Taiwan Semiconductor Corporation GBPC2502M

Overview

GBPC2502M from Taiwan Semiconductor is a 25A, 200V standard bridge rectifier in GBPC-M package with quad configuration, glass-passivated junctions, and integrally molded heatsink for low thermal resistance (1.5°C/W); used in AC-DC converters and switching mode power supplies requiring high surge capability (400A IFSM) and low leakage (<5µA IR).

For engineers reviewing the GBPC2502M datasheet, GBPC2502M pinout, GBPC2502M application, or GBPC2502M equivalent, key selection criteria include peak reverse voltage (200V), average forward current (25A), thermal resistance (1.5°C/W), surge rating (400A), and GBPC-M terminal orientation where cathode is parallel to anode.

Technical Context

This discrete bridge rectifier integrates four silicon diodes in a single-phase full-wave configuration, enabling efficient AC-to-DC conversion without external wiring. Its glass-passivated junction ensures stable reverse leakage (<5µA at rated VR) and long-term reliability under thermal cycling.

The GBPC-M mechanical variant features matte tin-plated leads compliant with J-STD-002, UL 94V-0 molding compound, and a heatsink-integrated case designed for direct mounting with ≤20 in-lbs torque. Junction temperature range spans −55°C to +150°C.

Key Specifications

Pinout & Package

Package: GBPC-M - Molded plastic case with integrally formed heatsink, cathode terminal parallel to anode, matte tin-plated leads, UL 94V-0 rated compound, weight ≈16.95g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBPC2502 and KBU2502, the GBPC2502M offers superior thermal performance (1.5°C/W), UL recognition for faster certification, and a compact GBPC-M footprint optimized for space-constrained industrial layouts.

Availability

GBPC2502M is available at Aetrix Electronics and suitable for industrial AC-DC power supplies, consumer SMPS adapters, and LED driver power stages requiring stable component supply, consistent thermal behavior, and certified safety compliance.

Supply support for GBPC2502M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global power and protection markets since 1979.

The GBPC series is part of TSC's standard rectifier product line, engineered for high-reliability AC-DC front-end conversion in industrial, computing, and consumer power systems where thermal robustness and safety certification are essential.

FAQ

What is the maximum junction temperature rating for GBPC2502M?

The GBPC2502M has a maximum junction temperature (TJ) rating of +150°C, verified per absolute maximum ratings in the official Taiwan Semiconductor datasheet. This allows operation in high-ambient environments when paired with appropriate heatsinking. Derating begins above 75°C case temperature, and sustained operation near 150°C requires careful thermal design. The GBPC2502M must not exceed this limit to ensure reliability and avoid parametric shift or premature failure.

Does GBPC2502M have UL recognition?

Yes, the GBPC2502M is UL Recognized under File #E-326243, confirming compliance with UL 60950-1 and UL 62368-1 for use in end-equipment power supplies. This recognition applies specifically to the GBPC-M package variant and supports faster regulatory approval cycles. The UL mark appears on the device body and is documented in Taiwan Semiconductor's official qualification reports for the GBPC2502M.

What is the forward voltage drop specification for GBPC2502M?

The GBPC2502M specifies a maximum forward voltage (VF) of 1.1 V per diode at IF = 12.5 A and TJ = 25°C, measured under pulsed conditions (PW = 0.3 ms). This value defines conduction loss in the bridge and directly impacts system efficiency. At higher currents or temperatures, VF increases slightly-designers should consult the "Typical Forward Characteristics" curve in the GBPC15/25/35 datasheet for precise derating.

How does the GBPC-M package differ from GBPC-W and standard GBPC?

The GBPC-M package features cathode and anode terminals oriented parallel to each other, whereas GBPC-W places them perpendicular. Standard GBPC (non-suffixed) refers to the base GBPC outline without specified terminal orientation. All share the same GBPC case dimensions and heatsink structure, but GBPC-M's parallel lead geometry enables tighter PCB layouts and simplified automated assembly in space-constrained applications like compact adapters.

Is GBPC2502M RoHS compliant and lead-free?

Yes, the GBPC2502M is RoHS compliant per EU Directive 2011/65/EU and uses matte tin-plated leads that meet J-STD-002 solderability standards. It contains no lead, mercury, cadmium, hexavalent chromium, PBB, or PBDE above threshold limits. Taiwan Semiconductor confirms full compliance in its material declarations, and the device is suitable for lead-free reflow processes up to 260°C peak temperature.