Taiwan Semiconductor Corporation GBPC3504W

Overview

GBPC3504W from Taiwan Semiconductor is a 35A, 400V glass-passivated quad bridge rectifier in GBPC-W wire-structure package, featuring 1.5°C/W junction-to-case thermal resistance, <5µA reverse leakage at 25°C, and 400A peak surge current capability; used in high-efficiency AC–DC converters and switching mode power supplies.

For engineers reviewing the GBPC3504W datasheet, GBPC3504W pinout, GBPC3504W application, or GBPC3504W equivalent, key selection criteria include rated forward current (35A), repetitive peak reverse voltage (400V), thermal resistance (1.5°C/W), surge rating (400A), and GBPC-W mechanical configuration with integral heatsink.

Technical Context

This discrete bridge rectifier integrates four silicon diodes in a single-phase full-wave configuration with glass-passivated junctions for enhanced reliability under thermal cycling and humidity stress. Its GBPC-W package features wire-structured terminals and an integrally molded heatsink enabling direct mounting to external heat sinks.

The device operates across –55°C to +150°C junction temperature range, supports 8.3ms half-sine surge events up to 400A, and maintains <1.1V forward voltage per diode at rated DC load - critical for minimizing conduction loss in high-current SMPS front-end stages.

Key Specifications

Pinout & Package

GBPC3504W uses the GBPC-W package: a quad bridge rectifier in a molded plastic case with wire-structured terminals, integral heatsink base, matte tin-plated leads compliant with J-STD-002, and UL 94V-0 rated molding compound. Weight: 16.95 g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBPC3504W, GBPC3504 offers identical electrical specs but requires layout adaptation for terminal orientation, while GBU35J trades thermal robustness for higher voltage rating and smaller footprint - making GBPC3504W optimal for thermally demanding, high-current AC–DC front ends.

Availability

GBPC3504W is available at Aetrix Electronics and suitable for industrial SMPS, server power supplies, medical equipment power modules, and renewable energy inverter input stages requiring stable component supply and long-lifecycle support.

Supply support for GBPC3504W includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.

The GBPC15/25/35 series was designed specifically for high-current, high-reliability AC–DC rectification in industrial power supplies and infrastructure equipment - emphasizing thermal performance, surge resilience, and regulatory compliance.

FAQ

What is the maximum continuous forward current rating for GBPC3504W?

The GBPC3504W has a rated average forward current (IF) of 35 A at case temperature ≤75°C with adequate heatsinking. This rating assumes proper thermal management using its integral heatsink base and external heatsink interface. Derating is required above 75°C case temperature per the forward current derating curve in the datasheet. GBPC3504W must not be operated beyond 35 A DC without verifying junction temperature remains ≤150°C.

Does GBPC3504W have UL recognition?

Yes, GBPC3504W is UL Recognized under File # E-326243, confirming compliance with UL 60747-1 for discrete semiconductors. This recognition applies to the entire GBPC15/25/35 series, including the GBPC-W variant. The UL mark supports end-product safety certifications in North America but does not imply approval for medical or life-support applications.

What is the thermal resistance from junction to case for GBPC3504W?

The junction-to-case thermal resistance (RθJC) of GBPC3504W is 1.5°C/W, measured under standard test conditions. This value reflects the efficiency of heat transfer from the silicon die through the molded package to the heatsink base. Achieving this thermal performance requires clean metal-to-metal contact between the GBPC3504W baseplate and the external heatsink, without insulating pads unless thermally compensated.

How is polarity marked on GBPC3504W?

GBPC3504W uses a cathode indicator - a channeled corner and molded "+" symbol adjacent to the positive output terminal - located on the heatsink surface near the "+" lead. The marking diagram on the device shows "P/N YWWF", where "YWW" is the date code and "F" is the factory code. Polarity must be verified visually before PCB assembly, as incorrect orientation causes immediate failure.

Is GBPC3504W RoHS compliant and lead-free?

Yes, GBPC3504W is RoHS compliant and lead-free per EU Directive 2011/65/EU. Its matte tin-plated leads meet J-STD-002 solderability requirements, and the device passes JESD201 Class 1A whisker testing. The molding compound complies with UL 94V-0 flammability standards. No exemptions are applied; full material declarations are available upon request from Taiwan Semiconductor.