Taiwan Semiconductor Corporation GPA807 C0G

Overview

GPA807 C0G from Taiwan Semiconductor is an AEC-Q101-qualified, glass-passivated single-die standard rectifier in TO-220AC package, rated for 1000 V repetitive peak reverse voltage (V_RRM), 8 A average forward current (I_F), and 150 A non-repetitive surge current (I_FSM). It delivers low forward voltage (≤1.1 V at 8 A, 25°C) and ultra-low reverse leakage (≤5 µA at 25°C), targeting high-efficiency DC/DC converters and industrial switching inverters.

For engineers reviewing the GPA807 C0G datasheet, GPA807 C0G pinout, GPA807 C0G application, or GPA807 C0G equivalent, key selection criteria include its 1000 V V_RRM, TO-220AC thermal resistance (R_θJC = 2.5 °C/W), AEC-Q101 qualification status, junction temperature range (–55 to +150°C), and halogen-free, RoHS-compliant construction.

Technical Context

The GPA807 C0G implements a single-die, planar-junction silicon rectifier structure with glass passivation for enhanced moisture and contamination resistance. Its thermal design centers on the TO-220AC case, enabling direct heatsink mounting and delivering R_θJC = 2.5 °C/W for stable operation under sustained 8 A conduction.

Electrical behavior is defined by tight control of forward voltage (max 1.1 V @ 8 A, 25°C) and reverse leakage (max 5 µA @ 25°C, rated V_R), with junction capacitance specified at 50 pF (1 MHz, 4 V). The device supports 8.3 ms half-sine surge events up to 150 A without degradation.

Key Specifications

Pinout & Package

Package: TO-220AC - 3-lead, single-ended, through-hole package with isolated tab (cathode-connected), matte tin-plated leads compliant with J-STD-002, UL 94V-0 molding compound, and JESD201 Class 2 whisker resistance.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar standard rectifier applications.

Compared with STTH8L06D and VS-8EWH06FN-M3, GPA807 C0G uniquely supports 1000 V systems while retaining TO-220AC mechanical compatibility and offering AEC-Q101 qualification in the H-variant-making it the only option for high-voltage automotive and industrial rectification where both voltage headroom and automotive reliability are mandatory.

Availability

GPA807 C0G is available at Aetrix Electronics and suitable for industrial DC/DC converters, automotive onboard chargers, and solar microinverter designs requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for GPA807 C0G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, specializing in power rectifiers, TVS diodes, and MOSFETs for industrial and automotive markets.

The GPA801–GPA807 family was engineered to deliver high-voltage, high-current rectification with AEC-Q101 readiness and robust thermal performance in cost-sensitive TO-220AC packaging for power conversion systems.

FAQ

What is the maximum repetitive peak reverse voltage (V_RRM) for GPA807 C0G?

The GPA807 C0G has a V_RRM rating of 1000 V, confirmed in the absolute maximum ratings table across all GPA801–GPA807 variants. This value is fixed for the GPA807 part number and defines its suitability for high-voltage DC bus applications such as solar string inputs and industrial 3-phase rectification. The GPA807 C0G must not be operated beyond this reverse voltage under any condition.

Is GPA807 C0G AEC-Q101 qualified?

The GPA807 C0G itself is not AEC-Q101 qualified; qualification applies only to the GPA807H variant, as explicitly stated in the ordering information and features list. GPA807H adds automotive-grade screening and test validation. For automotive designs requiring AEC-Q101 compliance, GPA807H-not GPA807 C0G-must be specified and sourced.

What is the thermal resistance (R_θJC) of GPA807 C0G and how does it impact heatsink selection?

The GPA807 C0G has a junction-to-case thermal resistance of 2.5 °C/W, measured per standard JEDEC test conditions. This value enables effective thermal transfer from the die to the TO-220AC tab. When designing heatsinks, engineers must calculate total thermal resistance (R_θJA = R_θJC + R_θCS + R_θSA) to ensure junction temperature remains ≤150°C at 8 A load-typically requiring ≥15 cm² aluminum heatsink area with thermal interface material.

Does GPA807 C0G have a specified junction capacitance, and why does it matter?

Yes, GPA807 C0G specifies a typical junction capacitance (C_J) of 50 pF at 1 MHz and 4.0 V reverse bias. This parameter directly affects high-frequency switching noise, EMI generation, and reverse recovery behavior in SMPS topologies. Lower C_J reduces capacitive coupling into gate drivers and improves efficiency in >100 kHz converters-making GPA807 C0G suitable for modern high-frequency power designs.

What are the lead finish and plating specifications for GPA807 C0G?

GPA807 C0G features matte tin-plated leads compliant with J-STD-002 for solderability, and the molding compound meets UL 94V-0 flammability rating. Its terminals also pass JESD201 Class 2 whisker testing, ensuring long-term reliability in high-humidity environments. These specifications confirm compatibility with standard reflow and wave soldering processes used in industrial and automotive PCB assembly.