Taiwan Semiconductor Corporation GBL02 D2G

Overview

GBL02 D2G from Taiwan Semiconductor is a 4A, 200V standard bridge rectifier in GBL package, featuring glass-passivated junctions, <1.1V forward voltage at 4A/25°C, <5µA reverse leakage at 25°C, and AEC-Q101 qualification option. It serves as AC-to-DC conversion core in compact off-line power supplies.

For engineers reviewing the GBL02 D2G datasheet, GBL02 D2G pinout, GBL02 D2G application, or GBL02 D2G equivalent, key selection factors include peak repetitive reverse voltage (200V), surge current rating (150A), thermal resistance (R_θJL = 13°C/W), and UL recognition (E-326243).

Technical Context

The GBL02 D2G integrates four silicon diodes in a single-phase full-wave bridge configuration with common-cathode and common-anode terminals. Its glass-passivated junction ensures stable reverse characteristics across -55°C to +150°C operating range and supports high dielectric strength for isolation-critical designs.

Thermal performance is defined by R_θJC = 8°C/W and R_θJA = 32°C/W under standard PCB mounting (0.5"×0.5" copper pads). Junction capacitance is 95pF per diode at 1MHz/4V, optimized for switching-mode operation up to several hundred kHz.

Key Specifications

Pinout & Package

Package: GBL - molded plastic case meeting UL 94V-0, matte tin-plated leads, 2.00g weight, polarity marked on top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBU2K and DF02M, the GBL02 D2G delivers superior thermal efficiency (R_θJL = 13°C/W vs. ≥32°C/W), tighter leakage control (<5µA), and smallest height (3.5 mm) among 4A/200V bridges-making it optimal for slim-profile, thermally demanding adapters and LED drivers.

Availability

GBL02 D2G is available at Aetrix Electronics and suitable for switching mode power supplies, USB wall adapters, and industrial sensor power modules requiring stable component supply, consistent parametric performance, and long-term lifecycle support.

Supply support for GBL02 D2G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.

The GBL series targets cost-sensitive, high-reliability AC/DC front-end applications-designed for robustness in universal-input power conversion with emphasis on thermal efficiency, safety certification, and automotive-grade variants.

FAQ

What is the maximum junction temperature rating for GBL02 D2G?

The GBL02 D2G has a maximum junction temperature (T_J) of +150°C, validated across its full operating range from –55°C to +150°C. This rating allows continuous operation in high-ambient environments such as enclosed LED drivers or industrial control enclosures. Derating curves in the datasheet specify usable current limits above 50°C case temperature. The GBL02 D2G maintains electrical integrity up to this limit when thermal design adheres to R_θJL = 13°C/W specifications.

Is GBL02 D2G RoHS and halogen-free compliant?

Yes, the GBL02 D2G is fully RoHS compliant and halogen-free per IEC 61249-2-21. The molding compound meets UL 94V-0 flammability rating, and terminals are matte tin-plated for lead-free soldering per J-STD-002. These compliance attributes are confirmed in Taiwan Semiconductor's official documentation for the GBL02 D2G and apply to all standard production lots without exception.

Does GBL02 D2G have AEC-Q101 qualification?

The base GBL02 D2G is not AEC-Q101 qualified; however, the AEC-Q101 variant is designated GBL02H (same voltage/current ratings, identical GBL package). GBL02H undergoes stress testing per AEC-Q101 Rev D including HTSL, TC, and UHAST. For automotive applications requiring qualification, GBL02H-not GBL02 D2G-is the specified part. No requalification is possible for standard GBL02 D2G units.

What is the forward voltage drop of GBL02 D2G at rated current?

The GBL02 D2G exhibits a maximum forward voltage (V_F) of 1.1 V per diode at I_F = 4 A and T_J = 25°C, measured under pulsed conditions (PW = 0.3 ms). At elevated junction temperatures (e.g., 125°C), V_F decreases slightly due to negative temperature coefficient. This value directly determines conduction loss: at 4A, total bridge drop is ~2.2V, yielding 8.8W dissipation if uncooled-confirming need for proper thermal design using the GBL02 D2G's R_θJL = 13°C/W spec.

How does the GBL02 D2G pinout differ from KBPC602?

The GBL02 D2G uses a 4-pin inline GBL package with AC1, AC2, +, and – terminals arranged linearly; KBPC602 uses a 4-pin round-body package with identical terminal function but different physical layout and lead spacing (2.54 mm vs. 5.08 mm). While both are full-wave bridges rated 2A/200V, the GBL02 D2G is 4A-rated and incompatible in footprint. PCB redesign is required to substitute GBL02 D2G for KBPC602 due to mechanical and thermal interface differences-not just pin count.