Taiwan Semiconductor Corporation HER3L03GH

Overview

HER3L03GH from Taiwan Semiconductor is a high-efficiency, AEC-Q101-qualified 3A, 200V ultrafast recovery rectifier in DO-201AD package, featuring 1.00V max forward voltage at 3.0A/25°C, 125A surge rating, and 3µA max reverse leakage at 25°C - used in automotive DC-DC converters and switching inverters.

For engineers reviewing the HER3L03GH datasheet, HER3L03GH pinout, HER3L03GH application, or HER3L03GH equivalent, key selection criteria include VRRM=200V, IFSM=125A, TJ(max)=150°C, RθJL=19°C/W, and AEC-Q101 qualification for under-hood power conversion designs.

Technical Context

This single-die, planar junction ultrafast rectifier uses optimized doping and geometry to achieve trr ≤50ns with low Qrr, enabling high-frequency switching in SMPS topologies. Its pure tin-plated leads meet J-STD-002 solderability and JESD201 Class 2 whisker resistance.

The device operates across -55°C to +150°C junction range, with thermal resistance values (RθJL=19°C/W, RθJA=44°C/W) measured on a 16mm×16mm Cu pad PCB - critical for thermal design in space-constrained automotive modules.

Key Specifications

Pinout & Package

DO-201AD axial-leaded package with cathode band marking; 1.10g mass; UL 94V-0 molded compound; pure tin-plated leads compliant with J-STD-002 and JESD201 Class 2.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast rectifier applications.

Compared with VS-3EYH02-M3/54 and MUR320HE3/A, HER3L03GH uniquely balances AEC-Q101 compliance, 50ns trr, and 1.30V VF ceiling - making it optimal for next-gen 48V automotive DC-DC where qualification and mid-range speed coexist.

Availability

HER3L03GH is available at Aetrix Electronics and suitable for automotive power conversion, industrial switching inverters, and renewable energy charge controllers requiring stable component supply with long-term lifecycle assurance.

Supply support for HER3L03GH includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Taiwan Semiconductor Corporation (TSC) is a vertically integrated analog and discrete semiconductor manufacturer headquartered in Hsinchu, Taiwan, serving global automotive, industrial, and computing markets since 1979.

The HER3L series targets high-reliability power conversion applications, specifically engineered for AEC-Q101-compliant ultrafast rectification in harsh-environment automotive and industrial systems.

FAQ

What is the peak repetitive reverse voltage rating for HER3L03GH?

The HER3L03GH has a peak repetitive reverse voltage (VRRM) rating of 200 V. This value is confirmed in the Absolute Maximum Ratings table of the official Taiwan Semiconductor datasheet Version C2105. Exceeding this voltage risks avalanche breakdown and permanent device failure. The HER3L03GH is designed for use in circuits where reverse voltage remains within this 200 V limit, such as 12V–48V automotive DC-DC outputs and auxiliary power rails.

Is HER3L03GH qualified to AEC-Q101 standards?

Yes, HER3L03GH is explicitly AEC-Q101 qualified, as indicated by the "H" suffix in its ordering code and confirmed in the FEATURES section of the Taiwan Semiconductor datasheet. This qualification covers stress tests including high-temperature operating life (HTOL), temperature cycling (TCT), and high-temperature reverse bias (HTRB). HER3L03GH is therefore approved for automotive powertrain and chassis applications where reliability under thermal and mechanical stress is mandatory.

What is the maximum forward voltage drop of HER3L03GH at full rated current?

The maximum forward voltage (VF) of HER3L03GH is 1.30 V at IF = 3.0 A and TJ = 25°C, per the Electrical Specifications table. At elevated junction temperature (125°C), VF drops to ≤0.90 V due to semiconductor physics. This VF ceiling directly determines conduction loss (Pcond ≈ IF × VF) and must be used in thermal calculations for PCB copper area and ambient temperature derating.

What package type does HER3L03GH use, and what are its key mechanical properties?

HER3L03GH uses the DO-201AD axial-leaded package. Key mechanical properties include UL 94V-0 flammability-rated molding compound, pure tin-plated leads compliant with J-STD-002 solderability, JESD201 Class 2 whisker resistance, cathode band polarity marking, and a typical weight of 1.10 g. These features ensure robust manufacturability and reliability in automated assembly and high-vibration environments.

How does the thermal performance of HER3L03GH support PCB-level heatsinking?

HER3L03GH specifies RθJL = 19°C/W (junction-to-lead) and RθJA = 44°C/W (junction-to-ambient) when mounted on a 16 mm × 16 mm Cu pad PCB. The low RθJL enables effective heat transfer from the die through the leads into large copper pours - allowing designers to avoid external heatsinks in many 3A applications. This makes HER3L03GH especially suitable for compact automotive ECUs and industrial modules with strict board-area constraints.