Vishay General Semiconductor - Diodes Division HFA200MD40D

Overview

HFA200MD40D from Infineon Technologies is an ultrafast, soft-recovery HEXFRED™ diode optimized for high-frequency power conversion. It features 400 V cathode-to-anode voltage rating, 200 A average forward current (IF(AV)), 45 ns typical reverse recovery time (trr), and 330 nC typical reverse recovery charge (Qrr), enabling low-loss operation in motor drives and switch-mode power supplies.

For engineers reviewing the HFA200MD40D datasheet, HFA200MD40D pinout, HFA200MD40D application, or HFA200MD40D equivalent, key selection criteria include soft recovery behavior (di(rec)M/dt = 270 A/µs at 125°C), isolated TO-244AB package thermal performance (RthJC = 0.23 °C/W dual-leg), and avalanche energy rating (EAS = 1.4 mJ).

Technical Context

The HFA200MD40D is a dual-anode, single-cathode ultrafast rectifier with isolated base construction. Its soft recovery waveform minimizes EMI generation and eliminates snubber requirements in most topologies, while extensive characterization across temperature (–55°C to +150°C), current (up to 200 A), and di/dt (up to 500 A/µs) enables accurate loss modeling in real-world operating conditions.

Designed for hard-switched converters, it delivers controlled reverse recovery with low IRRM (8.1 A typ. at 25°C) and predictable trr variation (45 ns typ. at 25°C, 260–390 ns at 125°C). The device supports bidirectional thermal path management via its isolated TO-244AB package, with RthJC of 0.45 °C/W per leg and 0.23 °C/W when both legs conduct simultaneously.

Key Specifications

Pinout & Package

Package: TO-244AB (Isolated), metal baseplate electrically isolated from terminals, suitable for direct-mount heatsinking with thermal grease interface.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ultrafast soft-recovery diode applications.

Compared with STTH200L04TV1 and IXYS MDD200-40, the HFA200MD40D uniquely combines verified 1.4 mJ avalanche robustness, isolated TO-244AB mechanical compatibility, and balanced softness (270 A/µs di(rec)M/dt) - making it the only option qualified for industrial motor drives with frequent overload events and shared heatsink architectures.

Availability

HFA200MD40D is available at Aetrix Electronics and suitable for industrial motor drives, uninterruptible power systems, and renewable energy inverters requiring stable component supply, long-term lifecycle support, and traceable sourcing from authorized channels.

Supply support for HFA200MD40D includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, specializing in power semiconductors, microcontrollers, and sensor solutions for industrial, automotive, and energy markets.

The HFA200MD40D belongs to Infineon's HEXFRED™ ultrafast diode product line, engineered specifically for high-frequency power conditioning systems where reduced EMI, soft recovery, and precise loss predictability are critical design requirements.

FAQ

What is the maximum continuous forward current rating for HFA200MD40D at 100°C case temperature?

The HFA200MD40D has a maximum continuous forward current (IF) of 83 A at TC = 100°C, as specified in its absolute maximum ratings table. This derating reflects thermal limitations of the TO-244AB package under sustained high-temperature operation. Engineers must ensure heatsink design maintains TC ≤ 100°C to sustain this current level continuously. The HFA200MD40D datasheet confirms this value applies per leg in dual-leg conduction mode.

Does HFA200MD40D support avalanche operation, and what is its rated energy?

Yes, the HFA200MD40D is rated for non-repetitive avalanche energy (EAS) of 1.4 mJ under standardized test conditions (L = 100 µH, duty cycle limited by max TJ). This rating is measured per leg and validated per JEDEC JESD24-11. The HFA200MD40D can safely absorb single-event inductive transients within this energy limit, making it suitable for unclamped inverter leg configurations where IGBTs may not fully suppress voltage spikes.

What is the thermal resistance from junction to case for HFA200MD40D when both legs conduct simultaneously?

The HFA200MD40D has a junction-to-case thermal resistance (RthJC) of 0.23 °C/W when both anode legs conduct simultaneously, as confirmed in the Thermal–Mechanical Characteristics table. This value assumes uniform current sharing and proper mounting torque (30–40 lbf·in). The HFA200MD40D's isolated TO-244AB package enables this improved thermal performance compared to single-leg operation (0.45 °C/W), directly supporting higher power density designs.

How does the soft recovery behavior of HFA200MD40D reduce EMI in power converters?

The HFA200MD40D achieves soft recovery through controlled di(rec)M/dt (270 A/µs at 125°C) and low IRRM (8.1 A typ.), which suppresses high-frequency current discontinuities during reverse recovery. This reduces broadband EMI generation by >15 dB in 30–100 MHz range versus standard fast recovery diodes. The HFA200MD40D's softness eliminates snubber circuits in most 10–20 kHz motor drive applications, simplifying layout and lowering system cost.

What are the mounting requirements for the isolated base of HFA200MD40D?

The HFA200MD40D requires a smooth, flat, burr-free mounting surface with a thin, even film of thermal grease applied before installation. Mounting torque must be applied gradually in 5–10 lbf·in increments until reaching 30–40 lbf·in (3.4–4.6 N·m). Over-torquing risks baseplate deformation and degraded thermal contact. The HFA200MD40D's isolated TO-244AB construction allows direct attachment to common heatsinks without electrical isolation hardware, provided surface flatness meets ≤0.05 mm deviation.