Taiwan Semiconductor Corporation GBPC2504M

Overview

GBPC2504M from Taiwan Semiconductor is a 25A, 400V glass-passivated single-phase bridge rectifier in GBPC-M package with integral heatsink, 1.5°C/W junction-to-case thermal resistance, and <5µA reverse leakage at 25°C - used in AC-DC converters and switching mode power supplies.

For engineers reviewing the GBPC2504M datasheet, GBPC2504M pinout, GBPC2504M application, or GBPC2504M equivalent, key selection factors include peak repetitive reverse voltage (400V), average forward current (25A), surge capability (400A IFSM), thermal performance (R_θJC = 1.5°C/W), and GBPC-M terminal orientation for heatsink mounting.

Technical Context

The GBPC2504M integrates four silicon diodes in a single-phase full-wave bridge configuration with glass-passivated junctions for enhanced reliability under high-voltage transients. Its GBPC-M mechanical variant features cathode terminals parallel to anode terminals, enabling direct heatsink mounting via two M4 screw holes.

Designed for industrial and SMPS applications, it supports continuous operation up to 150°C junction temperature and delivers low forward voltage drop (≤1.1V at 12.5A, 25°C) while maintaining ultra-low reverse leakage (<5µA at rated V_RRM).

Key Specifications

Pinout & Package

GBPC2504M uses the GBPC-M package: a molded plastic case with integral heatsink, matte tin-plated leads, UL 94V-0 rated compound, and cathode terminals oriented parallel to anode terminals for optimized heatsink interface. Mounting torque ≤20 in-lbs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBPC2504 and ON Semiconductor GBPC2504, the GBPC2504M offers identical electrical performance but distinguishes itself via standardized GBPC-M mechanical definition - including heatsink-mounting holes and cathode/anode terminal alignment - enabling simpler thermal integration without adapter hardware.

Availability

GBPC2504M is available at Aetrix Electronics and suitable for industrial AC-DC power supplies, switching mode power supplies, and motor drive front-end rectifiers requiring stable component supply and long-term lifecycle support.

Supply support for GBPC2504M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and power electronics markets.

The GBPC series was developed specifically for high-reliability, high-current AC-DC conversion in space-constrained industrial power systems - emphasizing thermal robustness, surge resilience, and safety certification readiness.

FAQ

What is the peak repetitive reverse voltage rating of GBPC2504M?

The GBPC2504M has a peak repetitive reverse voltage (V_RRM) rating of 400 V. This value is defined in the Absolute Maximum Ratings table and confirmed across all electrical test conditions in the datasheet. It specifies the maximum reverse voltage the device can block repeatedly without avalanche breakdown. Exceeding this voltage risks irreversible junction damage. The GBPC2504M is part of the GBPC25xx family where "04" denotes the 400 V rating.

Does GBPC2504M require an external heatsink?

The GBPC2504M incorporates an integral heatsink and achieves R_θJC = 1.5°C/W, enabling direct mounting to a system heatsink via its two M4 screw holes. While not strictly required for all 25A applications, thermal simulation or measurement is recommended. At full 25A load with >40°C ambient, an external heatsink is necessary to maintain T_J ≤150°C. The GBPC2504M datasheet provides derating curves confirming this behavior.

What does the "M" suffix in GBPC2504M signify?

The "M" suffix in GBPC2504M identifies the GBPC-M mechanical variant: a molded package with cathode terminals oriented parallel to anode terminals and integrated mounting holes for direct heatsink attachment. This differs from GBPC2504 (standard GBPC) and GBPC2504W (GBPC-W, with perpendicular terminals). The "M" is defined in the Ordering Information section and corresponds to drawing HQ2SD07-GBPCM-055 REV A.

Is GBPC2504M RoHS compliant and lead-free?

Yes, GBPC2504M is RoHS compliant and manufactured with lead-free terminations. The datasheet explicitly states RoHS compliance and confirms matte tin-plated leads meeting J-STD-002 solderability requirements. It also passes JESD201 Class 1A whisker testing, ensuring reliability in Pb-free reflow processes. No exemptions or exceptions are noted in the official documentation.

What is the forward voltage drop of GBPC2504M at rated current?

The GBPC2504M exhibits a maximum forward voltage drop (V_F) of 1.1 V per diode at I_F = 12.5 A and T_J = 25°C, as specified in the Electrical Specifications table. Since it is a full-wave bridge, total conduction drop across the conducting path is 2 × V_F, or ≤2.2 V. This value is measured under pulsed conditions (PW = 0.3 ms) and decreases slightly at lower currents or higher temperatures.