Taiwan Semiconductor Corporation GBPC5010M

Overview

GBPC5010M from Taiwan Semiconductor is a 50A, 1000V standard bridge rectifier in GBPC40-M package with glass-passivated junctions, 400A peak surge current rating, and 1.5°C/W junction-to-case thermal resistance-designed for high-reliability AC/DC conversion in industrial power supplies.

For engineers reviewing the GBPC5010M datasheet, GBPC5010M pinout, GBPC5010M application, or GBPC5010M equivalent, key selection criteria include rated forward current (50A), repetitive peak reverse voltage (1000V), thermal resistance (1.5°C/W), mounting compatibility (snap-on/wrap-around/solder/PCB), and UL recognition (E-326243).

Technical Context

This quad-configuration bridge rectifier integrates four silicon diodes in a single molded package with integral heatsink geometry optimized for low thermal resistance. Its glass-passivated junction ensures stable reverse leakage (<10 µA at 25°C) and robust surge handling (400A IFSM, 664 A²s fusing rating).

The GBPC5010M uses matte tin-plated leads compliant with J-STD-002 solderability and JESD201 Class 1A whisker resistance. Polarity is marked on case with cathode indicator, and mounting torque is specified at ≤20 in-lbs.

Key Specifications

Pinout & Package

Package: GBPC40-M - molded plastic case with integral heatsink, 4-way universal terminals (snap-on/wrap-around/solder/PCB mount), UL 94V-0 rated compound, cathode parallel to anode orientation, weight ≈17.3 g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBPC5010M, GBPC5010 offers identical performance at lower compliance overhead, while GBPC5010W adds isolation margin for safety-critical systems-neither is pin-compatible without verifying terminal orientation and heatsink interface geometry.

Availability

GBPC5010M is available at Aetrix Electronics and suitable for industrial switch-mode power supplies, uninterruptible power supplies (UPS), and motor drive input stages requiring stable component supply, long-life thermal performance, and regulatory compliance.

Supply support for GBPC5010M includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.

The GBPC40/50 series was developed to deliver high-current, high-voltage bridge rectifiers with integrated thermal management and universal mounting-targeting cost-sensitive yet reliability-demanding AC/DC front-end applications.

FAQ

What is the maximum continuous forward current rating for GBPC5010M?

The GBPC5010M has a rated average forward current (IF) of 50 A at case temperature ≤75°C with adequate heatsinking. This rating assumes free-air conditions with recommended mounting torque (≤20 in-lbs) and proper thermal interface to an external heatsink. At higher case temperatures, derating applies per the forward current derating curve in the datasheet-e.g., ~35 A at 100°C case temperature.

Does GBPC5010M have UL recognition, and what is the file number?

Yes, GBPC5010M is UL Recognized under File # E-326243. This certification confirms compliance with UL 60747-4 for semiconductor devices and validates its suitability for use in end products requiring North American safety approvals. The recognition covers the GBPC40-M package configuration and applies to all voltage variants in the GBPC50 series, including GBPC5010M.

What is the thermal resistance from junction to case (RθJC) for GBPC5010M?

The junction-to-case thermal resistance (RθJC) for GBPC5010M is 1.5°C/W, measured under standard test conditions per JESD51-1. This value reflects the efficiency of heat transfer from the silicon die to the molded case surface and is critical for calculating required heatsink size. Achieving this value requires proper mounting pressure and thermal interface material between the GBPC5010M baseplate and heatsink.

How is polarity marked on the GBPC5010M package?

Polarity on the GBPC5010M is indicated by a channeled corner and cathode symbol ("–") printed on the case near the negative DC output terminal. The AC input terminals (AC1 and AC2) are unmarked and interchangeable, while the "+" and "–" terminals are clearly labeled adjacent to their respective metal tabs. This marking aligns with the GBPC40-M mechanical drawing and ensures correct orientation during PCB layout or chassis mounting.

What mounting methods are supported by GBPC5010M?

GBPC5010M supports four mounting methods: snap-on (to chassis or heatsink flange), wrap-around (to busbar or copper bar), solder (directly to PCB pads or tinned copper planes), and PC board mounting (via through-hole or surface-mount compatible footprints). Its GBPC40-M package features standardized terminal geometry and matte tin-plated leads compliant with J-STD-002, ensuring reliable solder wetting and mechanical retention across all methods.