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Vishay General Semiconductor - Diodes Division GMF05LC-HS3-GS08

Part No.:
GMF05LC-HS3-GS08
Manufacturer:
Vishay General Semiconductor - Diodes Division
Category:
TVS Diodes
Package:
6-WFDFN Exposed Pad
Datasheet:
AetrixGMF05LC-HS3-GS08.pdf
Description:
TVS DIODE 5VWM 12.5VC LLP75-6A
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:6,469

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Product details

Overview

GMF05LC-HS3-GS08 from Vishay Semiconductors is a 5-line bidirectional asymmetrical ESD protection diode array in LLP75-6A package, rated for 5 V reverse stand-off voltage (VRWM), 43 pF typical line capacitance at 0 V, and ±30 kV IEC 61000-4-2 contact/air discharge immunity - deployed to safeguard high-speed USB 2.0, HDMI, and SD card interface lines.

For engineers reviewing the GMF05LC-HS3-GS08 datasheet, GMF05LC-HS3-GS08 pinout, GMF05LC-HS3-GS08 application, or GMF05LC-HS3-GS08 equivalent, key selection criteria include clamping voltage under 5 A surge (11.5–12.5 V), low leakage (<0.1 µA), RoHS-compliant lead-free packaging, and BiAs-mode asymmetrical clamping behavior for signal integrity preservation in compact portable electronics.

Technical Context

The GMF05LC-HS3-GS08 implements bidirectional asymmetrical (BiAs) protection: each of five signal lines (pins 1, 3–6) clamps positive transients above 6–8 V breakdown (VBR) to ground (pin 2) with reverse clamping (VC = 11.5–12.5 V @ 5 A), while negative transients are clamped near ground via forward conduction (VF = 3.1–4 V @ 5 A). This enables differential signal path protection without DC bias dependency.

Its LLP75-6A package supports high-density routing with 0.5 mm pitch, MSL Level 1 moisture sensitivity, and UL 94 V-0 molding compound - optimized for reflow-compatible assembly in space-constrained consumer and mobile designs where ESD robustness must coexist with <50 pF capacitance per line.

Key Specifications

ParameterValue and Actual Design Meaning
Protection Lines5 independent signal paths - enables single-device protection of full USB 2.0 (D+, D−, ID, VBUS sense, GND-referenced control)
VRWM5 V - matches standard 3.3 V/5 V logic rail systems without overvoltage risk during normal operation
Clamping Voltage (VC)11.5–12.5 V @ 5 A (IEC 61000-4-5) - limits transient overshoot below IC absolute maximum ratings
Line Capacitance (CD)43 pF @ 0 V - preserves signal integrity up to ~300 MHz; drops to 25 pF @ 2.5 V for improved high-frequency performance
ESD Immunity±30 kV contact / ±30 kV air (IEC 61000-4-2) - exceeds industrial and automotive ESD test requirements
Leakage Current (IR)≤0.1 µA @ 5 V - prevents battery drain in always-on portable device interfaces
PackageLLP75-6A (1.6 × 1.6 × 0.55 mm) - enables 0.5 mm pitch layout on ultra-thin PCBs

Pinout & Package

LLP75-6A is a 6-terminal leadless plastic package with exposed thermal pad, 0.5 mm pitch, and pin 1 marked by dot. Dimensions: 1.6 mm × 1.6 mm × 0.55 mm height. MSL Level 1, UL 94 V-0 compliant.

Pin/TerminalCircuit RoleDesign Meaning
Pin 1Signal Line 1 (L1)Protected data line input - connects to USB D+ or HDMI TMDS channel 0
Pin 2Ground ReferenceCommon cathode/anode return path - must be low-inductance connection to system ground plane
Pin 3Signal Line 2 (L2)Protected data line input - connects to USB D− or HDMI TMDS channel 1
Pin 4Signal Line 3 (L3)Protected data line input - used for SD card DAT0 or auxiliary control signal
Pin 5Signal Line 4 (L4)Protected data line input - assigned to SD card CMD or USB ID detection
Pin 6Signal Line 5 (L5)Protected data line input - supports VBUS sensing or hot-plug detect in USB applications

Key Features

FeatureDesign Value
Bidirectional Asymmetrical (BiAs) ClampingEnables independent optimization of positive/negative transient response - avoids false triggering on signal swings while maintaining low VF clamping for negative ESD events
Low 43 pF Capacitance @ 0 VMinimizes insertion loss and timing skew on 480 Mbps USB 2.0 differential pairs without requiring trace length matching compensation
±30 kV ESD RatingGuarantees survivability through full IEC 61000-4-2 qualification - eliminates need for secondary board-level protection in handheld product enclosures
LLP75-6A Ultra-Compact FootprintReduces PCB area by >60% vs. SOIC-8 ESD arrays - critical for thin-profile smartphones and wearables with stacked flex-rigid boards

Applications

USB 2.0 Interface ProtectionHDMI TMDS Channel Protection

Use Scenario: Protecting D+/D−, ID, VBUS sense, and GND-referenced control lines in smartphone USB OTG ports against repeated electrostatic discharge during cable insertion.

IC Role / Device Role / Timing Role: ESD transient suppressor placed directly at connector entry point - operates transparently during 480 Mbps data transmission.

Use Value: Prevents latch-up or gate oxide damage in USB PHY ICs by clamping 5 A surges to ≤12.5 V while adding only 43 pF loading per line.

Use Scenario: Safeguarding three TMDS data channels and one clock channel in portable media player HDMI outputs subjected to user-handling ESD.

IC Role / Device Role / Timing Role: Asymmetrical clamping device referenced to local ground - maintains differential signal swing integrity across 2.25 Gbps video links.

Use Value: Delivers <25 pF capacitance at 2.5 V bias to preserve eye diagram opening, with ±30 kV immunity eliminating field failure returns.

SD Card Slot ESD ProtectionMobile Display Serial Interface (DSI) Lane Protection

Use Scenario: Shielding SDIO bus lines (DAT0–DAT3, CMD, CLK) in tablet memory card slots from ESD events during hot-swap operations.

IC Role / Device Role / Timing Role: 5-line protection array covering all six SD card signals except power - placed within 3 mm of connector per JEDEC guidelines.

Use Value: Enables compliance with IEC 61000-4-2 Level 4 using single-component solution, reducing BOM count versus discrete diode arrays.

Use Scenario: Protecting four high-speed DSI data lanes and one clock lane in foldable OLED display modules where mechanical flexing increases ESD coupling risk.

IC Role / Device Role / Timing Role: Low-capacitance transient voltage suppressor mounted adjacent to display connector - operates in BiAs mode to avoid DC offset on AC-coupled lanes.

Use Value: Maintains <50 pF loading per lane to prevent jitter accumulation across 1.5 Gbps/lane DSI streams while surviving repeated 8 kV contact discharges.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
ON Semiconductor NUP4201MR6T1G6-line array, 5.5 V VRWM, 30 pF @ 0 V, ±30 kV ESD - but uses SOT-563 package (larger footprint, 2.2 × 1.35 mm)Supports one additional line; lower capacitance but higher package height (1.1 mm) limits use in ultra-thin devicesSelect when needing sixth protected line or tighter capacitance tolerance, accepting larger PCB area
Texas Instruments TPD4E001DRYR4-line array, 5.5 V VRWM, 12 pF @ 0 V, ±15 kV ESD - LLP-4 package (1.0 × 1.0 mm), lower capacitance but halved ESD ratingOptimized for RF front-end or antenna switch ESD; insufficient for full USB 2.0 or HDMI protectionChoose only for low-capacitance, low-ESD-risk subcircuits - not a functional replacement for GMF05LC-HS3-GS08's 5-line ±30 kV capability

Compared with NUP4201MR6T1G and TPD4E001DRYR, the GMF05LC-HS3-GS08 uniquely balances 5-line coverage, ±30 kV immunity, and 43 pF capacitance in a 1.6 mm² footprint - making it the only option meeting USB 2.0 + VBUS sense + ID detection protection in minimal space without sacrificing ESD margin.

Availability

GMF05LC-HS3-GS08 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, HDMI TMDS channel safeguarding, and SD card slot ESD hardening requiring stable component supply across high-volume consumer electronics production.

Supply support for GMF05LC-HS3-GS08 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Semiconductors is a global leader in discrete semiconductors, specializing in high-reliability diodes, MOSFETs, optoelectronics, and protection devices for industrial, automotive, and computing markets.

The GMF05LC-HS3-GS08 belongs to Vishay's ESD-Protection Diode Array family, engineered specifically for high-density, high-speed digital interface protection in portable and battery-powered equipment where space, leakage, and ESD robustness are co-constrained.

FAQ

What is the exact pin configuration and signal assignment for GMF05LC-HS3-GS08?

The GMF05LC-HS3-GS08 uses a 6-pin LLP75-6A package with pin 1 (L1), pin 2 (ground), pin 3 (L2), pin 4 (L3), pin 5 (L4), and pin 6 (L5). Each signal line (L1–L5) connects to a separate data or control path, while pin 2 serves as the common ground reference for all five bidirectional protection paths in BiAs mode. This layout is confirmed in Figure 2 of Vishay Document 85655 Rev. 1.7.

Does GMF05LC-HS3-GS08 support unidirectional or bidirectional ESD protection?

The GMF05LC-HS3-GS08 provides bidirectional asymmetrical (BiAs) protection: it clamps positive transients above 6–8 V (VBR) in reverse mode and negative transients near ground via forward conduction (VF = 3.1–4 V @ 5 A). This dual-mode behavior is intrinsic to its internal diode architecture and explicitly defined in the "BiAs-Mode" section of the datasheet.

What is the maximum peak pulse current rating for GMF05LC-HS3-GS08?

The GMF05LC-HS3-GS08 is rated for 5 A peak pulse current (IPPM) per line under IEC 61000-4-5 8/20 µs waveform conditions, with corresponding peak pulse power of 70 W. This value is specified in the Absolute Maximum Ratings table (page 2) and verified in Figure 6 of the datasheet showing VC vs. IPP performance.

Is GMF05LC-HS3-GS08 compatible with lead-free reflow soldering processes?

Yes, GMF05LC-HS3-GS08 is lead (Pb)-free and RoHS-compliant, qualified for lead-free reflow with peak temperature of 260 °C for 10 seconds at terminals. Its LLP75-6A package meets J-STD-020 MSL Level 1, permitting unlimited floor life and compatibility with standard Pb-free reflow profiles used in high-volume electronics assembly.

How does the line capacitance of GMF05LC-HS3-GS08 vary with applied voltage?

The GMF05LC-HS3-GS08 exhibits voltage-dependent capacitance: 43 pF typical at 0 V reverse bias, dropping to 25 pF at 2.5 V reverse bias (measured at 1 MHz). This behavior is documented in the Electrical Characteristics table and illustrated in Figure 3 ("Capacitance vs. Reverse Voltage"), enabling dynamic optimization for high-speed interfaces operating near mid-supply.

GMF05LC-HS3-GS08 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay General Semiconductor - Diodes Division
Package/Case:
6-WFDFN Exposed Pad
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Obsolete
Type:
Zener
Unidirectional Channels:
5
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
5V (Min)
Voltage - Breakdown (Min):
6V
Voltage - Clamping (Max) @ Ipp:
12.5V
Current - Peak Pulse (10/1000µs):
5A (8/20µs)
Power - Peak Pulse:
70W
Power Line Protection:
No
Applications:
General Purpose
Capacitance @ Frequency:
43pF @ 1MHz
Operating Temperature:
-55°C ~ 125°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
LLP75-6A

GMF05LC-HS3-GS08 FAQ

1.How can I place an order for GMF05LC-HS3-GS08 through Aetrix?

Please submit a Request for Quotation (RFQ) for GMF05LC-HS3-GS08 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for GMF05LC-HS3-GS08 reliable?

The price and inventory of GMF05LC-HS3-GS08 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for GMF05LC-HS3-GS08 is usually 5 days.

3.What payment methods are accepted for GMF05LC-HS3-GS08?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for GMF05LC-HS3-GS08 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for GMF05LC-HS3-GS08?

GMF05LC-HS3-GS08 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your GMF05LC-HS3-GS08 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for GMF05LC-HS3-GS08?

For technical support, including GMF05LC-HS3-GS08 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your GMF05LC-HS3-GS08 requirements.

6.How does Aetrix verify that GMF05LC-HS3-GS08 is sourced from the original manufacturer or authorized distributors?

All GMF05LC-HS3-GS08 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that GMF05LC-HS3-GS08 meets industry standards.

7.What is the process for return or replacement of GMF05LC-HS3-GS08?

All GMF05LC-HS3-GS08 units undergo pre-shipment inspection (PSI). If there is an issue with GMF05LC-HS3-GS08, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The GMF05LC-HS3-GS08 part is unused and in its original packaging.

Return procedure for GMF05LC-HS3-GS08:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

GMF05LC-HS3-GS08 Tags

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