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Taiwan Semiconductor Corporation GPAS1003

Part No.:
GPAS1003
Manufacturer:
Taiwan Semiconductor Corporation
Category:
Single Diodes
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixGPAS1003.pdf
Description:
10A, 200V, STANDARD RECTIFIER
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,092

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Product details

Overview

GPAS1003 from Taiwan Semiconductor is a 10A, 200V glass-passivated standard surface-mount rectifier in TO-263AB (D2PAK) package, designed for high-efficiency DC/DC conversion with low forward voltage (≤1.10 V at 10 A, 25°C), high surge capability (150 A, 8.3 ms), and junction temperature up to 150°C.

For engineers reviewing the GPAS1003 datasheet, GPAS1003 pinout, GPAS1003 application, or GPAS1003 equivalent, key selection factors include its 200 V repetitive peak reverse voltage, 4°C/W junction-to-case thermal resistance, moisture sensitivity level 1 rating, and compatibility with automated SMT assembly per J-STD-002.

Technical Context

This single-die standard rectifier uses glass passivation for enhanced reliability and operates with low power loss due to its 1.10 V max forward voltage at rated current. Its 150 A non-repetitive surge rating supports robust transient handling in switching converters.

The device features a TO-263AB (D2PAK) thermally optimized package with matte tin-plated leads, UL 94V-0 molding compound, and meets JESD 201 Class 1A whisker resistance - enabling stable performance in industrial power supplies and inverters.

Key Specifications

ParameterValue and Actual Design Meaning
VRRM200 V - Maximum repetitive reverse blocking voltage; defines safe operating range in bridge or freewheeling configurations
IF10 A - Continuous average forward current; determines steady-state power delivery capacity
IFSM150 A - Peak non-repetitive surge current (8.3 ms half-sine); enables survival during startup or fault transients
VF (max)1.10 V @ 10 A, 25°C - Directly impacts conduction loss and thermal design in high-current paths
RθJC4°C/W - Junction-to-case thermal resistance; allows accurate heatsink sizing when mounted to PCB copper plane
IR (max)5 µA @ 25°C, 100 µA @ 125°C - Low leakage ensures minimal standby power loss in high-impedance circuits

Pinout & Package

Package: TO-263AB (D2PAK) - surface-mount, 3-terminal power package with exposed cathode tab for thermal and electrical connection.

Pin/TerminalCircuit RoleDesign Meaning
AnodeInput terminal for forward conductionConnected to lower-potential side in rectification path; requires trace width and copper area matching 10 A continuous rating
Cathode (Tab)Output terminal and thermal interfaceExposed metal tab serves as both cathode connection and primary heat path to PCB; must be soldered to large copper pour
K (Cathode Lead)Secondary cathode connectionProvides mechanical stability and parallel current path; shares load with tab but not intended as sole thermal path

Key Features

FeatureDesign Value
Glass passivated junctionImproves long-term reliability under humidity and thermal cycling vs. epoxy-passivated alternatives
Moisture sensitivity level 1Eliminates bake requirement prior to reflow; compatible with standard SMT line handling
RoHS & halogen-free complianceMeets IEC 61249-2-21 and EU RoHS directives for environmentally constrained applications
Junction temperature range –55°C to +150°CSupports operation in sealed industrial enclosures without active cooling

Applications

DC/DC ConverterSwitching Inverter

Use Scenario: Secondary-side rectification in isolated 48 V–12 V buck-derived converters.

IC Role / Device Role / Timing Role: Power diode conducting during synchronous rectifier off-time or replacing MOSFET in low-cost designs.

Use Value: 1.10 V VF minimizes conduction loss at 10 A output, improving efficiency over higher-VF alternatives.

Use Scenario: Freewheeling path in motor drive H-bridge output stages.

IC Role / Device Role / Timing Role: Clamping inductive kickback during PWM dead-time intervals.

Use Value: 150 A IFSM withstands repeated motor stall surges without degradation.

Industrial Power SupplyRenewable Energy Interface

Use Scenario: Input rectification in 1 kW AC/DC front-end modules.

IC Role / Device Role / Timing Role: Main bridge leg component in full-wave rectifier configuration.

Use Value: 200 V VRRM provides sufficient margin above 170 VAC peak (240 VAC systems).

Use Scenario: Bypass protection in solar microinverter DC link.

IC Role / Device Role / Timing Role: Reverse polarity and overvoltage clamp for string-level protection.

Use Value: Low IR (5 µA @ 25°C) prevents leakage-induced drift in high-impedance monitoring circuits.

Equivalent & Alternatives

The following parts are listed as comparable options for similar standard rectifier applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STTH10R02CW200 V VRRM, 10 A IF, but TO-220AC package; VF = 1.15 V (max)Requires through-hole mounting and separate heatsink; less suitable for high-density SMT layoutsPrefer GPAS1003 for space-constrained SMT designs needing integrated thermal path
MBR10200CT200 V VRRM, dual common-cathode Schottky; VF = 0.95 V (typ), but IR = 1 mA @ 125°CLower VF improves light-load efficiency but higher leakage limits use in high-temp/high-impedance sensingChoose GPAS1003 where low leakage and rugged surge capability outweigh minor VF advantage

Compared with STTH10R02CW and MBR10200CT, GPAS1003 delivers superior SMT integration via TO-263AB, tighter leakage control, and verified moisture-insensitive handling - making it optimal for automated production of industrial-grade power supplies.

Availability

GPAS1003 is available at Aetrix Electronics and suitable for DC/DC converters, switching inverters, and industrial power supplies requiring stable component supply, consistent parametric performance, and long-term manufacturing continuity.

Supply support for GPAS1003 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.

The GPAS100x series targets cost-sensitive, high-reliability power conversion applications - emphasizing ruggedness, thermal efficiency, and SMT manufacturability in standard rectifier roles.

FAQ

What is the maximum junction temperature rating for GPAS1003?

The GPAS1003 has a maximum junction temperature (TJ) rating of +150°C, allowing operation in thermally demanding environments such as enclosed industrial power supplies. This rating is supported by its 4°C/W junction-to-case thermal resistance and TO-263AB package design. Derating curves in the GPAS1003 datasheet define allowable current versus case temperature to ensure safe operation within this limit.

Does GPAS1003 require baking before reflow soldering?

No, GPAS1003 does not require baking prior to reflow soldering because it is rated at Moisture Sensitivity Level 1 per J-STD-020. This means the device can be stored indefinitely in dry ambient conditions and placed directly into standard SMT reflow profiles without preconditioning. The GPAS1003's packaging and passivation process ensure robust moisture resistance.

What is the forward voltage specification for GPAS1003 at full rated current?

The GPAS1003 specifies a maximum forward voltage (VF) of 1.10 V at 10 A forward current and 25°C junction temperature, measured under pulsed conditions (PW = 0.3 ms). This value directly determines conduction losses in high-current paths. At elevated temperatures or higher currents, VF decreases slightly due to negative temperature coefficient behavior typical of silicon PN junctions.

How does GPAS1003 compare to GPAS1004 in terms of voltage rating?

GPAS1003 is rated for 200 V repetitive peak reverse voltage (VRRM), while GPAS1004 is rated for 400 V VRRM - double the blocking capability. Both share identical current ratings (10 A IF, 150 A IFSM), thermal resistance (4°C/W), and TO-263AB packaging. Selection between GPAS1003 and GPAS1004 depends strictly on required reverse voltage margin in the target circuit.

Is GPAS1003 compliant with RoHS and halogen-free standards?

Yes, GPAS1003 is RoHS compliant and halogen-free per IEC 61249-2-21. Taiwan Semiconductor confirms this compliance in the official GPAS1003 datasheet (Version D2211), covering all materials including molding compound, lead finish, and internal die construction. These certifications support use in environmentally regulated markets including EU, Japan, and China.

GPAS1003 Specifications

Product attributes
Attribute value
Manufacturer:
Taiwan Semiconductor Corporation
Series:
-
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
Standard
Voltage - DC Reverse (Vr) (Max):
200 V
Current - Average Rectified (Io):
10A
Voltage - Forward (Vf) (Max) @ If:
1.1 V @ 10 A
Speed:
Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr):
-
Current - Reverse Leakage @ Vr:
5 µA @ 200 V
Capacitance @ Vr, F:
50pF @ 4V, 1MHz
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TO-263AB (D2PAK)
Operating Temperature - Junction:
-55°C ~ 150°C

GPAS1003 FAQ

1.How can I place an order for GPAS1003 through Aetrix?

Please submit a Request for Quotation (RFQ) for GPAS1003 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for GPAS1003 reliable?

The price and inventory of GPAS1003 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for GPAS1003 is usually 5 days.

3.What payment methods are accepted for GPAS1003?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for GPAS1003 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for GPAS1003?

GPAS1003 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your GPAS1003 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for GPAS1003?

For technical support, including GPAS1003 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your GPAS1003 requirements.

6.How does Aetrix verify that GPAS1003 is sourced from the original manufacturer or authorized distributors?

All GPAS1003 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that GPAS1003 meets industry standards.

7.What is the process for return or replacement of GPAS1003?

All GPAS1003 units undergo pre-shipment inspection (PSI). If there is an issue with GPAS1003, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The GPAS1003 part is unused and in its original packaging.

Return procedure for GPAS1003:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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