My Inquiry
My Account
Taiwan Semiconductor Corporation GBPC5001 T0G
- Part No.:
- GBPC5001 T0G
- Manufacturer:
- Taiwan Semiconductor Corporation
- Category:
- Bridge Rectifiers
- Package:
- 4-Square, GBPC40
- Datasheet:
-
GBPC5001 T0G.pdf
- Description:
- BRIDGE RECT 1P 100V 50A GBPC40
- Quantity:
- Payment:
- Shipping:
Inventory:7,104
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
GBPC5001 T0G from Taiwan Semiconductor is a 50A, 100V standard bridge rectifier in GBPC40 package with glass-passivated junctions, 400A peak surge current rating, and 1.5°C/W junction-to-case thermal resistance-used in AC-DC converters and switching mode power supplies requiring high-reliability mains rectification.
For engineers reviewing the GBPC5001 T0G datasheet, GBPC5001 T0G pinout, GBPC5001 T0G application, or GBPC5001 T0G equivalent, key selection factors include its 100V repetitive peak reverse voltage (VRRM), 50A average forward current (IF), quad configuration, UL Recognized status (E-326243), and RoHS-compliant matte tin-plated terminals suitable for snap-on, wrap-around, solder, or PCB mounting.
Technical Context
This discrete bridge rectifier integrates four silicon diodes in a single molded GBPC40 case with integral heatsink, enabling direct mounting to heat sinks via its metal baseplate. Its glass-passivated junction ensures stable operation at up to 150°C junction temperature and withstands 664 A²s fusing I²t rating under 8.3ms half-sine surge conditions.
The device features universal 4-way termination-compatible with snap-on, wrap-around, solder, and PCB board mounting-and meets JESD201 Class 1A whisker resistance and UL 94V-0 flammability standards. Polarity is marked on the case with cathode indicator at chamfered corner.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRRM | 100 V - Maximum non-repetitive reverse voltage the device blocks without breakdown; defines input AC voltage compatibility (e.g., 70 Vrms max). |
| IF (AV) | 50 A - Continuous average forward current per device; determines steady-state power handling in rectifier stage. |
| IFSM | 400 A - Peak non-repetitive surge current capability; supports inrush current during cold-start of SMPS. |
| TJ max | +150 °C - Maximum allowable junction temperature; enables operation in high-ambient industrial environments. |
| RθJC | 1.5 °C/W - Thermal resistance from junction to case; allows accurate heatsink sizing when mounted directly to metal surface. |
| VF @ IF | 1.1 V @ 25 A - Forward voltage drop per diode at rated current; used to calculate conduction loss (2.2 V total bridge drop). |
| IR @ VRRM | 10 µA @ 100 V - Reverse leakage per diode; low value minimizes standby power loss in offline converters. |
Pinout & Package
Package: GBPC40 - Molded plastic case with integral metal heatsink baseplate (17.55 × 15.55 mm footprint), UL 94V-0 rated, 17.3 g weight. Terminals are matte tin-plated, J-STD-002 solderable, with polarity marked (cathode indicated at chamfered corner).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| AC1 / AC2 | AC Input Terminals | Two independent AC input pins accepting full-wave AC input; electrically symmetrical for flexible transformer center-tap or dual-winding interface. |
| + | DC Output Anode | Positive DC output terminal; connects to bulk capacitor positive rail in standard bridge configuration. |
| – | DC Output Cathode | Negative DC output terminal; serves as system ground reference point in isolated or non-isolated DC bus designs. |
Key Features
| Feature | Design Value |
|---|---|
| Glass-passivated junction | Enables stable long-term reliability and reduced parameter drift under thermal cycling and humidity stress. |
| Integral heatsink baseplate | Provides direct thermal path to external heatsink with RθJC = 1.5°C/W-eliminates need for separate thermal interface hardware. |
| Universal 4-way mounting | Supports snap-on, wrap-around, solder, and PCB-mounting-enables reuse across prototyping, low-volume, and high-volume production. |
| UL Recognized (E-326243) | Validates safety compliance for end-equipment certification in North America without additional component-level testing. |
| JESD201 Class 1A whisker resistance | Guarantees lead finish stability under thermal aging-critical for long-life industrial and telecom power supplies. |
Applications
| Industrial AC-DC Power Supplies | Switch-Mode Power Supply (SMPS) Front-End |
|---|---|
Use Scenario: Rectifying 85–264 VAC input in DIN-rail mounted industrial PSUs delivering 24 VDC/20 A. IC Role / Device Role / Timing Role: Discrete bridge rectifier providing full-wave AC-to-DC conversion before PFC and DC-DC stages. Use Value: 50 A IF rating and 400 A IFSM support sustained load and cold-start surges; 150°C TJ max enables derating margin in enclosed enclosures. | Use Scenario: Mains rectification in 300 W open-frame SMPS for factory automation controllers. IC Role / Device Role / Timing Role: Primary-side AC input bridge converting line voltage to high-voltage DC bus (~375 VDC). Use Value: Low 1.1 V VF reduces conduction loss vs. legacy rectifiers; UL recognition accelerates end-product safety certification. |
| LED Driver Power Stages | Uninterruptible Power Supply (UPS) Input Stage |
Use Scenario: Input rectification in constant-current LED drivers for high-bay lighting operating from 230 VAC mains. IC Role / Device Role / Timing Role: Bridge rectifier feeding bulk capacitor and downstream buck converter driving LED strings. Use Value: 100 V VRRM safely handles 230 VAC + 10% tolerance; RoHS-compliant tin plating ensures lead-free assembly compatibility. | Use Scenario: AC input rectification in line-interactive UPS systems with battery backup and AVR circuitry. IC Role / Device Role / Timing Role: High-current bridge converting utility AC to DC for charging and inverter input bus. Use Value: 664 A²s I²t rating withstands repeated grid transients and generator start-up surges without degradation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bridge rectifier applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Vishay GBPC5001-E4/51 | Same 50A/100V rating, GBPC40 package, but uses epoxy-molded construction without integral heatsink baseplate; RθJC = 2.0°C/W. | Requires external heatsink design; less suitable for direct-mount thermal paths. | Prefer GBPC5001 T0G when direct heatsink mounting and lower thermal resistance are required. |
| ON Semiconductor GBPC5010 | Same GBPC40 package and 50A rating, but rated for 1000V VRRM; higher VF (1.2 V) and larger I²t (720 A²s). | Better suited for high-voltage industrial drives or medical equipment with stringent transient immunity. | Select GBPC5001 T0G for cost-optimized 100V applications where lower VF and tighter thermal performance are prioritized. |
Compared with Vishay GBPC5001-E4/51 and ON Semi GBPC5010, GBPC5001 T0G delivers superior thermal performance (1.5°C/W vs. 2.0°C/W) and lower conduction loss (1.1 V VF), making it optimal for space-constrained, thermally demanding 100V AC-DC front-ends.
Availability
GBPC5001 T0G is available at Aetrix Electronics and suitable for industrial AC-DC power supplies, switch-mode power supply (SMPS) front-end designs, and LED driver power stages requiring stable component supply, long-lifecycle availability, and traceable sourcing.
Supply support for GBPC5001 T0G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS diodes, and MOSFETs for industrial and consumer applications.
The GBPC40/50 series was designed specifically for high-current, high-reliability AC mains rectification in industrial power supplies and SMPS front-ends-emphasizing thermal robustness, safety certification, and mechanical mounting flexibility.
FAQ
What is the maximum junction temperature rating for GBPC5001 T0G?
The GBPC5001 T0G has a maximum junction temperature (TJ max) of +150°C, allowing reliable operation in high-ambient industrial environments. This rating is validated per absolute maximum ratings in the official Taiwan Semiconductor datasheet (Version G2211). Derating curves show usable current capacity down to 0 A at 150°C case temperature, confirming thermal design headroom for GBPC5001 T0G in sealed enclosures.
Does GBPC5001 T0G support direct heatsink mounting?
Yes, GBPC5001 T0G supports direct heatsink mounting via its integral metal baseplate in the GBPC40 package. The device specifies a junction-to-case thermal resistance (RθJC) of 1.5°C/W, optimized for thermal transfer when mounted with appropriate torque (≤20 in-lbs) to a flat, clean heatsink surface. This eliminates need for additional thermal interface materials in many applications, distinguishing GBPC5001 T0G from standard epoxy-packaged bridges.
Is GBPC5001 T0G RoHS compliant and UL recognized?
Yes, GBPC5001 T0G is RoHS compliant and UL Recognized under file #E-326243. These certifications are explicitly stated in the Taiwan Semiconductor GBPC40/50 series datasheet (Version G2211) and apply to the GBPC5001 T0G variant. The UL recognition covers the entire GBPC40 package family and validates safety for use in end equipment sold in North America without requiring additional component-level evaluation.
What is the forward voltage drop specification for GBPC5001 T0G at rated current?
The forward voltage drop (VF) for GBPC5001 T0G is specified as 1.1 V maximum per diode at IF = 25 A and TJ = 25°C, per the Electrical Specifications table in the Taiwan Semiconductor datasheet. Since the device is a full-wave bridge, total conduction drop is approximately 2.2 V under these conditions-critical for calculating conduction losses in high-efficiency power supply designs using GBPC5001 T0G.
How does GBPC5001 T0G differ from GBPC4001 T0G?
GBPC5001 T0G is rated for 50 A average forward current (IF), while GBPC4001 T0G is rated for 40 A-both share identical 100 V VRRM, GBPC40 package, and thermal performance. The higher current rating of GBPC5001 T0G allows greater design margin in high-load applications, though both devices use the same pinout, mounting footprint, and thermal interface. Selection depends on required continuous current and derating needs in the final GBPC5001 T0G implementation.
GBPC5001 T0G Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Taiwan Semiconductor Corporation
- Series:
- -
- Package/Case:
- 4-Square, GBPC40
- Packaging:
- Tray
- Product Status:
- Active
- Diode Type:
- Single Phase
- Technology:
- Standard
- Voltage - Peak Reverse (Max):
- 100 V
- Current - Average Rectified (Io):
- 50 A
- Voltage - Forward (Vf) (Max) @ If:
- 1.1 V @ 25 A
- Current - Reverse Leakage @ Vr:
- 10 µA @ 100 V
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- QC Terminal
- Supplier Device Package:
- GBPC40
GBPC5001 T0G FAQ
1.How can I place an order for GBPC5001 T0G through Aetrix?
Please submit a Request for Quotation (RFQ) for GBPC5001 T0G on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for GBPC5001 T0G reliable?
The price and inventory of GBPC5001 T0G are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for GBPC5001 T0G is usually 5 days.
3.What payment methods are accepted for GBPC5001 T0G?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for GBPC5001 T0G transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for GBPC5001 T0G?
GBPC5001 T0G orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your GBPC5001 T0G order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for GBPC5001 T0G?
For technical support, including GBPC5001 T0G datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your GBPC5001 T0G requirements.
6.How does Aetrix verify that GBPC5001 T0G is sourced from the original manufacturer or authorized distributors?
All GBPC5001 T0G products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that GBPC5001 T0G meets industry standards.
7.What is the process for return or replacement of GBPC5001 T0G?
All GBPC5001 T0G units undergo pre-shipment inspection (PSI). If there is an issue with GBPC5001 T0G, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The GBPC5001 T0G part is unused and in its original packaging.
Return procedure for GBPC5001 T0G:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
GBPC5001 T0G Tags
-
HDS10M-13
Diodes Incorporated
-
CD-MBL106S
Bourns Inc.
-
MB10S-13
Diodes Incorporated
-
CD-MBL206SL
Bourns Inc.
-
MB4S-TP
Micro Commercial Co
-
MB6S-TP
Micro Commercial Co
-
CD-MBL210S
Bourns Inc.
-
BAS3007ARPPE6327HTSA1
Infineon Technologies
-
DF02M
Diodes Incorporated
-
CD-MBL210SL
Bourns Inc.
-
DF04M
Diodes Incorporated
-
DF01M
Diodes Incorporated
Tech Hub
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
