Taiwan Semiconductor Corporation GBPC2510W

Overview

GBPC2510W from Taiwan Semiconductor is a 25A, 1000V glass-passivated quad bridge rectifier in GBPC-W wire-structure package, featuring 1.1V max forward voltage at 12.5A, <5µA reverse leakage at 25°C, and 1.5°C/W junction-to-case thermal resistance - used in high-reliability AC/DC converters and switching mode power supplies.

For engineers reviewing the GBPC2510W datasheet, GBPC2510W pinout, GBPC2510W application, or GBPC2510W equivalent, key selection criteria include peak repetitive reverse voltage (1000V), average forward current (25A), surge capability (400A IFSM), thermal performance (RθJC = 1.5°C/W), and GBPC-W mechanical mounting configuration.

Technical Context

This discrete bridge rectifier integrates four silicon diodes in a single molded GBPC-W package with integral heatsink, enabling full-wave AC-to-DC conversion without external layout coordination of individual diodes. Its glass-passivated junction ensures stable reverse characteristics and low IR drift over temperature.

The device operates across –55°C to +150°C junction range and supports 8.3ms half-sine surge currents up to 400A. Thermal design is anchored by direct metal-to-heatsink interface via the GBPC-W's exposed baseplate, delivering verified 1.5°C/W RθJC for predictable derating in convection- or forced-air-cooled SMPS designs.

Key Specifications

Pinout & Package

GBPC2510W uses the GBPC-W package: a quad bridge rectifier in integrally molded plastic with wire-structure terminals, featuring an exposed copper heatsink baseplate, matte tin-plated leads, and cathode polarity marked on the case. Mounting torque must not exceed 20 in-lbs.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBU25J and GBPC2510, GBPC2510W uniquely combines 1000V blocking, GBPC-W wire-lead form factor, UL recognition, and 1.5°C/W thermal resistance - making it optimal for high-voltage, high-volume, safety-certified AC/DC front-ends where lead geometry and thermal margin are critical.

Availability

GBPC2510W is available at Aetrix Electronics and suitable for switching mode power supplies, industrial motor drives, and telecom rectifier modules requiring stable component supply, long-life availability, and consistent GBPC-W mechanical form factor.

Supply support for GBPC2510W includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in rectifiers, TVS diodes, MOSFETs, and power ICs.

The GBPC15/25/35 series was designed specifically for high-current, high-voltage AC/DC front-end rectification in industrial, computing, and telecom power systems - prioritizing thermal efficiency, surge robustness, and safety certification readiness.

FAQ

What is the maximum junction temperature rating for GBPC2510W?

The GBPC2510W has a maximum junction temperature (TJ(max)) of +150°C, validated across its full operating range from –55°C to +150°C. This rating enables use in high-ambient environments such as enclosed server PSUs or industrial enclosures. Derating curves in the datasheet define safe average current versus case temperature, and the 1.5°C/W RθJC allows precise thermal modeling when paired with a properly sized heatsink. GBPC2510W must not exceed this limit during transient or steady-state operation.

Does GBPC2510W support lead-free soldering processes?

Yes, GBPC2510W features matte tin-plated leads compliant with J-STD-002 for solderability and meets JESD201 Class 1A whisker testing requirements. It is RoHS-compliant and qualified for standard lead-free reflow profiles (peak ~260°C) and wave-soldering. The GBPC-W wire-structure terminals are designed to withstand thermal stress without delamination or wetting failure, making GBPC2510W suitable for modern high-reliability manufacturing lines.

How does the GBPC-W package differ mechanically from GBPC and GBPC-M variants?

The GBPC-W package uses wire-structure terminals - straight, round leads extending axially from the molded body - optimized for through-hole insertion and wave soldering. In contrast, GBPC uses flat-tab terminals for screw-mount heatsinks, and GBPC-M has parallel cathode/anode terminals for surface-mount or press-fit applications. GBPC2510W's GBPC-W footprint requires distinct PCB pad layout and mounting torque control (≤20 in-lbs), and is not interchangeable with GBPC or GBPC-M without board revision.

What is the reverse leakage current specification for GBPC2510W at elevated temperature?

At 25°C, GBPC2510W specifies maximum reverse current (IR) of 5 µA per diode at rated VRRM. While the datasheet does not publish IR at higher temperatures, typical behavior shows IR increases exponentially with junction temperature - approximately doubling per 10°C rise. For design margin at 125°C junction, engineers should expect IR in the range of 100–200 µA. This remains well within acceptable limits for most SMPS and industrial converter applications where bulk capacitance dominates standby leakage paths.

Is GBPC2510W UL Recognized, and what is the file number?

Yes, GBPC2510W is UL Recognized under File # E-326243, covering the entire GBPC15/25/35 series. This recognition applies to the GBPC-W variant and validates compliance with UL 60747-1 for discrete semiconductors, including flammability (UL 94V-0 molding compound), electrical insulation, and construction integrity. UL recognition simplifies end-product safety certification for power supplies targeting North American markets and reduces time-to-market for industrial and telecom equipment.