onsemi GBPC2501W

Overview

GBPC2501W from Diodes Incorporated is a 25A glass passivated single-phase bridge rectifier with 100V peak repetitive reverse voltage (VRRM), 1.1V forward voltage at 12.5A per diode, 300A non-repetitive surge rating, and metal-base heatsink for thermal management-used in industrial AC/DC power supplies and motor drive front-ends.

For engineers reviewing the GBPC2501W datasheet, GBPC2501W pinout, GBPC2501W application, or GBPC2501W equivalent, key selection criteria include VRRM derating for capacitive loads, case temperature–dependent current derating, thermal resistance to heatsink (1.3°C/W), and UL recognition under file E94661 for safety-critical power conversion.

Technical Context

This device integrates four silicon junction diodes in a single-phase full-wave bridge configuration with glass-passivated die construction to minimize reverse leakage (5.0μA at 25°C) and ensure stable operation up to 150°C junction temperature. Its internal metal base provides direct thermal conduction path to external heatsinks.

The GBPC2501W is rated for 25A average rectified output current at TC = 60°C with 20% derating required for capacitive loads. It supports 60Hz line-frequency operation with 8.3ms half-sine surge capability and exhibits 300pF typical total capacitance per element at 1MHz and 4V reverse bias.

Key Specifications

Pinout & Package

Package: GBPC-W - molded plastic case with internally mounted metal heatsink base and wire leads; UL 94V-0 rated; weight ≈14 g; mounting via #10 screw through central hole (5.08–5.59 mm diameter).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBJ2501 and KBPC2501W, the GBPC2501W uniquely combines wire-lead termination, integrated metal heatsink base, and UL recognition-making it optimal for high-reliability, thermally demanding chassis-mounted rectification where mechanical robustness and safety certification are mandatory.

Availability

GBPC2501W is available at Aetrix Electronics and suitable for industrial AC/DC power supplies, motor drive front-end rectification, and welding equipment power stages requiring stable component supply and long-lifecycle availability.

Supply support for GBPC2501W includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, serving industrial, computing, communications, and consumer markets.

The GBPC series belongs to Diodes' high-current bridge rectifier product line, engineered for ruggedized AC/DC conversion in environments demanding thermal resilience, surge immunity, and safety certification.

FAQ

What is the maximum case temperature for continuous 25A operation?

The GBPC2501W delivers 25A average output current only when case temperature (TC) is maintained at ≤60°C using an adequately sized heatsink. At higher case temperatures, current must be linearly derated per Figure 1 in the datasheet-e.g., ~18A at TC = 100°C. Thermal interface material and mounting torque (≤8.0 in-lb) directly impact achievable TC.

Can GBPC2501W be used with capacitive input filters without derating?

No. The datasheet explicitly requires 20% derating of IO for capacitive loads due to higher peak currents and increased thermal stress on diode junctions. For a 25A-rated unit, this means limiting continuous current to 20A when feeding bulk capacitors directly-verified by thermal testing under worst-case line and load conditions.

Is the GBPC2501W RoHS compliant despite containing lead-free exemptions?

Yes. GBPC2501W complies with RoHS Directive 2011/65/EU, including permitted exemptions for high-melting-point solder (lead in solder alloys above 85 wt%) and glass (lead oxide in passivation layers), as documented in EU Annexes 5 and 7-confirmed by Diodes' official compliance statements and test reports.

How does the metal base improve thermal performance versus standard plastic-packaged bridges?

The integral metal base provides a low-resistance thermal path from die to external heatsink, achieving RθJC = 1.3°C/W-up to 40% lower than comparable plastic-only packages. This allows higher power density and eliminates reliance on PCB copper area for heat spreading, enabling direct chassis mounting in space-constrained enclosures.