Taiwan Semiconductor Corporation GPA806 C0G

Overview

GPA806 C0G from Taiwan Semiconductor is an AEC-Q101-qualified, glass-passivated single-die standard rectifier in TO-220AC package, rated for 800 V repetitive peak reverse voltage (V_RRM), 8 A average forward current (I_F), and 150 A non-repetitive surge current (I_FSM). It delivers low forward voltage (≤1.1 V at 8 A, 25°C) and ultra-low reverse leakage (≤5 µA at 25°C), targeting high-efficiency DC/DC converters and switching inverters.

For engineers reviewing the GPA806 C0G datasheet, GPA806 C0G pinout, GPA806 C0G application, or GPA806 C0G equivalent, key selection criteria include its 800 V V_RRM, TO-220AC thermal resistance (R_θJC = 2.5 °C/W), 150 A I_FSM, 50 pF junction capacitance at 4 V, and AEC-Q101 qualification status - all critical for automotive-grade power conversion reliability.

Technical Context

The GPA806 C0G implements a single-junction, planar-glass-passivated silicon rectifier structure optimized for fast recovery and low conduction loss. Its 800 V V_RRM rating enables use in 400–600 V DC bus systems, while the 2.5 °C/W junction-to-case thermal resistance supports sustained 8 A operation with minimal heatsinking.

Electrical behavior is defined by strict limits: forward voltage ≤1.1 V at full 8 A load and 25°C junction temperature, reverse leakage ≤100 µA at 125°C, and junction capacitance of 50 pF at 1 MHz and 4 V reverse bias - parameters directly impacting efficiency, thermal management, and EMI in high-frequency switching topologies.

Key Specifications

Pinout & Package

Package: TO-220AC - 3-lead, single-ended heat sinkable outline with matte tin-plated leads compliant with J-STD-002 solderability and JESD201 Class 2 whisker resistance. Polarity marked on case; weight ≈1.80 g.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar standard rectifier applications.

Compared with STTH8R06DJF and VS-8EWH06FN-M3, GPA806 C0G uniquely combines 800 V rating with AEC-Q101 qualification - enabling single-device solutions in 600 V automotive OBCs where both voltage headroom and qualification are non-negotiable.

Availability

GPA806 C0G is available at Aetrix Electronics and suitable for automotive on-board chargers, industrial DC/DC converters, solar microinverter input stages, and UPS inverter clamp circuits requiring stable component supply across multi-year production cycles.

Supply support for GPA806 C0G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated Taiwanese manufacturer specializing in discrete power semiconductors, including rectifiers, TVS diodes, and MOSFETs, with ISO/TS 16949 and AEC-Q200 certified production lines.

The GPA801–GPA807 family was designed specifically for high-reliability, high-voltage rectification in automotive and industrial power conversion - emphasizing surge robustness, thermal stability, and qualification-compliant manufacturing.

FAQ

What is the maximum junction temperature rating for GPA806 C0G?

The GPA806 C0G has a maximum junction temperature (T_J) of +150°C, validated across its full operating range from −55°C to +150°C. This rating is maintained under all specified absolute maximum conditions, including 8 A continuous forward current and 150 A surge. The device's 2.5 °C/W junction-to-case thermal resistance enables reliable operation at this limit when mounted on an appropriately sized heatsink. GPA806 C0G must not exceed this T_J in any application.

Does GPA806 C0G meet automotive qualification standards?

Yes, GPA806 C0G is AEC-Q101 qualified, confirming its suitability for automotive applications including underhood environments. This qualification covers stress tests for temperature cycling, humidity, mechanical shock, and high-temperature operating life. The "H" suffix in ordering codes (e.g., GPA806H) explicitly denotes AEC-Q101 compliance. GPA806 C0G shares the same qualification status as other GPA8xH variants in the family.

What is the forward voltage specification for GPA806 C0G at elevated temperature?

The forward voltage (V_F) for GPA806 C0G is specified as ≤1.1 V maximum at I_F = 8 A and T_J = 25°C. While the datasheet does not provide a guaranteed max V_F at higher temperatures, typical curves show V_F decreases with rising junction temperature - approximately 0.95 V at 125°C under same test conditions. GPA806 C0G maintains stable conduction characteristics across its full −55°C to +150°C junction range.

Is GPA806 C0G compatible with lead-free reflow soldering processes?

Yes, GPA806 C0G features matte tin-plated leads that comply with J-STD-002 for solderability and are rated for standard lead-free reflow profiles (peak temperature up to 260°C). The TO-220AC package molding compound meets UL 94V-0 flammability rating, and the device passes JESD201 Class 2 whisker testing - ensuring long-term interconnect reliability after assembly. GPA806 C0G is fully compatible with IPC-J-STD-020-compliant reflow cycles.

How does the junction capacitance of GPA806 C0G affect high-frequency switching performance?

GPA806 C0G exhibits a typical junction capacitance (C_J) of 50 pF at 1 MHz and 4 V reverse bias. This low value minimizes displacement current and dv/dt-induced turn-on in high-frequency switching circuits (e.g., >100 kHz SMPS), reducing EMI and preventing unintended gate driver triggering. At higher reverse voltages, C_J decreases further - supporting clean commutation in fast-switching topologies. GPA806 C0G's C_J is measured and verified per JEDEC standards.