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Vishay General Semiconductor - Diodes Division GMF05C-HSF-GS08
- Part No.:
- GMF05C-HSF-GS08
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Category:
- TVS Diodes
- Package:
- 6-UFDFN Exposed Pad
- Datasheet:
-
GMF05C-HSF-GS08.pdf
- Description:
- TVS DIODE 5VWM 12.5VC LLP75-6L
- Quantity:
- Payment:
- Shipping:
Inventory:20,434
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Product details
Overview
GMF05C-HSF-GS08 from Vishay Semiconductors is a 5-line bidirectional asymmetrical (BiAs) ESD protection diode array in the ultra-compact LLP75-6L package, rated for 5 V reverse stand-off voltage (VRWM), ±30 kV IEC 61000-4-2 contact/air discharge, and 12 A IEC 61000-4-5 peak pulse current. It protects high-speed data lines including USB 2.0, HDMI, and SD card interfaces with low clamping voltage (VC ≤ 12.5 V at 12 A) and low leakage (<1 μA).
For engineers reviewing the GMF05C-HSF-GS08 datasheet, GMF05C-HSF-GS08 pinout, GMF05C-HSF-GS08 application, or GMF05C-HSF-GS08 equivalent, key selection criteria include its BiAs-mode clamping behavior, 126 pF capacitance at 0 V (1 MHz), MSL Level 1 solderability, e4 precious-metal termination, and suitability for space-constrained portable electronics requiring robust transient immunity without signal integrity degradation.
Technical Context
The GMF05C-HSF-GS08 implements bidirectional asymmetrical (BiAs) protection: pins 1 and 3–6 serve as protected signal lines referenced to ground (pin 2), enabling independent clamping of positive transients (via reverse breakdown, VBR = 6–8 V) and negative transients (via forward conduction, VF ≤ 5.5 V at 12 A). This architecture delivers distinct clamping voltages in each polarity-critical for preserving logic thresholds in mixed-signal interfaces.
Its LLP75-6L package features a 1.6 mm × 1.05 mm footprint, 0.6 mm max height, and exposed heat sink pad for thermal dissipation. The device operates from −55 °C to +125 °C junction temperature and supports reflow up to 260 °C per J-STD-020, making it suitable for automotive infotainment and industrial handhelds where reliability under thermal cycling is essential.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Protection Lines | 5 independent channels (L1–L5), each with dedicated BiAs clamping path to ground |
| Reverse Stand-off Voltage | VRWM = 5 V - defines maximum continuous operating voltage before leakage rises |
| ESD Immunity | ±30 kV contact & air discharge (IEC 61000-4-2) - exceeds Level 4 system-level ESD requirements |
| Surge Rating | IPPM = 12 A (8/20 μs, IEC 61000-4-5) - supports robust lightning/surge immunity in portable interfaces |
| Clamping Voltage | VC ≤ 12.5 V at 12 A (reverse), VF ≤ 5.5 V at 12 A (forward) - limits voltage overshoot during transients |
| Capacitance | CD = 126 pF @ 0 V, 1 MHz - optimized for USB 2.0 (≤130 pF limit) without degrading signal rise time |
| Leakage Current | IR < 0.1 μA @ VRWM = 5 V - ensures minimal loading on battery-powered signal lines |
Pinout & Package
The GMF05C-HSF-GS08 uses the LLP75-6L surface-mount package: 1.65 mm × 1.05 mm × 0.6 mm, with an exposed thermal pad, e4 (NiPdAu) terminations, and MSL Level 1 handling. Pin 1 is marked by a dot; the device requires no special storage conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 | L1 signal line input | Protected data line (e.g., USB D+); connected to internal BiAs diode cathode/anode pair |
| Pin 2 | Ground reference | Common cathode/anode node for all 5 protection paths; must be low-inductance PCB ground connection |
| Pin 3 | L2 signal line input | Second protected line (e.g., USB D−); electrically isolated from L1 but shares ground reference |
| Pin 4 | L3 signal line input | Third protected line (e.g., HDMI TMDS clock); identical clamping characteristics to L1/L2 |
| Pin 5 | L4 signal line input | Fourth protected line (e.g., SD card DAT0); enables compact multi-line protection without discrete devices |
| Pin 6 | L5 signal line input | Fifth protected line (e.g., SD card CMD); completes full 5-channel ESD shield for memory card interfaces |
Key Features
| Feature | Design Value |
|---|---|
| BiAs-mode clamping | Asymmetric forward/reverse clamping (VF ≤ 5.5 V / VC ≤ 12.5 V) preserves logic '0' and '1' margins in bidirectional buses |
| Ultra-low profile | 0.6 mm max height enables use in slim smartphones, wearables, and foldable displays where Z-height is constrained |
| e4 termination | NiPdAu plating eliminates Sn whisker risk and ensures long-term solder joint reliability in high-reliability applications |
| Low line capacitance | 126 pF @ 0 V enables compliance with USB 2.0 eye diagram and HDMI 1.4 signal integrity requirements |
| MSL Level 1 rating | Unlimited floor life at ≤30 °C/60% RH - eliminates baking requirements and simplifies SMT line logistics |
Applications
| USB 2.0 Interface Protection | HDMI 1.4 Data Line Protection |
|---|---|
|
Use Scenario: Protecting D+ and D− lines in smartphone USB OTG ports against repeated electrostatic discharge during cable insertion/removal. IC Role / Device Role / Timing Role: ESD transient suppressor placed directly at connector, clamping fast-rising ESD events before they reach the USB PHY. Use Value: Prevents latch-up or permanent damage to USB transceivers while maintaining <130 pF total line capacitance for full-speed (480 Mbps) signal fidelity. |
Use Scenario: Shielding TMDS clock and data pairs in portable projectors and docking stations from ESD during HDMI hot-plug events. IC Role / Device Role / Timing Role: Low-capacitance parallel clamp on each TMDS channel, referenced to local ground plane to minimize common-mode noise injection. Use Value: Enables robust HDMI 1.4 compliance with ±30 kV contact discharge immunity without degrading differential skew or eye opening. |
| Secure Digital (SD) Card Slot Protection | Industrial Handheld Touchscreen Interface |
|
Use Scenario: Safeguarding SDIO bus signals (CMD, CLK, DAT0–DAT3) in medical tablets and ruggedized tablets exposed to clinical or field environments. IC Role / Device Role / Timing Role: Single-package 5-line protection aligned with SD 4-bit bus layout, minimizing PCB trace length between connector and clamp. Use Value: Eliminates need for five discrete diodes, reducing BOM count and board area while delivering uniform clamping across all data lanes. |
Use Scenario: Protecting I²C or SPI touch controller interface lines in warehouse scanners and inventory terminals subjected to frequent operator ESD. IC Role / Device Role / Timing Role: BiAs-mode clamp on SDA/SCL or MOSI/MISO lines, leveraging low VF to avoid false logic-low assertion during negative transients. Use Value: Maintains communication integrity during daily ESD exposure without requiring software-level error recovery or bus reset protocols. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESD5Z5.0T1G | Single-line SOD-523; VRWM = 5 V; IPP = 12 A; CD = 110 pF; no BiAs architecture - symmetric clamping | Requires 5 separate devices for 5-line protection; higher assembly cost and larger PCB footprint | Preferred when board layout allows discrete placement and lower total capacitance (110 pF) is prioritized over integration |
| Texas Instruments TPD4E001DRYR | 4-line LLP-10 package; VRWM = 5.5 V; IPP = 4 A per line; CD = 12 pF; integrated ESD + EMI filtering | Limited to 4 lines; lower surge rating; significantly lower capacitance suits high-speed USB 3.0 or MIPI | Selected when EMI suppression is required alongside ESD protection and design supports 4-line coverage only |
Compared with ESD5Z5.0T1G and TPD4E001DRYR, the GMF05C-HSF-GS08 uniquely delivers 5-line BiAs protection in a single LLP75-6L package with industry-leading 12 A surge rating and balanced trade-off between capacitance (126 pF) and clamping performance-making it optimal for compact, cost-sensitive USB 2.0 and SDIO designs where integration and robustness are co-priorities.
Availability
GMF05C-HSF-GS08 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI 1.4 data line shielding, and SD card slot transient suppression requiring stable component supply, consistent lead times, and full traceability for medical, industrial, and consumer electronics programs.
Supply support for GMF05C-HSF-GS08 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Semiconductors is a global leader in discrete semiconductors, specializing in high-reliability diodes, MOSFETs, optoelectronics, and protection devices for automotive, industrial, and computing markets.
The GMF05C-HSF-GS08 belongs to Vishay's GMF series of ultra-compact ESD arrays, engineered specifically for high-density portable electronics where board space, ESD robustness, and signal integrity must coexist without compromise.
FAQ
What is the exact pin configuration and signal assignment for GMF05C-HSF-GS08?
The GMF05C-HSF-GS08 has six terminals: pin 1 (L1), pin 2 (ground), pin 3 (L2), pin 4 (L3), pin 5 (L4), and pin 6 (L5). All five signal lines connect to internal BiAs diodes referenced to the common ground pin. Pin 1 marking is indicated by a dot; the LLP75-6L package uses an exposed thermal pad not connected to any internal circuitry. Layout must maintain short, low-inductance traces from each protected line to its respective pin and direct grounding of pin 2.
Does GMF05C-HSF-GS08 support IEC 61000-4-5 surge testing at full rating?
Yes, the GMF05C-HSF-GS08 is rated for 12 A peak pulse current (IPPM) per line under IEC 61000-4-5 (8/20 μs waveform) in BiAs mode with pin 2 grounded. This rating applies individually to pins 1 and 3–6 when tested one line at a time. Simultaneous multi-line surges reduce effective per-line energy handling due to shared thermal mass, so system-level validation is recommended for multi-line stress scenarios.
How does the BiAs-mode operation of GMF05C-HSF-GS08 improve protection in bidirectional data lines?
BiAs-mode provides asymmetric clamping: negative transients are clamped near ground (VF ≤ 5.5 V) to prevent false logic-low states, while positive transients are clamped at higher voltage (VC ≤ 12.5 V) to avoid exceeding IC absolute maximum ratings. This dual-threshold behavior preserves signal integrity in protocols like USB and SDIO where both polarities carry valid data, unlike symmetric clamps that over-clamp one polarity.
What is the maximum allowable PCB trace length between GMF05C-HSF-GS08 and the protected connector?
To maintain effective ESD protection, PCB trace length from GMF05C-HSF-GS08 pins to the protected connector should be ≤3 mm. Longer traces add inductance that increases clamping voltage during fast ESD events (e.g., 0.7 ns rise time per IEC 61000-4-2), potentially allowing damaging voltage overshoot. Ground return paths must be equally short and use multiple vias to the solid ground plane beneath the LLP75-6L thermal pad.
Is GMF05C-HSF-GS08 compatible with lead-free reflow profiles and RoHS requirements?
Yes, GMF05C-HSF-GS08 is RoHS-compliant and qualified for lead-free reflow with a peak temperature of 260 °C (J-STD-020 MSL Level 1). Its e4 NiPdAu termination ensures compatibility with standard SAC305 solder paste and eliminates tin whisker risk. No pre-baking is required prior to assembly due to its unlimited floor life at ≤30 °C/60% RH.
GMF05C-HSF-GS08 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay General Semiconductor - Diodes Division
- Package/Case:
- 6-UFDFN Exposed Pad
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 5
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5V (Min)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 12.5V
- Current - Peak Pulse (10/1000µs):
- 12A (8/20µs)
- Power - Peak Pulse:
- 200W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 126pF @ 1MHz
- Operating Temperature:
- -55°C ~ 125°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- LLP75-6L
GMF05C-HSF-GS08 FAQ
1.How can I place an order for GMF05C-HSF-GS08 through Aetrix?
Please submit a Request for Quotation (RFQ) for GMF05C-HSF-GS08 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for GMF05C-HSF-GS08 reliable?
The price and inventory of GMF05C-HSF-GS08 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for GMF05C-HSF-GS08 is usually 5 days.
3.What payment methods are accepted for GMF05C-HSF-GS08?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for GMF05C-HSF-GS08 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for GMF05C-HSF-GS08?
GMF05C-HSF-GS08 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your GMF05C-HSF-GS08 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for GMF05C-HSF-GS08?
For technical support, including GMF05C-HSF-GS08 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your GMF05C-HSF-GS08 requirements.
6.How does Aetrix verify that GMF05C-HSF-GS08 is sourced from the original manufacturer or authorized distributors?
All GMF05C-HSF-GS08 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that GMF05C-HSF-GS08 meets industry standards.
7.What is the process for return or replacement of GMF05C-HSF-GS08?
All GMF05C-HSF-GS08 units undergo pre-shipment inspection (PSI). If there is an issue with GMF05C-HSF-GS08, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The GMF05C-HSF-GS08 part is unused and in its original packaging.
Return procedure for GMF05C-HSF-GS08:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
GMF05C-HSF-GS08 Tags
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ESD9B5.0ST5G
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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