Taiwan Semiconductor Corporation HDBL104G

Overview

HDBL104G from Taiwan Semiconductor is a 1 A, 400 V repetitive peak reverse voltage (V_RRM) glass-passivated quad bridge rectifier in DBL package, featuring 1.3 V max forward voltage at 1 A and 50 ns reverse recovery time, widely used in compact AC/DC adapters and LED lighting power stages.

For engineers reviewing the HDBL104G datasheet, HDBL104G pinout, HDBL104G application, or HDBL104G equivalent, key selection criteria include V_RRM = 400 V, I_F = 1 A, t_rr = 50 ns, R_θJA = 40 °C/W, and DBL surface-mount compatibility with JEDEC-standard PCB footprints.

Technical Context

The HDBL104G integrates four silicon diodes in a single-phase full-wave bridge configuration with glass-passivated junctions for enhanced reliability under thermal cycling and humidity stress. Its DBL package uses matte tin-plated leads compliant with J-STD-002 solderability and JESD201 Class 2 whisker resistance.

Designed for high-efficiency switching-mode power conversion, it delivers 50 A peak surge current (I_FSM) and supports continuous operation up to 150 °C junction temperature, with thermal resistance R_θJL = 15 °C/W enabling direct heat transfer to PCB copper.

Key Specifications

Pinout & Package

Package: DBL - Dual-in-line molded plastic case with 4 external terminals (AC1, AC2, +, −), UL 94V-0 rated, 0.360 g weight, compatible with standard reflow profiles.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBU4K and MB10F, the HDBL104G offers optimal balance of compact DBL footprint, 50 ns fast recovery, and 40 °C/W thermal performance-making it ideal for thermally constrained, high-frequency adapter and lighting designs where board space and efficiency are prioritized.

Availability

HDBL104G is available at Aetrix Electronics and suitable for LED driver power supplies, USB-C wall adapters, and industrial control power modules requiring stable component supply with consistent parametric performance across production lots.

Supply support for HDBL104G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated Taiwanese semiconductor manufacturer specializing in discrete power devices and analog ICs since 1979.

The HDBL104G belongs to TSC's high-efficiency bridge rectifier product line, engineered specifically for cost-sensitive, high-volume AC/DC power conversion in consumer, lighting, and industrial applications where reliability, thermal performance, and RoHS compliance are essential.

FAQ

What is the maximum junction temperature rating for HDBL104G?

The HDBL104G has a maximum junction temperature (T_J) rating of +150 °C, verified per absolute maximum ratings table in the official Taiwan Semiconductor datasheet. This allows continuous operation in high-ambient environments such as enclosed LED drivers or industrial control cabinets. Derating curves confirm usable current capacity down to 0.6 A at 100 °C ambient, ensuring robust thermal design margins for HDBL104G in real-world deployments.

Is HDBL104G pin-compatible with other parts in the HDBL10xG series?

Yes, all HDBL101G through HDBL107G share identical DBL package dimensions, terminal layout, and pinout (AC1, AC2, +, −). The only differences are V_RRM and corresponding V_F/t_rr values-so HDBL104G can be substituted for HDBL103G or HDBL105G on the same PCB if voltage and recovery requirements align. No layout change is needed, but electrical validation remains essential for HDBL104G in each target application.

Does HDBL104G meet automotive qualification standards?

The base HDBL104G is not AEC-Q101 qualified; however, the variant HDBL104GH is explicitly certified to AEC-Q101 for automotive applications. This distinction is marked in the ordering code-the "H" suffix denotes qualification. For under-hood lighting or infotainment power supplies, designers must specify HDBL104GH to ensure compliance with automotive stress test requirements including temperature cycling, humidity bias, and mechanical shock.

What is the reverse recovery time (t_rr) specification for HDBL104G and how is it measured?

HDBL104G specifies t_rr = 50 ns maximum, measured under conditions of I_F = 0.5 A, I_R = 1.0 A, and I_rr = 0.25 A, per the official Taiwan Semiconductor datasheet. This fast recovery enables reduced switching losses and lower EMI in high-frequency SMPS designs above 65 kHz. The value applies specifically to HDBL101G–HDBL104G variants; higher-voltage versions (HDBL105G–HDBL107G) have 75 ns t_rr.

How does the DBL package of HDBL104G compare to traditional GBU or KBU packages in terms of thermal performance?

HDBL104G's DBL package achieves R_θJA = 40 °C/W and R_θJL = 15 °C/W-superior to typical GBU4K (R_θJA ≈ 50 °C/W) due to optimized leadframe geometry and direct thermal path to PCB copper. Unlike bulkier KBU packages, DBL's low profile (2.3 mm height) and matte tin plating support fine-pitch reflow and automated optical inspection. These attributes make HDBL104G especially effective in thermally dense, space-limited applications where thermal resistance directly impacts system efficiency and lifetime.