Taiwan Semiconductor Corporation HDBL106G

Overview

HDBL106G from Taiwan Semiconductor is a 1 A, 800 V repetitive peak reverse voltage (V_RRM) glass-passivated quad bridge rectifier in DBL package, featuring 50 A peak forward surge current (I_FSM), 1.7 V max forward voltage at 1 A and 25°C, and 75 ns reverse recovery time - deployed in compact AC/DC front-end stages of LED drivers and industrial adapters.

For engineers reviewing the HDBL106G datasheet, HDBL106G pinout, HDBL106G application, or HDBL106G equivalent, key selection criteria include its 800 V V_RRM, 15 °C/W junction-to-lead thermal resistance, AEC-Q101 qualification option (H-suffix), RoHS/halogen-free compliance, and DBL package compatibility with high-density PCB layouts.

Technical Context

The HDBL106G integrates four silicon diodes in a single-phase full-wave bridge configuration with glass-passivated junctions for enhanced moisture and contamination resistance. Its 800 V V_RRM and 1.7 V typical forward voltage support efficient rectification in medium-voltage SMPS inputs up to 560 V_RMS.

Thermally, it delivers 15 °C/W R_θJL and operates across –55°C to +150°C junction temperature range. The device meets JESD201 Class 2 whisker resistance and UL 94V-0 flammability requirements for molded plastic encapsulation.

Key Specifications

Pinout & Package

Package: DBL - surface-mount, 4-terminal molded plastic case with matte tin-plated leads, UL 94V-0 rated, 0.360 g weight, polarity marked on top surface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar bridge rectifier applications.

Compared with GBU8K and MB10F, the HDBL106G offers optimal balance of SMD DBL footprint, 15 °C/W thermal resistance, and 75 ns t_rr - making it preferred for space-constrained, thermally demanding, medium-frequency SMPS where both layout density and thermal performance matter.

Availability

HDBL106G is available at Aetrix Electronics and suitable for LED lighting drivers, industrial AC/DC adapters, and consumer wall adapters requiring stable component supply, consistent parametric performance, and long-term manufacturing continuity.

Supply support for HDBL106G includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global industrial, computing, and consumer markets since 1979.

The HDBL106G belongs to TSC's DBL-series high-efficiency bridge rectifiers, engineered specifically for cost-sensitive, high-reliability AC/DC conversion in compact power supplies where thermal robustness and regulatory compliance are essential.

FAQ

What is the maximum repetitive peak reverse voltage (V_RRM) rating for HDBL106G?

The HDBL106G has a V_RRM rating of 800 V, verified per Taiwan Semiconductor's official datasheet revision G2103. This value defines the maximum instantaneous reverse voltage the device can block repeatedly without breakdown. It directly supports rectification of 560 V_RMS AC inputs, making HDBL106G suitable for universal-input (85–265 V_AC) and 230 V_AC-optimized power supplies where safety margin is critical. The 800 V rating is specific to HDBL106G and differs from adjacent variants like HDBL105G (600 V) and HDBL107G (1000 V).

Is HDBL106G RoHS and halogen-free compliant?

Yes, HDBL106G is fully RoHS compliant and halogen-free per IEC 61249-2-21, as confirmed in the official Taiwan Semiconductor documentation. The DBL package uses green molding compound meeting UL 94V-0 flammability standards, and all terminations are matte tin-plated. These attributes ensure HDBL106G meets environmental requirements for CE-marked consumer electronics, industrial controls, and automotive-qualified derivatives (H-suffix). Compliance applies to the standard HDBL106G - no additional suffix required.

What is the forward voltage (V_F) specification for HDBL106G at rated current?

HDBL106G specifies a maximum forward voltage of 1.7 V at I_F = 1 A and T_J = 25°C, per the Electrical Specifications table in the G2103 datasheet. This value reflects worst-case conduction loss across the internal diode pair during positive half-cycles. At elevated temperatures (e.g., 125°C), V_F decreases slightly due to negative temperature coefficient. The 1.7 V rating applies only to HDBL105G, HDBL106G, and HDBL107G - lower-voltage variants (e.g., HDBL104G) specify 1.3 V max.

Does HDBL106G have AEC-Q101 qualification?

The base HDBL106G is not AEC-Q101 qualified; however, the variant HDBL106GH is explicitly listed as AEC-Q101 qualified in the Ordering Information section of the datasheet. The "H" suffix denotes automotive-grade screening and testing. For automotive infotainment or body-control applications requiring AEC-Q101, HDBL106GH must be specified - the standard HDBL106G lacks this qualification and should not be used in automotive contexts unless re-qualified by the end customer.

What is the thermal resistance from junction to lead (R_θJL) for HDBL106G?

HDBL106G has a typical junction-to-lead thermal resistance (R_θJL) of 15 °C/W, as published in the Thermal Performance section of the G2103 datasheet. This parameter quantifies heat transfer efficiency from the silicon die to the PCB copper via the leads. It enables accurate thermal design when using external copper pours as heatsinks - for example, sustaining 1 A continuous current at +70°C ambient requires ≤1.2 W total power dissipation (1.7 V × 1 A × 0.7 duty ≈ 1.2 W), resulting in ~18°C junction rise above lead temperature.