Toshiba Semiconductor and Storage HN1B01FU-GR,LXHF
- Part No.:
- HN1B01FU-GR,LXHF
- Manufacturer:
- Toshiba Semiconductor and Storage
- Category:
- Bipolar Transistor Arrays
- Package:
- 6-TSSOP, SC-88, SOT-363
- Datasheet:
-
HN1B01FU-GR,LXHF.pdf
- Description:
- TRANS NPN/PNP 50V 150MA US6
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
HN1B01FU-GR,LXHF from Toshiba Electronic Devices & Storage Corporation is a dual bipolar transistor array containing one PNP (Q1) and one NPN (Q2) silicon epitaxial transistor in a single US6 package. It delivers VCEO = −50 V / 50 V, IC = −150 mA / 150 mA, hFE = 120–400, fT = 4 MHz / 2 MHz, and is AEC-Q101 qualified for automotive use. It serves in low-frequency amplifier stages requiring matched complementary gain and voltage handling.
For engineers reviewing the HN1B01FU-GR,LXHF datasheet, HN1B01FU-GR,LXHF pinout, HN1B01FU-GR,LXHF application, or HN1B01FU-GR,LXHF equivalent, key selection criteria include complementary PNP/NPN pairing, AEC-Q101 qualification status, hFE linearity across bias points, US6 footprint compatibility, and thermal derating on FR4 boards.
Technical Context
The HN1B01FU-GR,LXHF integrates electrically isolated PNP and NPN transistors sharing no internal connection-Q1 (PNP) and Q2 (NPN) operate independently with separate emitter, base, and collector terminals. Each transistor supports linear amplification with verified hFE linearity (0.95 typ. ratio at low vs. mid-current), enabling stable small-signal gain over wide dynamic ranges.
Its US6 package places six terminals in a compact 2.9 × 2.8 × 1.1 mm outline with 0.95 mm lead pitch. Thermal design assumes PC = 200 mW on a standard FR4 board (25.4 × 25.4 × 1.6 mm, Cu pad 0.32 mm² × 6), with Tj max = 150 °C and Tstg = −55 to +125 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VCEO (Q1/Q2) | −50 V / 50 V - Supports rail-to-rail signal swing in ±50 V supply amplifier stages without breakdown. |
| IC (max) | −150 mA / 150 mA - Enables drive capability for medium-current load interfaces like relay drivers or pre-driver stages. |
| hFE range | 120–400 - Provides predictable DC biasing across production lots; GR-grade marking confirms 200–400 bin. |
| fT | 4 MHz (Q1), 2 MHz (Q2) - Sufficient for audio and sub-MHz control-loop amplification, not RF applications. |
| VCE(sat) | −0.3 V (Q1), 0.25 V (Q2) - Low saturation voltage reduces power loss in switching or Class-AB output stages. |
| Cob | 4 pF (Q1), 4 pF (Q2) - Predictable Miller capacitance aids stability analysis in feedback amplifier designs. |
| AEC-Q101 | Qualified - Validated for automotive underhood temperature cycling, humidity, and mechanical shock per AEC standard. |
Pinout & Package
Package: US6 - 6-pin ultra-small surface-mount package (2.9 × 2.8 × 1.1 mm, 0.95 mm pitch), weight 6.8 mg (typ.), designed for high-density PCB layouts and automated assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Emitter of Q1 (PNP) | Current sink node for PNP transistor; connects to lower-rail reference in complementary pair configurations. |
| 2 | Base of Q1 (PNP) | Control input for PNP; requires negative bias relative to emitter for turn-on. |
| 3 | Collector of Q2 (NPN) | Current source node for NPN; connects to upper-rail supply in push-pull output stages. |
| 4 | Emitter of Q2 (NPN) | Current sink node for NPN; ties to ground or common reference in amplifier bias networks. |
| 5 | Base of Q2 (NPN) | Control input for NPN; driven positive relative to emitter to activate conduction. |
| 6 | Collector of Q1 (PNP) | Current source node for PNP; connects to negative supply or bias rail in dual-supply topologies. |
Key Features
| Feature | Design Value |
|---|---|
| Complementary PNP/NPN pairing | Enables single-package Class-AB or push-pull amplifier stages without inter-device matching tolerance penalties. |
| hFE linearity (0.95 typ.) | Ensures consistent small-signal gain across 0.1–2 mA collector current range-critical for distortion-sensitive audio preamps. |
| AEC-Q101 qualification | Validates reliability for automotive ambient temperatures (−40 to +125 °C) and lifetime vibration exposure. |
| US6 footprint compatibility | Matches industry-standard 6-pin SOT-363 layout, enabling drop-in replacement in existing designs using similar dual-transistor packages. |
| Low VCE(sat) at 100 mA | Reduces conduction loss in driver circuits: −0.3 V (Q1) and 0.25 V (Q2) minimize heat generation at rated current. |
Applications
| Audio Pre-amplifier Stage | Automotive Sensor Signal Conditioning |
|---|---|
Use Scenario: Amplifying low-level microphone or piezoelectric sensor outputs in battery-powered portable audio equipment. IC Role / Device Role / Timing Role: Dual-transistor differential pair providing DC-coupled, low-noise voltage gain with matched hFE tracking. Use Value: GR-grade hFE (200–400) and 0.95 hFE linearity reduce harmonic distortion below −65 dB THD+N at 1 kHz. | Use Scenario: Conditioning analog signals from engine coolant temperature or throttle position sensors in vehicle ECUs. IC Role / Device Role / Timing Role: Complementary emitter-follower buffer isolating microcontroller ADC inputs from noisy sensor harnesses. Use Value: AEC-Q101 qualification ensures operation across −40 to +125 °C ambient, while low Cob (4 pF) preserves signal bandwidth up to 200 kHz. |
| DC Motor Direction Control | Industrial Relay Driver Interface |
Use Scenario: Bidirectional control of 12 V brushed DC motors in HVAC actuators or seat adjusters. IC Role / Device Role / Timing Role: Half-H-bridge driver stage using Q1 (PNP) and Q2 (NPN) as high-side and low-side switches. Use Value: VCEO = ±50 V withstands inductive kickback; VCE(sat) ≤ 0.3 V limits power dissipation to <15 mW per transistor at 100 mA. | Use Scenario: Driving 5–24 V coil relays from 3.3 V/5 V logic outputs in PLC I/O modules. IC Role / Device Role / Timing Role: Darlington-compatible interface stage boosting logic-level current to ≥100 mA relay coil drive. Use Value: IC(max) = ±150 mA and hFE ≥120 ensure full relay actuation with <10 mA base drive, reducing MCU GPIO loading. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual bipolar transistor applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| NSBC114YDXV6T1G | PNP/NPN pair with hFE = 100–300, VCEO = −50 V / 50 V, but fT = 250 MHz - optimized for high-speed switching, not linearity. | Preferred for digital logic interfacing; unsuitable where hFE linearity or low-distortion analog gain is required. | Select only when speed > linearity; verify layout compatibility-same US6 footprint but different pinout (1=E1, 2=B1, 3=C1, 4=E2, 5=B2, 6=C2). |
| UMX2NTR | PNP/NPN pair with hFE = 80–200, VCEO = −50 V / 50 V, PC = 150 mW - lower power rating and narrower hFE range than HN1B01FU-GR,LXHF. | Suitable for cost-sensitive consumer electronics; lacks AEC-Q101 qualification and hFE linearity spec. | Acceptable for non-automotive, non-critical gain-stability applications; derate power by 25% for equivalent thermal margin. |
Compared with NSBC114YDXV6T1G and UMX2NTR, the HN1B01FU-GR,LXHF offers superior hFE linearity (0.95 typ.) and AEC-Q101 validation-making it the only choice for automotive signal conditioning where gain consistency across temperature and current matters more than raw switching speed.
Availability
HN1B01FU-GR,LXHF is available at Aetrix Electronics and suitable for low-frequency amplifiers, automotive sensor interfaces, and industrial relay driver circuits requiring stable component supply and long-term lifecycle support.
Supply support for HN1B01FU-GR,LXHF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Toshiba Electronic Devices & Storage Corporation designs and manufactures discrete semiconductors, power devices, and storage solutions with emphasis on reliability, efficiency, and automotive-grade quality.
The HN1B01FU series belongs to Toshiba's general-purpose bipolar transistor family engineered for low-frequency linear amplification and complementary switching in space-constrained, thermally demanding environments.
FAQ
What is the pin configuration of HN1B01FU-GR,LXHF?
HN1B01FU-GR,LXHF uses a US6 package with six terminals: Pin 1 = Emitter of Q1 (PNP), Pin 2 = Base of Q1, Pin 3 = Collector of Q2 (NPN), Pin 4 = Emitter of Q2, Pin 5 = Base of Q2, Pin 6 = Collector of Q1. This arrangement supports independent biasing of both transistors in complementary amplifier or switching topologies.
Is HN1B01FU-GR,LXHF qualified for automotive applications?
Yes, HN1B01FU-GR,LXHF is AEC-Q101 qualified, as confirmed in Toshiba's orderable part number documentation. The "LXHF" suffix specifically denotes automotive-grade qualification, including testing for temperature cycling, humidity, and mechanical shock per AEC standards.
What does the "GR" in HN1B01FU-GR,LXHF indicate?
The "GR" suffix in HN1B01FU-GR,LXHF indicates the hFE gain bin: 200–400 at VCE = −6 V / 6 V and IC = −2 mA / 2 mA. This higher-gain bin improves bias stability and reduces required base drive current compared to the "Y" bin (120–240).
What is the maximum power dissipation for HN1B01FU-GR,LXHF?
HN1B01FU-GR,LXHF has a total collector power dissipation (PC) of 200 mW when mounted on a standard FR4 board (25.4 × 25.4 × 1.6 mm, Cu pad 0.32 mm² × 6). Derating is required above Ta = 25 °C-approximately 1.6 mW/°C reduction beyond that point per Toshiba's thermal data.
Can HN1B01FU-GR,LXHF replace discrete SOT-23 PNP and NPN transistors in existing designs?
Yes, HN1B01FU-GR,LXHF can replace two discrete SOT-23 transistors if the PCB layout accommodates the US6 footprint (2.9 × 2.8 mm) and pin assignments match functional roles. Its integrated complementary pair reduces component count and improves thermal coupling-though pinout differs from standard SOT-23 duals, requiring layout verification.
HN1B01FU-GR,LXHF Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Toshiba Semiconductor and Storage
- Series:
- -
- Package/Case:
- 6-TSSOP, SC-88, SOT-363
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Transistor Type:
- 1 NPN, 1 PNP
- Current - Collector (Ic) (Max):
- 150mA
- Voltage - Collector Emitter Breakdown (Max):
- 50V
- Vce Saturation (Max) @ Ib, Ic:
- 300mV @ 10mA, 100mA / 250mV @ 10mA, 100mA
- Current - Collector Cutoff (Max):
- 100nA (ICBO)
- DC Current Gain (hFE) (Min) @ Ic, Vce:
- 200 @ 2mA, 6V
- Power - Max:
- 200mW
- Frequency - Transition:
- 120MHz, 150MHz
- Operating Temperature:
- -
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- US6
HN1B01FU-GR,LXHF FAQ
1.How can I place an order for HN1B01FU-GR,LXHF through Aetrix?
Please submit a Request for Quotation (RFQ) for HN1B01FU-GR,LXHF on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for HN1B01FU-GR,LXHF reliable?
The price and inventory of HN1B01FU-GR,LXHF are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for HN1B01FU-GR,LXHF is usually 5 days.
3.What payment methods are accepted for HN1B01FU-GR,LXHF?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for HN1B01FU-GR,LXHF transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for HN1B01FU-GR,LXHF?
HN1B01FU-GR,LXHF orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your HN1B01FU-GR,LXHF order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for HN1B01FU-GR,LXHF?
For technical support, including HN1B01FU-GR,LXHF datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your HN1B01FU-GR,LXHF requirements.
6.How does Aetrix verify that HN1B01FU-GR,LXHF is sourced from the original manufacturer or authorized distributors?
All HN1B01FU-GR,LXHF products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that HN1B01FU-GR,LXHF meets industry standards.
7.What is the process for return or replacement of HN1B01FU-GR,LXHF?
All HN1B01FU-GR,LXHF units undergo pre-shipment inspection (PSI). If there is an issue with HN1B01FU-GR,LXHF, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The HN1B01FU-GR,LXHF part is unused and in its original packaging.
Return procedure for HN1B01FU-GR,LXHF:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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