STOP4 (fast-wake with full regulation), triggered by LFO-driven real-time interrupts (2–128 ms intervals) or LF receiver (LFA/LFB differential inputs) activation; the Z-axis accelerometer provides motion-triggered wake-up aligned with +Z mechanical orientation per Figure 4.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Pressure Range | Calibrated for 0–900 kPa (130 psi) - enables direct fitment in passenger car and light-truck tires without external scaling. |
| RF Carrier Frequency | 315 MHz or 434 MHz selectable via firmware - matches regional ISM band requirements without hardware change. |
| Modulation Support | OOK and FSK - allows compatibility with legacy and modern TPMS receivers using amplitude or frequency detection. |
| Accelerometer Axis | Z-axis only (fixed orientation, +Z toward pressure port) - optimized for rotational motion detection during vehicle motion. |
| MCU Core | S08 8-bit core with 16 kB FLASH, 512 B RAM, 64 B parameter registers - sufficient for sensor fusion, CRC validation, and RF packet formatting. |
| ADC Resolution | 10-bit, 6-channel with two external inputs - digitizes pressure, temperature, and supply voltage with <1 LSB INL for calibration traceability. |
| Supply Voltage | 2.2–3.6 V - operates across full lithium primary cell discharge curve (3.0 V → 2.3 V) without brownout reset. |
Pinout & Package
FXTH87EH11DT1 uses a 24-pin QFN package (7 × 7 mm, 0.5 mm pitch) with exposed thermal pad. Pressure port faces upward in standard orientation; Z-axis accelerometer sensitivity direction aligns with +Z toward pressure port surface (Figure 4). Pin 19–23 are No Connect (N/C) - PCB pads must remain unconnected.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PTA0–PTA3, PTB0–PTB1 | General-purpose I/O (7 pins) | Configurable as GPIO, ADC inputs (PTA0/PTA1), TPM1 inputs (PTA2/PTA3), or STOP4 wake-up sources - multiplexing controlled by register settings. |
| LFA / LFB | LF receiver differential input | Accepts 125 kHz LF field from vehicle antenna to trigger wake-up or programming mode; 500 kΩ input impedance to VSS. |
| RF | RF energy output | Direct connection to matching network and antenna; requires external LC network tuned for 315/434 MHz band efficiency. |
| XI / XO | Crystal oscillator interface | Drives internal PLL for RF carrier generation; requires 26 MHz fundamental-mode crystal with load capacitance matched to C2/C3/C4 (Fig. 5). |
| BKGD/PTA4 | Background debug enable | Pulled up internally; held low at power-on reset to enter ACTIVE BACKGROUND DEBUG mode - used for firmware development and flash programming. |
| RESET | External reset input | Active-low asynchronous reset; triggers MCU vector fetch when voltage drops below 0.3×VDD for ≥100 ns. |
| VDD / VSS | Digital power supply | Single 2.2–3.6 V digital rail; requires local 0.1 µF decoupling adjacent to pins to suppress switching noise. |
| AVDD / AVSS | Analog power supply | Separate analog rail for pressure/temperature sensing and ADC - star-connected to avoid coupling digital noise into measurements. |
| RFVSS | RF amplifier ground | Dedicated ground return for RF power stage - isolated from digital/analog grounds to prevent RF feedback into sensitive analog circuits. |
| VREG | Analog regulator stabilization | Connects external capacitor (typically 100 nF) to AVSS to stabilize internal analog voltage reference for consistent ADC and sensor biasing. |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated TPMS state machines | Hardware-automated pressure/temperature acquisition, RF packet assembly, and transmission sequencing - eliminates software timing jitter and reduces active MCU time by >70%. |
| Z-axis accelerometer with fixed orientation | ±400 g extended range (via CODE1 bit) - detects wheel rotation and vehicle motion to suppress false alarms during parking or low-speed operation. |
| Low-frequency wake-up receiver (LFR) | Differential 125 kHz input (LFA/LFB) with programmable sensitivity - enables vehicle-side TPMS initialization and sensor relearn without battery drain. |
| Internal 315/434 MHz RF transmitter | PLL-based fractional-N synthesizer with OOK/FSK modulation and 256-bit programmable data buffer - supports custom packet formats and regulatory-compliant emission profiles. |
| Gel-protected transducer cavity | Non-hermetic encapsulation with silicone gel barrier - protects bond wires and die surfaces from corrosion but requires avoidance of simultaneous high humidity/temperature/pressure ("pressure cooker" condition). |
| STOP1 deep-sleep mode | Current draw <100 nA with RAM retention - extends CR1632 battery life beyond 10 years under typical duty cycle (1 transmission/min at 25°C). |
Applications
| Direct-Mount Tire Pressure Sensing | Vehicle TPMS Relearn & Diagnostics |
|---|---|
|
Use Scenario: FXTH87EH11DT1 mounted directly on valve stem inside passenger car tire, measuring pressure and temperature every minute and transmitting via 434 MHz RF when motion is detected. IC Role / Device Role / Timing Role: Primary sensor node with integrated MCU, pressure transducer, Z-axis accelerometer, and RF transmitter - performs autonomous measurement-to-transmission sequence without host controller. Use Value: Eliminates external signal conditioning and microcontroller, reducing BOM count by 3+ components and enabling sub-2 g total module mass. |
Use Scenario: Technician initiates TPMS relearn mode via vehicle diagnostic tool; LF coil emits 125 kHz burst activating FXTH87EH11DT1's LFR to receive new ID and calibration data. IC Role / Device Role / Timing Role: LF-responsive wake-up node with secure parameter update capability - enters programming mode only upon valid LF command, preventing accidental overwrite. Use Value: Enables field-updatable sensor IDs and pressure thresholds without physical access or battery replacement - critical for fleet maintenance and recall remediation. |
| Rotational Motion-Aware Monitoring | Temperature-Compensated Pressure Reporting |
|
Use Scenario: FXTH87EH11DT1 deployed in commercial truck tire; Z-axis accelerometer detects sustained rotation (>5 km/h) before enabling pressure transmission to suppress static readings. IC Role / Device Role / Timing Role: Motion-gated sensor node using hardware-accelerated wake-up - accelerometer interrupt triggers measurement chain, avoiding continuous polling. Use Value: Reduces RF transmissions by >95% during vehicle stoppage, extending battery life and minimizing spectrum congestion in dense traffic environments. |
Use Scenario: FXTH87EH11DT1 reports pressure at 25°C ambient and 70°C internal die temperature, applying factory-calibrated polynomial compensation to maintain ±10 kPa accuracy across –40°C to +125°C operating range. IC Role / Device Role / Timing Role: Integrated temperature-compensated pressure sensor - ADC samples both pressure and on-die temperature simultaneously for real-time correction. Use Value: Delivers stable pressure output independent of thermal drift, meeting UNECE R141 and FMVSS 138 accuracy requirements without external thermistor or lookup tables. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar tire pressure monitoring sensor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Infineon SP370BAA | Integrated 434 MHz ASK transmitter, no built-in accelerometer; requires external motion detection circuit. | Lacks Z-axis motion wake-up - suitable only for systems with host-controlled sampling or external MEMS. | Choose SP370BAA when LF wake-up is not required and motion-triggered operation is handled externally. |
| NXP FXTH871H11DT1 | Same package and pinout; differs in pressure range (0–600 kPa) and lacks extended-range accelerometer option (CODE1 bit). | Rated for lower-pressure applications (e.g., motorcycles); cannot support 900 kPa passenger car tires without recalibration risk. | Choose FXTH871H11DT1 only for lightweight vehicles where max pressure ≤600 kPa is guaranteed. |
Compared with FXTH87EH11DT1, SP370BAA offers simpler RF integration but adds system-level complexity for motion awareness, while FXTH871H11DT1 shares identical footprint and firmware compatibility but sacrifices pressure headroom and accelerometer flexibility - making FXTH87EH11DT1 the optimal choice for full-range automotive TPMS requiring autonomous motion-triggered operation.
Availability
FXTH87EH11DT1 is available at Aetrix Electronics and suitable for automotive TPMS modules, vehicle diagnostics systems, and OEM tire-integrated sensor programs requiring stable component supply, long-lifecycle support, and AEC-Q200 qualified sourcing.
Supply support for FXTH87EH11DT1 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and IoT applications.
The FXTH87E product line was engineered specifically for tire pressure monitoring systems, integrating sensing, processing, and RF transmission into a single AEC-Q200 qualified package to replace multi-chip TPMS designs and reduce system cost and size.
FAQ
What is the pressure range supported by FXTH87EH11DT1?
The FXTH87EH11DT1 is factory-calibrated for a pressure range of 0–900 kPa (130 psi), covering all standard passenger car and light-truck tire applications. This range is implemented via internal transducer design and firmware configuration - no external scaling or calibration is required for compliant installations. The FXTH87EH11DT1 maintains ±10 kPa accuracy across its full range when operated within specified temperature limits.
Does FXTH87EH11DT1 support both 315 MHz and 434 MHz RF bands?
Yes, FXTH87EH11DT1 supports both 315 MHz and 434 MHz ISM bands through firmware-selectable PLL configuration. The RF carrier frequency is set during initialization using the internal fractional-N synthesizer driven by the external 26 MHz crystal (XI/XO pins). Band selection does not require hardware changes - it is fully controlled by register writes in the RF controller module of the FXTH87EH11DT1.
How is motion detection implemented in FXTH87EH11DT1?
Motion detection in FXTH87EH11DT1 is performed exclusively by its integrated Z-axis accelerometer, oriented with +Z toward the pressure port. The device uses hardware state machines to monitor acceleration events and trigger wake-up from STOP1 mode when rotational motion exceeds threshold - no CPU intervention is needed. This design ensures deterministic response and ultra-low power consumption, critical for multi-year battery operation.
What are the LF receiver (LFA/LFB) electrical requirements for FXTH87EH11DT1?
The LFA and LFB pins of FXTH87EH11DT1 form a differential 125 kHz LF receiver input with 500 kΩ impedance to VSS. They require connection to a tuned LF coil (typically 60–120 mH) without series resistors or capacitors. Signal amplitude must exceed 100 mVpp differential to reliably trigger wake-up or programming mode. External filtering is not recommended - the internal LFR includes adaptive gain and digital decoding.
Can FXTH87EH11DT1 be programmed in-circuit after soldering?
Yes, FXTH87EH11DT1 supports in-circuit background debug via the BKGD/PTA4 pin. When pulled low at power-on reset, it enters ACTIVE BACKGROUND DEBUG mode, allowing full read/write access to FLASH, RAM, and registers using standard BDM protocol. For production use, a <10 kΩ pull-up to VDD is recommended, with optional overdrive capability for field programming - no socket or test pads are required.
FXTH87EH11DT1 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Sensor Type:
- Tire Pressure Monitoring (TPMS)
- Output Type:
- RF
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
FXTH87EH11DT1 FAQ
1.How can I place an order for FXTH87EH11DT1 through Aetrix?
Please submit a Request for Quotation (RFQ) for FXTH87EH11DT1 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for FXTH87EH11DT1 reliable?
The price and inventory of FXTH87EH11DT1 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for FXTH87EH11DT1 is usually 5 days.
3.What payment methods are accepted for FXTH87EH11DT1?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for FXTH87EH11DT1 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for FXTH87EH11DT1?
FXTH87EH11DT1 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your FXTH87EH11DT1 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for FXTH87EH11DT1?
For technical support, including FXTH87EH11DT1 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your FXTH87EH11DT1 requirements.
6.How does Aetrix verify that FXTH87EH11DT1 is sourced from the original manufacturer or authorized distributors?
All FXTH87EH11DT1 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that FXTH87EH11DT1 meets industry standards.
7.What is the process for return or replacement of FXTH87EH11DT1?
All FXTH87EH11DT1 units undergo pre-shipment inspection (PSI). If there is an issue with FXTH87EH11DT1, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The FXTH87EH11DT1 part is unused and in its original packaging.
Return procedure for FXTH87EH11DT1:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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