Taiwan Semiconductor Corporation GBPC3501M

Overview

GBPC3501M from Taiwan Semiconductor is a 35A, 100V standard bridge rectifier in GBPC-M package with glass-passivated junctions, 1.5°C/W junction-to-case thermal resistance, and <5µA reverse leakage at 25°C - used in AC-DC converters and switching mode power supplies requiring high surge tolerance and low thermal resistance.

For engineers reviewing the GBPC3501M datasheet, GBPC3501M pinout, GBPC3501M application, or GBPC3501M equivalent, key selection criteria include rated forward current (35A), peak repetitive reverse voltage (100V), IFSM surge rating (300A), thermal resistance (1.5°C/W), and GBPC-M terminal configuration with cathode parallel to anode.

Technical Context

This quad-configuration bridge rectifier integrates four silicon diodes in a single molded package with integral heatsink structure, enabling direct PCB mounting and efficient heat transfer. Its glass-passivated junction ensures stable reverse characteristics and long-term reliability under repeated surge stress.

The GBPC3501M operates across –55°C to +150°C junction temperature range and meets UL 94V-0 flammability and JESD201 Class 1A whisker requirements. It delivers 1.1V max forward voltage per diode at rated current and supports 8.3ms half-sine surge events up to 300A.

Key Specifications

Pinout & Package

GBPC3501M uses the GBPC-M package: a molded quad bridge with matte tin-plated leads, cathode terminal parallel to anode, and integral heatsink base designed for mechanical mounting and thermal conduction. Weight: 16.95g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with Vishay GBPC3501 and ON Semi GBPC3501W, the GBPC3501M uniquely combines UL recognition, JESD201 Class 1A compliance, and GBPC-M's optimized heatsink-mounting interface - making it the preferred choice for certified industrial power supplies requiring mechanical and thermal robustness.

Availability

GBPC3501M is available at Aetrix Electronics and suitable for switching mode power supplies, AC-DC front-end converters, and industrial control power modules requiring stable component supply, long-lifecycle support, and traceable sourcing.

Supply support for GBPC3501M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and power electronics markets since 1979.

The GBPC15/25/35 series was developed to deliver high-current, high-reliability bridge rectifiers with integrated thermal management and safety certifications - targeting cost-sensitive yet regulation-compliant AC-DC power conversion.

FAQ

What is the peak repetitive reverse voltage rating of GBPC3501M?

The GBPC3501M has a peak repetitive reverse voltage (VRRM) rating of 100 V. This value is confirmed in the Absolute Maximum Ratings table for the GBPC35xx family, where "01" suffix denotes 100V. It provides adequate margin for 120VAC input applications with typical line variations and transients. The GBPC3501M must not be operated beyond this voltage to ensure reliable blocking performance.

Does GBPC3501M have UL recognition?

Yes, GBPC3501M is UL Recognized under File # E-326243. This certification applies specifically to the GBPC-M variant and confirms compliance with UL 60747-1 for discrete semiconductors. The UL mark supports end-equipment safety approvals in North America and is documented in the official Taiwan Semiconductor datasheet revision M2211.

What is the forward voltage drop of GBPC3501M at rated current?

The GBPC3501M exhibits a maximum forward voltage (VF) of 1.1 V per diode at IF = 17.5 A and TJ = 25°C. Since the device contains four series-connected diodes in bridge configuration, total conduction loss is dominated by two diodes conducting simultaneously - resulting in ~2.2 V total drop at full 35A output. This value is measured under pulsed conditions (PW = 0.3 ms) per datasheet Note 1.

How is thermal management handled in GBPC3501M?

GBPC3501M features an integrally molded heatsink that achieves a junction-to-case thermal resistance (RθJC) of 1.5°C/W. The GBPC-M package is designed for direct mechanical mounting to an external heatsink or metal chassis using the flat base surface. Mounting torque must not exceed 20 in-lbs to avoid damage. This thermal design eliminates the need for discrete heatsinks in many 35A applications.

What does the "M" suffix signify in GBPC3501M?

The "M" suffix in GBPC3501M denotes the GBPC-M package variant, characterized by terminal leads oriented with cathode parallel to anode - distinct from GBPC-W (wire-structure) and standard GBPC (terminal cathode perpendicular to anode). This configuration optimizes mechanical mounting and thermal interface for heatsink attachment, and is specified in the Ordering Information section of the Taiwan Semiconductor datasheet.