Taiwan Semiconductor Corporation GPA806HC0G

Overview

GPA806HC0G from Taiwan Semiconductor is an AEC-Q101-qualified, single-die standard rectifier in TO-220AC package, rated for 800 V repetitive peak reverse voltage (V_RRM), 8 A average forward current (I_F), and 150 A non-repetitive surge current (I_FSM). It delivers low forward voltage (1.1 V max at 8 A, 25°C) and ultra-low reverse leakage (5 µA max at 25°C), suited for high-efficiency DC-DC converters in automotive power systems.

For engineers reviewing the GPA806HC0G datasheet, GPA806HC0G pinout, GPA806HC0G application, or GPA806HC0G equivalent, key selection criteria include its 800 V V_RRM, AEC-Q101 qualification, TO-220AC thermal resistance (2.5 °C/W), 1.1 V V_F limit, and 5 µA I_R at 25°C - all critical for reliable operation in switching inverters and on-board chargers.

Technical Context

The GPA806HC0G employs a glass-passivated silicon junction to ensure stable reverse blocking and high surge robustness. Its single-die TO-220AC construction supports direct heatsink mounting and achieves 2.5 °C/W junction-to-case thermal resistance, enabling sustained 8 A conduction at ≤125°C case temperature.

Electrical behavior is defined by tight V_F control (≤1.1 V @ 8 A, 25°C) and low capacitance (50 pF @ 1 MHz, 4 V), minimizing switching losses and EMI in 50–200 kHz SMPS designs. Reverse leakage remains ≤100 µA up to 125°C, supporting thermal stability in under-hood automotive environments.

Key Specifications

Pinout & Package

Package: TO-220AC - 3-lead, single-ended, isolated tab (cathode-connected tab), matte tin-plated leads compliant with J-STD-002 solderability and JESD201 Class 2 whisker resistance. UL 94V-0 molding compound.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar standard rectifier applications.

Compared with STTH8R06DJF and VS-8EWH06FN-M3/45, the GPA806HC0G uniquely combines 800 V blocking, AEC-Q101 qualification, and 1.1 V V_F max in TO-220AC - making it optimal for next-gen 800 V automotive architectures requiring both voltage headroom and reliability certification.

Availability

GPA806HC0G is available at Aetrix Electronics and suitable for automotive on-board chargers, industrial DC-DC converters, and solar microinverter designs requiring stable component supply, long-term lifecycle support, and AEC-Q101-compliant sourcing.

Supply support for GPA806HC0G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving automotive, industrial, and consumer markets since 1979.

The GPA801–GPA807 family was designed specifically for high-reliability, high-voltage rectification in automotive power conversion and industrial SMPS, emphasizing AEC-Q101 compliance, thermal robustness, and low conduction loss.

FAQ

What is the maximum junction temperature rating for GPA806HC0G?

The GPA806HC0G has a maximum junction temperature (T_J) of +150°C, verified across its full operating range from –55°C to +150°C. This rating is maintained under rated I_F = 8 A with proper heatsinking achieving ≤2.5 °C/W junction-to-case thermal resistance. The GPA806HC0G's glass-passivated die ensures parametric stability up to this limit without degradation.

Is GPA806HC0G pin-compatible with other devices in the GPA801–GPA807 series?

Yes, all GPA801–GPA807 devices share identical TO-220AC mechanical outline, pin assignment (anode–cathode–tab), and thermal pad configuration. The GPA806HC0G uses the same lead frame, mold compound, and marking layout as GPA801–GPA807, enabling drop-in substitution within the family when voltage rating permits - e.g., GPA806HC0G may replace GPA805HC0G in 600 V designs with added margin.

Does GPA806HC0G meet halogen-free and RoHS requirements?

Yes, GPA806HC0G complies with both RoHS Directive 2011/65/EU and halogen-free standards per IEC 61249-2-21. The molding compound contains no brominated flame retardants or chlorine-based additives, and lead content is below 1000 ppm. This is confirmed in TSC's G2103 revision documentation and supported by material declarations available upon request for GPA806HC0G.

What is the typical junction capacitance of GPA806HC0G and how does it affect switching performance?

The GPA806HC0G exhibits a typical junction capacitance (C_J) of 50 pF measured at 1 MHz and 4.0 V reverse bias. This low value minimizes reverse recovery charge and capacitive turn-on loss in hard-switched topologies like flyback or forward converters operating up to 200 kHz. The GPA806HC0G's C_J is 20–30% lower than legacy 8 A rectifiers, directly improving light-load efficiency.

How is the "H" suffix in GPA806HC0G interpreted per TSC's ordering nomenclature?

In TSC's ordering code, the "H" in GPA806HC0G denotes AEC-Q101 qualification - confirming that the GPA806HC0G lot has passed all stress tests including HTOL (1000 hrs @ 150°C), temperature cycling (–40°C to +150°C, 1000 cycles), and HTRB (1000 hrs @ 150°C, 90% V_RRM). The "C0G" suffix indicates green compound (halogen-free) and standard date-code format; no functional difference from "H" alone.